SLVAE87B December   2020  – June 2025 BQ79600-Q1 , BQ79612-Q1 , BQ79614-Q1 , BQ79616-Q1 , BQ79652-Q1 , BQ79654-Q1 , BQ79656-Q1

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1 NPN LDO Supply
  5. 2 AVDD, CVDD Outputs and DVDD, NEG5, REFHP and REFHM
    1. 2.1 Base Device
    2. 2.2 Design Summary
  6. 3 OTP Programming
  7. 4 Cell Voltage Sense (VCn) and Cell Balancing (CBn)
    1. 4.1 Cell Voltage Sense (VCn)
    2. 4.2 Cell Balancing (CBn)
      1. 4.2.1 Non-Adjacent Cell Balancing
      2. 4.2.2 Adjacent Cell Balancing
      3. 4.2.3 Cell Balancing With External FET
    3. 4.3 Using Fewer Than 16 Cells
      1. 4.3.1 Design Summary
  8. 5 Bus Bar Support
    1. 5.1 Bus Bar on BBP or BBN
    2. 5.2 Typical Connection
      1. 5.2.1 Cell Balancing Handling
    3. 5.3 Bus Bar on Individual VC Channel
    4. 5.4 Multiple Bus Bar Connections
      1. 5.4.1 Two Bus Bar Connections to One Device
      2. 5.4.2 Three Bus Bar Connections to One Device
      3. 5.4.3 Cell Balancing Handling
  9. 6 TSREF
  10. 7 General Purpose Input-Output (GPIO) Configurations
    1. 7.1 Ratiometric Temperature Measurement
    2. 7.2 SPI Mode
      1. 7.2.1 Support 8 NTC Thermistors With SPI Slave Device
      2. 7.2.2 Design Summary
  11. 8 Base and Bridge Device Configuration
    1. 8.1 Power Mode Pings and Tones
      1. 8.1.1 Power Mode Pings
      2. 8.1.2 Power Mode Tones
      3. 8.1.3 Ping and Tone Propagation
    2. 8.2 UART Physical Layer
      1. 8.2.1 Design Considerations
  12. 9 Daisy-Chain Stack Configuration
    1. 9.1 Communication Line Isolation
      1. 9.1.1 Capacitor Only Isolation
      2. 9.1.2 Capacitor and Choke Isolation
      3. 9.1.3 Transformer Isolation
      4. 9.1.4 Design Summary
    2. 9.2 Ring Communication
    3. 9.3 Reclocking
      1. 9.3.1 Design Summary
  13. 10Multidrop Configuration
  14. 11Main ADC Digital LPF
  15. 12AUX Anti Aliasing Filter (AAF)
  16. 13Layout Guidelines
    1. 13.1 Ground Planes
    2. 13.2 Bypass Capacitors for Power Supplies and References
    3. 13.3 Cell Voltage Sensing
    4. 13.4 Daisy Chain Communication
  17. 14BCI Performance
  18. 15Common and Differential Mode Noise
    1. 15.1 Design Consideration
  19. 16Summary
  20. 17References
  21. 18Revision History

7.2.2 Design Summary

  1. Connect external temperature sensor to GPIOs using a voltage divider network.
  2. GPIO pins used for temperature measurement must have a pullup resistor to TSREF equivalent to the resistance of the NTC at nominal temperature. Each input must also have a 1kΩ resistor and 1µF capacitor.
  3. GPIO pins with signals connecting from off-board must use a zener diode clamp.
  4. DC voltage readings need a 1kΩ resistor and 1µF capacitor.
  5. To use GPIOs in SPI mode, use GPIO4 through GPIO7. Unused GPIOs must be pulled low to GND.
  6. GPIO pins are all programmed as inputs with a weak pulldown, leaving the inputs floating. The pins must not be allowed to remain as floating inputs. Reprogram the pins to become outputs or add a pulldown resistor.
  7. The BQ79616-Q1 can support 8 NTC thermistors with SPI slave device using 4 channel 2:1 switch and this configuration has no impact to temperature measurement diagnostic.