Place the protection and filtering circuitry as
close to the bus connector, to prevent transients, ESD and noise from propagating
onto the board. The layout example provides information on components around the
device. Add a transient voltage suppression (TVS) device for extra protection. A
series common mode choke (CMC) is placed on the CANH and CANL lines between and
connector.
Design the bus protection components in the direction of the signal path. Do not force the transient current to divert from the signal path to reach the protection device. Use supply and ground planes to provide low inductance.
Note: High-frequency currents follows the path of least impedance and not the path of least resistance.
- Verify that high-frequency
filtering capacitors, typically 100nF, are placed as close as possible to
the supply terminals of the device. Establish that this capacitor is low
ESR.
- Input and output supply
capacitors, CIN and CVCC2, can be low ESR, and must be
close to the supply terminal pins.
- VSUPB is the supply input to the switching FETs of the
buck regulator; and therefore, are separated from VSUP and VHSS by a
pi-filter as shown.
- The routing resistance must be minimized from the VCC1 output capacitor to
the VCC1 pin of the TCAN245x-Q1. The internal
circuits of the digital pins of the TCAN245x-Q1
are powered by the VCC1 pin; therefore, any excessive resistance in this
path can cause problems with VCC1 regulation.
- Bus termination: this layout
example shows split termination. This is where the termination is split into
two resistors, RTERM, with the center or split tap of the
termination connected to ground via capacitor CSPLIT. Split
termination provides common mode filtering for the bus. When bus termination
is placed on the board instead of directly on the bus, additional care must
be taken to make sure the terminating node is not removed from the bus;
thus, removing the termination.
- Use at least two vias for supply and ground connections of bypass capacitors
and protection devices to minimize trace and via inductance.