SLVSHK7A March   2025  – December 2025 TPS65214

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  System Control Thresholds
    6. 6.6  BUCK1, BUCK2, BUCK3 Converter
    7. 6.7  General Purpose LDOs (LDO1, LDO2)
    8. 6.8  GPIOs and multi-function pins (EN/PB/VSENSE, nRSTOUT, nINT, GPO/nWAKEUP, GPIO/VSEL, MODE/STBY)
    9. 6.9  Voltage and Temperature Monitors
    10. 6.10 I2C Interface
    11. 6.11 Typical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power-Up Sequencing
      2. 7.3.2  Power-Down Sequencing
      3. 7.3.3  Push Button and Enable Input (EN/PB/VSENSE)
      4. 7.3.4  OFF-Request by I2C Command
      5. 7.3.5  First Supply Detection (FSD)
      6. 7.3.6  Input Voltage Slew Rate With Automatic Power-up
      7. 7.3.7  Buck Converters (Buck1, Buck2, and Buck3)
      8. 7.3.8  Linear Regulators (LDO1 and LDO2)
      9. 7.3.9  Reset to SoC (nRSTOUT)
      10. 7.3.10 Interrupt Pin (nINT)
      11. 7.3.11 PWM/PFM and Low Power Modes (MODE/STBY)
      12. 7.3.12 General Purpose Input/Output and Voltage Select Pin (GPIO/VSEL)
      13. 7.3.13 General Purpose Output and nWAKEUP (GPO/nWAKEUP)
      14. 7.3.14 RESET-Request by I2C Command
      15. 7.3.15 Register Access Control
      16. 7.3.16 I2C-Compatible Interface
        1. 7.3.16.1 Data Validity
        2. 7.3.16.2 Start and Stop Conditions
        3. 7.3.16.3 Transferring Data
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
        1. 7.4.1.1 OFF State
        2. 7.4.1.2 INITIALIZE State
        3. 7.4.1.3 ACTIVE State
        4. 7.4.1.4 STBY State
        5. 7.4.1.5 SLEEP State
        6.       49
        7. 7.4.1.6 Fault Handling
  9. 8 User Registers
    1. 8.1 Device Registers
  10. 9 Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Typical Application Example
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1 Application Curves
        2. 9.2.3.2 Buck1, Buck2, Buck3 Design Procedure
        3. 9.2.3.3 LDO1, LDO2 Design Procedure
        4. 9.2.3.4 VSYS, VDD1P8
        5. 9.2.3.5 Digital Signals Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

8 User Registers

The registers up to register USER_GENERAL_NVM_STORAGE_REG (address 27h) are backed up by NVM. The reset value corresponds to the configuration of the orderable part number and is signified by an 'X'. Please refer to the Technical Reference Manual (TRM) of the respective orderable part-number.

The registers MANUFACTURING_VER (28h) through SPARE_3 (37h) are not NVM-backed and reset to the value shown in the register map.

Registers TI_DEV_ID (00h), NVM_ID (01h), MANUFACTURING_VER (28h) and FACTORY_CONFIG_2 (41h) cannot be changed by the user.