TCA4307
- Supports bidirectional data transfer of I 2C bus signals
- Operating power-supply voltage range of 2.3 V to 5.5 V
- T A ambient air temperature range of -40 °C to 125 °C
- Stuck bus recovery featuring automatic bus recovery
- 1-V Precharge on all SDA and SCL lines prevents corruption during live insertion
- Accommodates standard mode and fast mode I 2C devices
- Supports clock stretching, arbitration and synchronization
- Powered-off high-impedance I 2C pins
The TCA4307 is a hot-swappable I 2C bus buffer that supports I/O card insertion into a live backplane without corruption of the data and clock lines. Control circuitry prevents the backplane-side I 2C lines (in) from being connected to the card-side I 2C lines (out) until a stop command or bus idle condition occurs on the backplane without bus contention on the card. When the connection is made, this device provides bidirectional buffering, keeping the backplane and card capacitance isolated. During insertion, the SDA and SCL lines are pre-charged to 1 V to minimize the current required to charge the parasitic capacitance of the device.
The TCA4307 has stuck bus recovery, which automatically disconnects the bus if it detects either SDAOUT or SCLOUT are low for about 40 ms. Once the bus is disconnected, the device automatically generates up to 16 pulses on SCLOUT to attempt to reset the device which is holding the bus low.
When the I 2C bus is idle, the TCA4307 can be put into shutdown mode by setting the EN pin low, reducing power consumption. When EN is pulled high, the TCA4307 resumes normal operation. It also includes an open drain READY output pin, which indicates that the backplane and card sides are connected together. When READY is high, the SDAIN and SCLIN are connected to SDAOUT and SCLOUT. When the two sides are disconnected, READY is low.
技術文件
類型 | 標題 | 日期 | ||
---|---|---|---|---|
* | Data sheet | TCA4307Hot Swappable I2C Bus and SMBus Bufferwith Stuck Bus Recovery datasheet (Rev. B) | PDF | HTML | 2023年 11月 21日 |
Application note | I2C Solutions for Hot Swap Applications (Rev. A) | 2023年 1月 31日 |
設計與開發
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訂購與品質
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