LMP8602-Q1
- Gain = 20x for LMP8601 and LMP8601-Q1
- Gain = 50x for LMP8602 and LMP8602-Q1
- Gain = 100x for LMP8603 and LMP8603-Q1
- TCVOS: 10 µV/°C Maximum
- CMRR: 90-dB Minimum
- Input Offset Voltage: 1-mV Maximum
- CMVR at VS = 3.3 V: –4 V to 27 V
- CMVR at VS = 5 V: –22 V to 60 V
- Single-Supply Bidirectional Operation
- All Minimum and Maximum Limits 100% Tested
- Q1 Devices Qualified for Automotive Applications
- Q1 Devices ACE-Q100 Qualified With the Following Results:
- Device Temperature Grade 1: –40°C to 125°C Ambient Operating Temperature Range
- Device Temperature Grade 0: –40°C to 150°C (LMP8601EDRQ1 Only)
- Device HBM ESD Classification Level 2
(3A on inputs) - Device CDM ESD Classification Level C6
- Device MM ESD Classification Level M2
The LMP8601, LMP8602, LMP8603 (LMP860x) and LMP8601-Q1, LMP8602-Q1, LMP8603-Q1 (LMP860x-Q1) devices are fixed-gain, precision current-sense amplifiers (also referred to as current-shunt monitors). The input common-mode voltage range is –22 V to +60 V when operating from a single 5-V supply, or –4 V to +27 V with a 3.3-V supply. The LMP860x and LMP860x-Q1 are ideal parts for unidirectional and bidirectional current sensing applications.
These devices have a precise gain of 20x (LPM8601, LPM8601-Q1), 50x (LPM8602, LPM8602-Q1), and 100x (LPM8603, LPM8603-Q1), and are adequate in most targeted applications to drive an ADC to full-scale value. The fixed gain is achieved in two separate stages: a preamplifier with a gain of 10x and an output stage buffer amplifier with a gain of 2x (LMP8601, LMP8601-Q1), 5x (LMP8602, LMP8602-Q1), or 10x (LMP8603, LMP8603-Q1). The path between the two stages is brought out on two pins to enable the option of an additional filter network or modifying the gain.
The offset input pin enables these devices for unidirectional or bidirectional single supply voltage current sensing.
The LMP860x-Q1 devices incorporate enhanced manufacturing and support processes for the automotive market and are compliant with the AEC-Q100 standard.
기술 자료
유형 | 직함 | 날짜 | ||
---|---|---|---|---|
* | Data sheet | LMP860x, LMP860x-Q1 60-V, Bidirectional, Low- or High-Side, Voltage-Output, Current-Sensing Amplifiers datasheet (Rev. H) | PDF | HTML | 2016/04/27 |
Application note | Risks and Prevention of ESD, EOS, and Latch Up Events for Current Sense Amplifiers | PDF | HTML | 2024/11/18 | |
Application brief | Low-Drift, Precision, In-Line Motor Current Measurements With PWM Rejection (Rev. D) | PDF | HTML | 2023/04/07 | |
Application brief | Switching Power Supply Current Measurements (Rev. E) | PDF | HTML | 2023/04/07 | |
Application note | Using a PCB Copper Trace as a Current-Sense Shunt Resistor | PDF | HTML | 2022/01/25 | |
Application brief | Benefits of Intergated Low Inductive Shunt for PWM Applications | 2017/06/17 | ||
Application brief | Precision LED Brightness and Color Mixing With Discrete Current Sense Amplifiers | 2017/02/28 | ||
EVM User's guide | AN-1923 Current Sense Demo Board (SOIC) User's Guide (Rev. A) | 2013/04/26 | ||
EVM User's guide | AN-1958 LMP860X SOIC Eval Board User's Guide (Rev. C) | 2013/04/26 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
LMP8602MAEVAL — LMP8602용 평가 보드
The LMP860X SOIC Evaluation Board is designed to evaluate current sense amplifiers like the LMP8601, LMP8602, and LMP8603. These all are 60V Common Mode, Bidirectional Precision Current Sensing amplifier with different gain. This board has a LMP860X part mounted on the PCB together with the (...)
CIRCUIT060035 — 윈도우 콤퍼레이터 회로를 사용한 양방향 전류 감지
CIRCUIT060037 — 정밀 과전류 래치 회로
PSPICE-FOR-TI — TI 설계 및 시뮬레이션 툴용 PSpice®
TI 설계 및 시뮬레이션 환경용 PSpice는 기본 제공 라이브러리를 이용해 복잡한 혼합 신호 설계를 시뮬레이션할 수 있습니다. 레이아웃 및 제작에 (...)
TINA-TI — SPICE 기반 아날로그 시뮬레이션 프로그램
TIDA-00302 — 과도 안정성을 갖춘 전류 션트 모니터 레퍼런스 디자인
Additionally, an external protection circuit is implemented to provide surge and fast-transient protection and demonstrate the different immunity levels to (...)
패키지 | 핀 | CAD 기호, 풋프린트 및 3D 모델 |
---|---|---|
SOIC (D) | 8 | Ultra Librarian |
VSSOP (DGK) | 8 | Ultra Librarian |
주문 및 품질
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
- 팹 위치
- 조립 위치