SNVSCF0 October   2024 LM65680-Q1

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Device Comparison Table
  6. 5 Pin Configuration and Functions
  7. 6 Specifications
    1. 6.1 Absolute Maximum Ratings
    2. 6.2 ESD Ratings
    3. 6.3 Recommended Operating Conditions
    4. 6.4 Thermal Information
    5. 6.5 Electrical Characteristics
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Descriptions
      1. 7.3.1  Output Voltage Selection
      2. 7.3.2  EN Pin and Use as VIN UVLO
      3. 7.3.3  Device Configuration
      4. 7.3.4  Single-Output Dual-Phase Operation
      5. 7.3.5  Mode Selection
        1. 7.3.5.1 MODE/SYNC Pin Uses for Synchronization
        2. 7.3.5.2 Clock Locking
      6. 7.3.6  Adjustable Switching Frequency
      7. 7.3.7  Dual Random Spread Spectrum (DRSS)
      8. 7.3.8  Internal LDO, VCC UVLO, and BIAS Input
      9. 7.3.9  Bootstrap Voltage (BST Pin)
      10. 7.3.10 Soft Start and Recovery From Dropout
      11. 7.3.11 Safety Features
        1. 7.3.11.1 Power-Good Monitor
        2. 7.3.11.2 Overcurrent and Short-Circuit Protection
        3. 7.3.11.3 Hiccup
        4. 7.3.11.4 Thermal Shutdown
    4. 7.4 Device Functional Modes
      1. 7.4.1 Shutdown Mode
      2. 7.4.2 Active Mode
        1. 7.4.2.1 Peak Current Mode Operation
        2. 7.4.2.2 Auto Mode Operation
          1. 7.4.2.2.1 Diode Emulation
        3. 7.4.2.3 FPWM Mode Operation
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Power Train Components
        1. 8.1.1.1 Buck Inductor
        2. 8.1.1.2 Output Capacitors
        3. 8.1.1.3 Input Capacitors
        4. 8.1.1.4 EMI Filter
      2. 8.1.2 Error Amplifier and Compensation
      3. 8.1.3 Maximum Ambient Temperature
        1. 8.1.3.1 Derating Curves
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
        1. 8.2.2.1 Inductor Selection
        2. 8.2.2.2 Output Capacitors
        3. 8.2.2.3 Feed-forward Capacitor (CFF)
        4. 8.2.2.4 Input Capacitor Selection
        5. 8.2.2.5 Choosing the Switching Frequency
        6. 8.2.2.6 Setting the Output Voltage
        7. 8.2.2.7 Compensation Components
        8. 8.2.2.8 CBST
        9. 8.2.2.9 External UVLO
      3. 8.2.3 Application Curves
    3. 8.3 Best Design Practices
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
        1. 8.5.1.1 Ground and Thermal Considerations
      2. 8.5.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
        1. 9.2.1.1 PCB Layout Resources
        2. 9.2.1.2 Thermal Design Resources
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Tape and Reel Information

Package Options

Mechanical Data (Package|Pins)
Thermal pad, mechanical data (Package|Pins)
Orderable Information

6.4 Thermal Information

THERMAL METRIC(1) DEVICE UNIT
eQFN (JESD 51-7) eQFN (EVM)
26 PINS 26 PINS
RθJA Junction-to-ambient thermal resistance 33.7(2) 18(3) °C/W
RθJC(top) Junction-to-case (top) thermal resistance 24.1 (4) °C/W
RθJB Junction-to-board thermal resistance 6.9  (4) °C/W
ψJT Junction-to-top characterization parameter 1.1 1.4 °C/W
ψJB Junction-to-board characterization parameter 6.9 5.8 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application note.
(2) The value of RΘJA given in this table is only valid for comparison with other packages and cannot be used for design purposes. It was calculated in accordance with JESD 51-7, simulated with a 4-layer JEDEC board, and does do not represent the performance obtained in an actual application. For thermal design information please see the  Maximum Ambient Temperature  section.
(3) Refer to the LM65680-Q1EVM user's guide for board layout and additional information. For thermal design information please see the Maximum Ambient Temperature  section.
(4) Not applicable to an EVM.