SLVSHK7A March   2025  – December 2025 TPS65214

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  System Control Thresholds
    6. 6.6  BUCK1, BUCK2, BUCK3 Converter
    7. 6.7  General Purpose LDOs (LDO1, LDO2)
    8. 6.8  GPIOs and multi-function pins (EN/PB/VSENSE, nRSTOUT, nINT, GPO/nWAKEUP, GPIO/VSEL, MODE/STBY)
    9. 6.9  Voltage and Temperature Monitors
    10. 6.10 I2C Interface
    11. 6.11 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Power-Up Sequencing
      2. 7.3.2  Power-Down Sequencing
      3. 7.3.3  Push Button and Enable Input (EN/PB/VSENSE)
      4. 7.3.4  OFF-Request by I2C Command
      5. 7.3.5  First Supply Detection (FSD)
      6. 7.3.6  Input Voltage Slew Rate With Automatic Power-up
      7. 7.3.7  Buck Converters (Buck1, Buck2, and Buck3)
      8. 7.3.8  Linear Regulators (LDO1 and LDO2)
      9. 7.3.9  Reset to SoC (nRSTOUT)
      10. 7.3.10 Interrupt Pin (nINT)
      11. 7.3.11 PWM/PFM and Low Power Modes (MODE/STBY)
      12. 7.3.12 General Purpose Input/Output and Voltage Select Pin (GPIO/VSEL)
      13. 7.3.13 General Purpose Output and nWAKEUP (GPO/nWAKEUP)
      14. 7.3.14 RESET-Request by I2C Command
      15. 7.3.15 Register Access Control
      16. 7.3.16 I2C-Compatible Interface
        1. 7.3.16.1 Data Validity
        2. 7.3.16.2 Start and Stop Conditions
        3. 7.3.16.3 Transferring Data
    4. 7.4 Device Functional Modes
      1. 7.4.1 Modes of Operation
        1. 7.4.1.1 OFF State
        2. 7.4.1.2 INITIALIZE State
        3. 7.4.1.3 ACTIVE State
        4. 7.4.1.4 STBY State
        5. 7.4.1.5 SLEEP State
        6.       49
        7. 7.4.1.6 Fault Handling
  9. User Registers
    1. 8.1 Device Registers
  10. Application and Implementation
    1. 9.1 Application Information
    2. 9.2 Typical Application
      1. 9.2.1 Typical Application Example
      2. 9.2.2 Design Requirements
      3. 9.2.3 Detailed Design Procedure
        1. 9.2.3.1 Application Curves
        2. 9.2.3.2 Buck1, Buck2, Buck3 Design Procedure
        3. 9.2.3.3 LDO1, LDO2 Design Procedure
        4. 9.2.3.4 VSYS, VDD1P8
        5. 9.2.3.5 Digital Signals Design Procedure
    3. 9.3 Power Supply Recommendations
    4. 9.4 Layout
      1. 9.4.1 Layout Guidelines
      2. 9.4.2 Layout Example
  11. 10Device and Documentation Support
    1. 10.1 Receiving Notification of Documentation Updates
    2. 10.2 Support Resources
    3. 10.3 Trademarks
    4. 10.4 Electrostatic Discharge Caution
    5. 10.5 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Power-Down Sequencing

An OFF-request or a shut-down-fault triggers the power-down sequence. The OFF-request can be triggered by a falling edge on EN/PB/VSENSE if configured for EN or VSENSE respectively a long press of the push-button if configured as PB or by an I2C-command to I2C_OFF_REQ in MFP_CTRL register. This bit self-clears.

An I2C-triggered shut-down requires a renewed ON-request on the EN/PB/VSENSE pin. In case of EN- or VSENSE-configuration, a low-going edge followed by a high-going-edge is required on the EN/PB/VSENSE-pin. The falling-edge deglitch time for EN or VSENSE configuration tDEGL_EN/VSENSE_I2C is shorter than the deglitch-time for pin-induced OFF-requests (tDEGL_EN_Fall and tDEGL_VSENSE_Fall). The deglitch-times for PB-configuration remain.

In many cases, the power-down sequence follows the reverse power-up sequence. In some applications, all rails can be required to shut down at the same time with no delay between rails or require wait-times to allow discharging of rail.

The power-down sequence is configured as follows:

  • The slot (respectively the position in the sequence) for each rail, GPO, GPIO, and nRSTOUT is defined using the corresponding *_SEQUENCE_SLOT registers, the four MSB for the ON-sequence, the four LSB for the down-sequencing.
  • The duration of each slot is defined in the POWER_DOWN_SLOT_DURATION_x registers and can be configured as 0ms, 1.5ms, 3ms or 10ms. In total, 8 slots can be configured.
  • In addition to the slot-duration, the power-down sequence is also gated by the previous rail being discharged below the SCG-threshold, unless active discharge is deactivated on the previous rail. If that does not occur, the power-down of subsequent rails is paused. To allow for power-down in case of biased or shorted rails, the sequence continues despite an incomplete discharge of the previous rail after eight times the slot-duration (or 12ms in case of slot-duration of 0ms).
  • To bypass the discharge-check, set the BYPASS_RV_FOR_RAIL_ENABLE bit in the GENERAL_CONFIG register to '1'.
Note: In case active discharge on a rail is deactivated, unsuccessful discharge of the rail within the slot duration does not gate the power down of the subsequent rail, but the sequence is purely timing based. In case of residual voltage, the RV-bit is set regardless.

Active discharge is enabled by default and not NVM based. Thus, if desired, discharge needs to be deactivated after each VSYS-power-cycle. During RESET or OFF-request, the discharge configuration is not reset, as long as VSYS is present. However, in INITIALIZE state and prior to the power-up-sequence, all rails get discharged, regardless of the setting.

During the power-down-sequence, non-NVM-backed bits get reset, with the exception of *_DISCHARGE_EN bits and certain interrupt bits. See Table 7-8 for details.

Below graphic shows the power-down-sequence for NVM-ID 0x01, revision 0x2 as an example:

TPS65214 Power-Down Sequencing (Example) Figure 7-3 Power-Down Sequencing (Example)
CAUTION: Do not change the registers related to an ongoing sequence by I2C-command!

Non-NVM-bits are not accessible for approximately 80μs after starting a transition into INITIALIZE state.