SLVSHO1A March 2025 – December 2025 TPS1689
PRODUCTION DATA
| THERMAL METRIC | TPS1689x | UNIT | |
|---|---|---|---|
| LQFN | |||
| PINS | |||
| RθJA | Junction-to-ambient thermal resistance | 21.6 | °C/W |
| ΨJT | Junction-to-top characterization parameter | 0.9 | °C/W |
| ΨJB | Junction-to-board characterization parameter | 8.9 | °C/W |