Startseite Schnittstelle USB-ICs USB-Redriver & -Multiplexer

HD3SS3212

AKTIV

2-kanaliger differenzieller Mux/Demux 2:1/1:2, USB 3.1, 10- Gbit/s

Produktdetails

Type Passive mux Function Type-C, USB 3.0 USB speed (MBits) 10000 Number of channels 2 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 5000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 2 Configuration 2:1 SPDT Features Logic Controlled (Output Enabled), USB 3.1 (Type-C) Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 800 ESD HBM (typ) (kV) 2 Bandwidth (MHz) 8000
Type Passive mux Function Type-C, USB 3.0 USB speed (MBits) 10000 Number of channels 2 Supply voltage (max) (V) 3.6 Supply voltage (min) (V) 3 Ron (typ) (mΩ) 5000 Input/output voltage (min) (V) 0 Input/output voltage (max) (V) 2 Configuration 2:1 SPDT Features Logic Controlled (Output Enabled), USB 3.1 (Type-C) Rating Catalog Operating temperature range (°C) -40 to 85 Supply current (max) (µA) 800 ESD HBM (typ) (kV) 2 Bandwidth (MHz) 8000
VQFN (RKS) 20 11.25 mm² 4.5 x 2.5
  • Provides MUX/DEMUX Solution for USB Type-C™ Ecosystem for USB 3.1 Gen 1 and Gen 2 Data Rates
  • Compatible With MIPI DSI/CSI, FPDLinkIII, LVDS, and PCIE Gen II, III
  • Operates up to 10 Gbps
  • Wide –3-dB Differential BW of over 8 GHz
  • Excellent Dynamic Characteristics (at 5 GHz)
    • Crosstalk = –32 dB
    • Off Isolation = –19 dB
    • Insertion Loss = –1.6 dB
    • Return Loss = –12 dB
  • Bidirectional "Mux/De-Mux" Differential Switch
  • Supports Common Mode Voltage 0 to 2 V
  • Single Supply Voltage VCC of 3.3 V
  • Commercial Temperature Range of 0°C to 70°C (HD3SS3212RKS)
  • Industrial Temperature Range of –40°C to 85°C (HD3SS3212IRKS)
  • Provides MUX/DEMUX Solution for USB Type-C™ Ecosystem for USB 3.1 Gen 1 and Gen 2 Data Rates
  • Compatible With MIPI DSI/CSI, FPDLinkIII, LVDS, and PCIE Gen II, III
  • Operates up to 10 Gbps
  • Wide –3-dB Differential BW of over 8 GHz
  • Excellent Dynamic Characteristics (at 5 GHz)
    • Crosstalk = –32 dB
    • Off Isolation = –19 dB
    • Insertion Loss = –1.6 dB
    • Return Loss = –12 dB
  • Bidirectional "Mux/De-Mux" Differential Switch
  • Supports Common Mode Voltage 0 to 2 V
  • Single Supply Voltage VCC of 3.3 V
  • Commercial Temperature Range of 0°C to 70°C (HD3SS3212RKS)
  • Industrial Temperature Range of –40°C to 85°C (HD3SS3212IRKS)

The HD3SS3212 is a high-speed bidirectional passive switch in mux or demux configurations suited for USB Type-C™ application supporting USB 3.1 Gen 1 and Gen 2 data rates. Based on control pin SEL, the device provides switching on differential channels between Port B or Port C to Port A.

The HD3SS3212 is a generic analog differential passive switch that can work for any high-speed interface applications requiring a common mode voltage range of 0 to 2 V and differential signaling with differential amplitude up to 1800 mVpp. It employs adaptive tracking that ensures the channel remains unchanged for the entire common mode voltage range.

Excellent dynamic characteristics of the device allow high-speed switching with minimum attenuation to the signal eye diagram with very little added jitter. It consumes <2 mW of power when operational and has a shutdown mode exercisable by OEn pin resulting <20 µW.

The HD3SS3212 is a high-speed bidirectional passive switch in mux or demux configurations suited for USB Type-C™ application supporting USB 3.1 Gen 1 and Gen 2 data rates. Based on control pin SEL, the device provides switching on differential channels between Port B or Port C to Port A.

The HD3SS3212 is a generic analog differential passive switch that can work for any high-speed interface applications requiring a common mode voltage range of 0 to 2 V and differential signaling with differential amplitude up to 1800 mVpp. It employs adaptive tracking that ensures the channel remains unchanged for the entire common mode voltage range.

