Packaging information
Package | Pins VSON-CLIP (DPC) | 8 |
Operating temperature range (°C) -40 to 150 |
Package qty | Carrier 2,500 | LARGE T&R |
Features for the CSD95375Q4M
- 93% System Efficiency at 15 A
- Max Rated Continuous Current 25 A,
Peak 60 A - High Frequency Operation (up to 2 MHz)
- High Density - SON 3.5 × 4.5-mm
Footprint - Ultra-Low Inductance Package
- System Optimized PCB Footprint
- Ultra-Low Quiescent (ULQ) Current Mode
- 3.3 V and 5 V PWM Signal Compatible
- Diode Emulation Mode with FCCM
- Tri-State PWM Input
- Integrated Bootstrap Diode
- Shoot Through Protection
- RoHS Compliant Lead-Free Terminal
Plating - Halogen Free
Description for the CSD95375Q4M
The CSD95375Q4M NexFET™ Power Stage is a highly optimized design for use in a high power, high density Synchronous Buck converter. This product integrates the driver IC and NexFET technology to complete the power stage switching function. The driver IC has a built-in selectable diode emulation function that enables DCM operation to improve light load efficiency. In addition, the driver IC supports ULQ mode that enables Connected Standby for Windows™ 8. With the PWM input in tri-state, quiescent current is reduced to 130 µA, with immediate response. When SKIP# is held at tri-state, the current is reduced to 8 µA (typically 20 µs is required to resume switching). This combination produces a high current, high efficiency, and high speed switching device in a small 3.5 × 4.5-mm outline package. In addition, the PCB footprint has been optimized to help reduce design time and simplify the completion of the overall system design.