SLVSHO1A March   2025  – December 2025 TPS1689

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Device Comparison
  6. Pin Configuration and Functions
  7. Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Electrical Characteristics
    6. 6.6  Telemetry
    7. 6.7  PMBus and GPIO DC Characteristics
    8. 6.8  Logic Interface
    9. 6.9  Timing Requirements
    10. 6.10 Switching Characteristics
    11. 6.11 Typical Characteristics
  8. Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1  Undervoltage Protection
      2. 7.3.2  Insertion Delay
      3. 7.3.3  Overvoltage Protection
      4. 7.3.4  Inrush Current, Overcurrent, and Short-Circuit Protection
        1. 7.3.4.1 Slew rate (dVdt) and Inrush Current Control
          1. 7.3.4.1.1 Start-Up Timeout
        2. 7.3.4.2 Steady-State Overcurrent Protection (Circuit-Breaker)
        3. 7.3.4.3 Active Current Limiting During Start-Up
        4. 7.3.4.4 Short-Circuit Protection
      5. 7.3.5  Analog Load Current Monitor (IMON)
      6. 7.3.6  Overtemperature Protection
      7. 7.3.7  Analog Junction Temperature Monitor (TEMP)
      8. 7.3.8  FET Health Monitoring
      9. 7.3.9  Single Point Failure Mitigation
        1. 7.3.9.1 IMON Pin Single Point Failure
        2. 7.3.9.2 IREF Pin Single Point Failure
      10. 7.3.10 General Purpose Digital Input/Output Pins
        1. 7.3.10.1 Fault Response and Indication (FLT)
        2. 7.3.10.2 Power Good Indication (PG)
        3. 7.3.10.3 Parallel Device Synchronization (SWEN)
      11. 7.3.11 Stacking Multiple eFuses for Unlimited Scalability
        1. 7.3.11.1 Current Balancing During Start-Up
      12. 7.3.12 Quick Output Discharge(QOD)
      13. 7.3.13 Write Protect Feature(WP#)
      14. 7.3.14 PMBus® Digital Interface
        1. 7.3.14.1  PMBus® Device Addressing
        2. 7.3.14.2  SMBus Protocol
        3. 7.3.14.3  SMBus™ Message Formats
        4. 7.3.14.4  Packet Error Checking
        5. 7.3.14.5  Group Commands
        6. 7.3.14.6  SMBus™ Alert Response Address (ARA)
        7. 7.3.14.7  PMBus® Commands
          1. 7.3.14.7.1 Detailed Descriptions of PMBus® Commands
            1. 7.3.14.7.1.1  OPERATION (01h, Read/Write Byte)
            2. 7.3.14.7.1.2  CLEAR_FAULTS (03h, Send Byte)
            3. 7.3.14.7.1.3  RESTORE_FACTORY_DEFAULTS (12h, Send Byte)
            4. 7.3.14.7.1.4  STORE_USER_ALL (15h, Send Byte)
            5. 7.3.14.7.1.5  RESTORE_USER_ALL (16h, Send Byte)
            6. 7.3.14.7.1.6  BB_ERASE (F5h, Send Byte)
            7. 7.3.14.7.1.7  FETCH_BB_EEPROM (F6h, Send Byte)
            8. 7.3.14.7.1.8  CLEAR_BB_RAM (FCh, Send Byte)
            9. 7.3.14.7.1.9  POWER_CYCLE (D9h, Send Byte)
            10. 7.3.14.7.1.10 MFR_WRITE_PROTECT (F8h, Read/Write Byte)
            11. 7.3.14.7.1.11 CAPABILITY (19h, Read Byte)
            12. 7.3.14.7.1.12 STATUS_BYTE (78h, Read Byte)
            13. 7.3.14.7.1.13 STATUS_WORD (79h, Read Word)
            14. 7.3.14.7.1.14 STATUS_OUT (7Ah, Read Byte)
            15. 7.3.14.7.1.15 STATUS_IOUT (7Bh, Read Byte)
            16. 7.3.14.7.1.16 STATUS_INPUT (7Ch, Read Byte)
            17. 7.3.14.7.1.17 STATUS_TEMP (7Dh, Read Byte)
            18. 7.3.14.7.1.18 STATUS_CML (7Eh, Read Byte)
            19. 7.3.14.7.1.19 STATUS_MFR_SPECIFIC (80h, Read Byte)
            20. 7.3.14.7.1.20 STATUS_MFR_SPECIFIC_2 (F3h, Read Word)
            21. 7.3.14.7.1.21 PMBUS_REVISION (98h, Read Byte)
            22. 7.3.14.7.1.22 MFR_ID (99h, Block Read)
            23. 7.3.14.7.1.23 MFR_MODEL (9Ah, Block Read)
            24. 7.3.14.7.1.24 MFR_REVISION (9Bh, Block Read)