Excellent dynamic characteristics of the device allow high-speed switching with minimum attenuation to the signal eye diagram with very little added jitter. It consumes <2 mW of power when operational and has a shutdown mode exercisable by OEn pin resulting <20 µW.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 12
Typ Titel Datum
* Data sheet HD3SS3212x Two-Channel Differential 2:1/1:2 USB3.1 Mux/Demux datasheet (Rev. F) PDF | HTML 30 Sep 2016
White paper A Primer on USB Type-C and Power Delivery Applications and Requirements (Rev. B) PDF | HTML 25 Mär 2022
Application note Schematic Checklist for HD3SS3212 and HD3SS3220 31 Mär 2020
Application note Enabling USB Type-C downstream ports for USB3.1 and 3.2 Hubs 12 Dez 2019
Application note Passive Mux Selection Based On Bandwidth > Ron 11 Sep 2019
White paper USB System Design Considerations: Switches and Redrivers 16 Nov 2018
EVM User's guide HD3SS3212x EVM User's Guide 27 Aug 2018
Application note High-Speed Layout Guidelines for Signal Conditioners and USB Hubs 14 Jun 2018
Technical article How to select the right USB Type-C™ signal switches PDF | HTML 20 Mär 2018
White paper USB Type-C™ represents breakthrough connectivity 04 Dez 2015
Technical article How USB Type-C helps make cars as smart as phones PDF | HTML 10 Jul 2015
White paper Transition existing products from USB 2.0 OTG to USB Type-C 10 Jul 2015

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Evaluierungsplatine

HD3SS3212EVM — Zweikanaliger differenzieller 2:1/1:2, 10 Gbps, Mux/Demux – Evaluierungsmodul

The HD3SS3212EVM can be used to evaluate the high-speed bidirectional passive switching performance for USB Type-C™ mux or demux applications supporting USB 3.1 Gen 1 and Gen 2 data rates.  It is also compatible with MIPI DSI/CSI, LVDS, and PCI Express Gen 2 and Gen 3 interface standards.
Benutzerhandbuch: PDF
Evaluierungsplatine

USB-CTM-MINIDK-EVM — USB Type-C™ Mini-Dock-Platine mit Video- und Ladeunterstützung – Evaluierungsmodul

The USB Type-C™ and Power Delivery (PD) MiniDock evaluation module (EVM) provides a complete reference solution for a USB Type-C dock including audio, USB data, power and video.  The EVM has a small 2-inch by 4-inch form factor and supports both source and sink power capabilities over (...)

Benutzerhandbuch: PDF | HTML
Simulationsmodell

HD3SS3212 S-Parameter Model

SLAR119.ZIP (184 KB) - S-Parameter Model
Simulationstool

PSPICE-FOR-TI — PSpice® für TI Design-und Simulationstool

PSpice® für TI ist eine Design- und Simulationsumgebung, welche Sie dabei unterstützt, die Funktionalität analoger Schaltungen zu evaluieren. Diese voll ausgestattete Design- und Simulationssuite verwendet eine analoge Analyse-Engine von Cadence®. PSpice für TI ist kostenlos erhältlich und (...)
Simulationstool

TINA-TI — SPICE-basiertes analoges Simulationsprogramm

TINA-TI provides all the conventional DC, transient and frequency domain analysis of SPICE and much more. TINA has extensive post-processing capability that allows you to format results the way you want them. Virtual instruments allow you to select input waveforms and probe circuit nodes voltages (...)
Benutzerhandbuch: PDF
Referenzdesigns

TIDA-01243 — USB Type-C™ und Stromversorgungs-Minidock mit Video- und Ladeunterstützung – Referenzdesign

The USB Type-C® and power delivery (PD) minidock reference design provides a reference for a USB Type-C dock including audio, USB data, power and video.  This reference design has a small 2-inch by 4-inch form factor and supports both source and sink power capabilities over the (...)
Design guide: PDF
Schaltplan: PDF
Referenzdesigns

TIDA-00882 — Referenzdesign für HDD mit USB Typ C und Stromversorgung über den USB-Bus

This reference design uses Texas Instrument's SuperSpeed USB 3.0 to SATA bridge, USB Type-CTM and USB PD controller with integrated power switch and High-Speed USB mux, and SuperSpeed USB 3.1 mux to demonstrate the subsystems required to implement a Type-C external hard disk drive capable of (...)
Test report: PDF
Schaltplan: PDF
Gehäuse Pins Herunterladen
VQFN (RKS) 20 Optionen anzeigen

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos