DSLVDS1047
- Designed for Signaling Rates up to 400-Mbps
- 3.3-V Power Supply Design
- 300-ps Typical Differential Skew
- 400-ps Maximum Differential Skew
- 1.7-ns Maximum Propagation Delay
- ±350-mV Differential Signaling
- Low Power Dissipation (13 mW at 3.3-V Static)
- Interoperable With Existing 5-V LVDS Receivers
- High impedance on LVDS Outputs on Power Down
- Flow-Through Pinout Simplifies PCB Layout
- Meets or Exceeds TIA/EIA-644 LVDS Standard
- Industrial Operating Temperature Range
(−40°C to +85°C) - Available in TSSOP Package
The DSLVDS1047 device is a quad CMOS flow-through differential line driver designed for applications requiring ultra-low power dissipation and high data rates. The device is designed to support data rates in excess of 400 Mbps (200 MHz) using Low Voltage Differential Signaling (LVDS) technology.
The DSLVDS1047 accepts low voltage TTL/CMOS input levels and translates them to low voltage
(350 mV) differential output signals. In addition, the driver supports a TRI-STATE function that may be used to disable the output stage, disabling the load current, and thus dropping the device to an ultra low idle power state of 13 mW typical. The DSLVDS1047 has a flow-through pinout for easy PCB layout.
The EN and EN* inputs are ANDed together and control the TRI-STATE outputs. The enables are common to all four drivers. The and companion line receiver (DSLVDS1048) provide a new alternative to high power psuedo-ECL devices for high speed point-to-point interface applications.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | DSLVDS1047 3.3-V LVDS Quad Channel High-Speed Differential Line Driver datasheet | PDF | HTML | 2018年 9月 27日 |
Application note | Applications of Low-Voltage Differential Signaling (LVDS) in LED Walls | 2020年 10月 29日 | ||
Application note | Applications of Low-Voltage Differential Signaling (LVDS) in Ultrasound Scanners | 2019年 6月 29日 | ||
Application brief | LVDS to Improve EMC in Motor Drives | 2018年 9月 27日 | ||
EVM User's guide | DSLVDS1047-1048EVM User's Guide | 2018年 8月 23日 | ||
Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||
Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018年 5月 16日 | ||
Application note | An Overview of LVDS Technology | 1998年 10月 5日 |
設計與開發
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DSLVDS1047-1048EVM — 四通道 LVDS 驅動器和接收器評估模組
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PSPICE-FOR-TI — PSpice® for TI 設計與模擬工具
TINA-TI — 基於 SPICE 的類比模擬程式
封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
---|---|---|
TSSOP (PW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
- REACH
- 產品標記
- 鉛塗層/球物料
- MSL 等級/回焊峰值
- MTBF/FIT 估算值
- 材料內容
- 認證摘要
- 進行中持續性的可靠性監測
- 晶圓廠位置
- 組裝地點
建議產品可能具有與此 TI 產品相關的參數、評估模組或參考設計。