            25. 7.3.14.7.1.25 READ_VIN (88h, Read Word)
            26. 7.3.14.7.1.26 READ_VOUT (8Bh, Read Word)
            27. 7.3.14.7.1.27 READ_IIN (89h, Read Word)
            28. 7.3.14.7.1.28 READ_TEMPERATURE_1 (8Dh, Read Word)
            29. 7.3.14.7.1.29 READ_VAUX (D0h, Read Word)
            30. 7.3.14.7.1.30 READ_PIN (97h, Read Word)
            31. 7.3.14.7.1.31 READ_EIN (86h, Block Read)
            32. 7.3.14.7.1.32 READ_VIN_AVG (DCh, Read Word)
            33. 7.3.14.7.1.33 READ_VIN_MIN (D1h, Read Word)
            34. 7.3.14.7.1.34 READ_VIN_PEAK (D2h, Read Word)
            35. 7.3.14.7.1.35 READ_VOUT_AVG (DDh, Read Word)
            36. 7.3.14.7.1.36 READ_VOUT_MIN (DAh, Read Word)
            37. 7.3.14.7.1.37 READ_IIN_AVG (DEh, Read Word)
            38. 7.3.14.7.1.38 READ_IIN_PEAK (D4h, Read Word)
            39. 7.3.14.7.1.39 READ_TEMP_AVG (D6h, Read Word)
            40. 7.3.14.7.1.40 READ_TEMP_PEAK (D7h, Read Word)
            41. 7.3.14.7.1.41 READ_PIN_AVG (DFh, Read Word)
            42. 7.3.14.7.1.42 READ_PIN_PEAK (D5h, Read Word)
            43. 7.3.14.7.1.43 READ_SAMPLE_BUF (D8h, Block Read)
            44. 7.3.14.7.1.44 READ_BB_RAM (FDh, Block Read)
            45. 7.3.14.7.1.45 READ_BB_EEPROM (F4h, Block Read)
            46. 7.3.14.7.1.46 BB_TIMER (FAh, Read Byte)
            47. 7.3.14.7.1.47 PMBUS_ADDR (FBh, Read/Write Byte)
            48. 7.3.14.7.1.48 VIN_UV_WARN (58h, Read/Write Word)
            49. 7.3.14.7.1.49 VIN_UV_FLT (59h, Read/Write Word)
            50. 7.3.14.7.1.50 VIN_OV_WARN (57h, Read/Write Word)
            51. 7.3.14.7.1.51 VIN_OV_FLT (55h, Read/Write Word)
            52. 7.3.14.7.1.52 VOUT_UV_WARN (43h, Read/Write Word)
            53. 7.3.14.7.1.53 VOUT_PGTH (5Fh, Read/Write Word)
            54. 7.3.14.7.1.54 OT_WARN (51h, Read/Write Word)
            55. 7.3.14.7.1.55 OT_FLT (4Fh, Read/Write Word)
            56. 7.3.14.7.1.56 PIN_OP_WARN (6Bh, Read/Write Word)
            57. 7.3.14.7.1.57 IIN_OC_WARN (5Dh, Read/Write Word)
            58. 7.3.14.7.1.58 ALERT_MASK (DBh, Read/Write Word)
            59. 7.3.14.7.1.59 VIREF (E0h, Read/Write Byte)
            60. 7.3.14.7.1.60 AUX/TEMP/EEDATA/EECLK/GPIOx (E1h, Read/Write Byte)
            61. 7.3.14.7.1.61 SMBA_FLT_CONFIG (E2h, Read/Write Byte)
            62. 7.3.14.7.1.62 FAULT_MASK (E3h, Read/Write Word)
            63. 7.3.14.7.1.63 DEVICE_CONFIG (E4h, Read/Write Word)
            64. 7.3.14.7.1.64 BB_CONFIG (E5h, Read/Write Byte)
            65. 7.3.14.7.1.65 OC_TIMER (E6h, Read/Write Byte)
            66. 7.3.14.7.1.66 RETRY_CONFIG (E7h, Read/Write Byte)
            67. 7.3.14.7.1.67 ADC_CONFIG_1 (E8h, Read/Write Byte)
            68. 7.3.14.7.1.68 ADC_CONFIG_2 (E9h, Read/Write Byte)
            69. 7.3.14.7.1.69 PK_MIN_AVG (EAh, Read/Write Byte)
            70. 7.3.14.7.1.70 PSU_VOLTAGE (ECh, Read/Write Byte)
            71. 7.3.14.7.1.71 CABLE_DROP (EDh, Read/Write Byte)
            72. 7.3.14.7.1.72 IMON OFFSET CALIBRATION (F2h, Read/Write Byte)
            73. 7.3.14.7.1.73 INS_DLY (F9h, Read/Write Byte)
        8. 7.3.14.8  Analog-to-Digital Converter
        9. 7.3.14.9  Digital-to-Analog Converters
        10. 7.3.14.10 DIRECT Format Conversion
        11. 7.3.14.11 Blackbox Fault Recording
    4. 7.4 Device Functional Modes
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Single Device, Standalone Operation
      2. 8.1.2 Single TPS1689x and Multiple TPS1685 Devices, Parallel Connection
      3. 8.1.3 Multiple TPS1689x Devices: Parallel Connection With Individual Telemetry
