SNVSCF0 October   2024 LM65680-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descriptions
      1. 7.3.1  Output Voltage Selection
      2. 7.3.2  EN Pin and Use as VIN UVLO
      3. 7.3.3  Device Configuration
      4. 7.3.4  Single-Output Dual-Phase Operation
      5. 7.3.5  Mode Selection
        1. 7.3.5.1 MODE/SYNC Pin Uses for Synchronization
        2. 7.3.5.2 Clock Locking
      6. 7.3.6  Adjustable Switching Frequency
      7. 7.3.7  Dual Random Spread Spectrum (DRSS)
      8. 7.3.8  Internal LDO, VCC UVLO, and BIAS Input
      9. 7.3.9  Bootstrap Voltage (BST Pin)
      10. 7.3.10 Soft Start and Recovery From Dropout
      11. 7.3.11 Safety Features
        1. 7.3.11.1 Power-Good Monitor
        2. 7.3.11.2 Overcurrent and Short-Circuit Protection
        3. 7.3.11.3 Hiccup
        4. 7.3.11.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
        1. 7.4.2.1 Peak Current Mode Operation
        2. 7.4.2.2 Auto Mode Operation
          1. 7.4.2.2.1 Diode Emulation
        3. 7.4.2.3 FPWM Mode Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Power Train Components
        1. 8.1.1.1 Buck Inductor
        2. 8.1.1.2 Output Capacitors
        3. 8.1.1.3 Input Capacitors
        4. 8.1.1.4 EMI Filter
      2. 8.1.2 Error Amplifier and Compensation
      3. 8.1.3 Maximum Ambient Temperature
        1. 8.1.3.1 Derating Curves
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Output Capacitors
        3. 8.2.2.3 Feed-forward Capacitor (CFF)
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Choosing the Switching Frequency
        6. 8.2.2.6 Setting the Output Voltage
        7. 8.2.2.7 Compensation Components
        8. 8.2.2.8 CBST
        9. 8.2.2.9 External UVLO
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
        1. 9.2.1.1 PCB Layout Resources
        2. 9.2.1.2 Thermal Design Resources
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.1 Absolute Maximum Ratings

Over operating junction temperature range (unless otherwise noted) (1)
MIN MAX UNIT
Input voltage VIN to PGND –0.3 75 V
Input voltage EN/UVLO TO PGND –0.3 75 V
Input voltage RT to PGND –0.3 75 V
Input voltage DRSS/MODECOMM to PGND –0.3 40 V
Input voltage BIAS TO PGND –0.3 40 V
Input voltage MODE/SYNC to PGND –0.3 5.5 V
Input voltage CONFIG/CLKOUT to PGND –0.3 5.5 V
Input voltage COMP, FB to PGND –0.3 5.5 V
Input voltage SS to PGND –0.3 VCC + 0.3 V
Output voltage SW to PGND –0.6 VIN + 0.3 V
Output voltage PG to PGND –0.3 40 V
Output voltage BST to SW –0.3 5.5 V
Output voltage VCC to PGND –0.3 5.5 V
TJ Operating junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.