The LMG341xR150 GaN FET with integrated driver and protection enables designers to
achieve new levels of power density and efficiency in power electronics systems. The inherent
advantages of this device over silicon MOSFETs include ultra-low input and output capacitance, zero
reverse recovery to reduce switching losses by as much as 80%, and low switch node ringing to
reduce EMI. These advantages enable dense and efficient topologies like the totem-pole PFC.
The LMG341xR150 provides a smart alternative to traditional cascode GaN and standalone
GaN FETs by integrating a unique set of features to simplify design, maximize reliability and
optimize the performance of any power supply. Integrated gate drive enables 100 V/ns switching with
near zero VDS ringing, less than 100-ns current limiting response
self-protects against unintended shoot-through events, Overtemperature shutdown prevents thermal
runaway, and system interface signals provide self-monitoring capability.
The LMG341xR150 GaN FET with integrated driver and protection enables designers to
achieve new levels of power density and efficiency in power electronics systems. The inherent
advantages of this device over silicon MOSFETs include ultra-low input and output capacitance, zero
reverse recovery to reduce switching losses by as much as 80%, and low switch node ringing to
reduce EMI. These advantages enable dense and efficient topologies like the totem-pole PFC.
The LMG341xR150 provides a smart alternative to traditional cascode GaN and standalone
GaN FETs by integrating a unique set of features to simplify design, maximize reliability and
optimize the performance of any power supply. Integrated gate drive enables 100 V/ns switching with
near zero VDS ringing, less than 100-ns current limiting response
self-protects against unintended shoot-through events, Overtemperature shutdown prevents thermal
runaway, and system interface signals provide self-monitoring capability.