      4. 8.1.4 Multiple Devices, Independent Operation (Multi-zone)
    2. 8.2 Typical Application: 54V, 2kW Power Path Protection with PMBus® Interface in Datacenter Servers
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Performance Plots
    3. 8.3 Power Supply Recommendations
      1. 8.3.1 Transient Protection and Other Design Considerations
      2. 8.3.2 Output Short-Circuit Measurements
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
  10. Device and Documentation Support
    1. 9.1 Third-Party Products Disclaimer
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Electrical Characteristics

–40°C ≤ TJ ≤ +125°C, VIN = VDD = 50V, OUT = Open, RILIM = 931Ω, RIMON = 2.55kΩ, VIREF = 1V , FLT = 10kΩ pull-up to 5V, PGOOD = 10kΩ pull-up to 5V, COUT = 10µF, CIN = 10nF, dVdT = Open , VEN/UVLO = 2V, TEMP/EECLK/GPIO1 = Open, AUX/EEDATA/GPIO2 = Open, ADDR0 = Open, ADDR1 = Open, SCL = 330Ω pull-up to 3.3V, SDA = 330Ω pull-up to 3.3V.  (All voltages referenced to GND, (unless otherwise noted))
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
INPUT SUPPLY (VDD)
VIN Input voltage range 9 80 V
VDD Input voltage range VIN 80 V
IQON(VDD) VDD ON state quiescent current VDD > VUVPR, VEN ≥ VUVLOR, VOVP < VOVPF 4 6 mA
VUVPR VDD Undervoltage Protection Threshold Rising VDD Rising 8.5 8.9 V
VUVPF VDD Undervoltage Protection Threshold falling VDD Falling 6.7 7.05 V
VUVPHYS UVP Hysteresis VDD 1.5 V
INPUT SUPPLY (IN)
VUVLOR(VIN) VIN undervoltage threshold rising VIN Rising, VIN_UV_FLT = 0x7F 40.5 41.2 V
VUVLOF(VIN) VIN undervoltage threshold falling VIN Falling, VIN_UV_FLT = 0x7F 37 38.5 V
IQON(VIN) VIN ON state quiescent current VEN ≥ VUVLOR 1.69 mA
IQOFF(VIN) VIN OFF state current   VSDR < VEN < VUVLO 1.69 mA
ISD(VIN) VIN shutdown current VEN < VSDF 1.69 mA
ILKG(VOUT) VOUT leakage current VEN < VUVLO, SWEN=L, VOUT = 0V 20 µA
ILKG(VOUT) VOUT leakage current VEN > VUVLO, SWEN=L, VOUT = 0V 220 µA
ENABLE / UNDERVOLTAGE LOCKOUT (EN/UVLO)
VUVLOR EN/UVLO pin voltage threshold for turning on, rising EN/UVLO  Rising 1.18 1.21 1.24 V
VUVLOF EN/UVLO pin voltage threshold for turning off and engaging QOD, falling  (primary device) EN/UVLO Falling 1 1.12 1.14 V
VUVLOHYS UVLO Hysteresis 89 mV
VSDF Shutdown threshold EN/UVLO Falling 0.4 0.42 V
VSDR Shutdown threshold EN/UVLO  Rising  0.5 0.55 V
IENLKG EN/UVLO pin leakage current -100 100 nA
OVERVOLTAGE PROTECTION (IN)
VIN-OVPR IN overvoltage protection threshold (rising) VIN_OV_FLT = 0xB1
58.5 60 61.5 V
VIN-OVPF IN overvoltage protection threshold (falling) VIN_OV_FLT = 0xB1
55.57 57 58.43 V
VIN-OVPHYS IN overvoltage protection threshold (Hysterisis) VIN_OV_FLT = 0xB1
3 V
ON-RESISTANCE (IN - OUT)
RON ON state resistance IOUT = 12A; TJ = 25°C 3.5 5.55
RON ON state resistance IOUT = 12A; TJ = -40°C to 125°C 6.1
CURRENT LIMIT REFERENCE (IREF)
VIREF Current Limit Reference DAC output
voltage
VIREF = 0x32 (Default) 0.99 1 1.01 V
VIREF Current Limit Reference DAC output
voltage
VIREF = 0x00 0.29 0.3 0.31 V
VIREF Current Limit Reference DAC output
voltage
VIREF = 0x3F 1.16 1.182 1.2 V
CURRENT LIMIT (ILIM)
GILIM(LIN) Current Monitor Gain (ILIM:IOUT) vs. IOUT. Device in steady state (PG asserted), IOUT = 12 A 17 18 20.6 µA/A
Istart-up peak Peak Current at Startup VOUT > VFB, GHI deasserted; VIN ≤ 60V 0.5 A
VFB Foldback voltage 2 V
OUTPUT CURRENT MONITOR AND OVERCURRENT PROTECTION (IMON)
GIMON Current Monitor Gain (IMON:IOUT) Device in steady state (PG asserted), IOUT = 12A 17.7 18.18 18.49 µA/A
GIMON Current Monitor Gain (IMON:IOUT) Device in steady state (PG asserted), IOUT = 4A 17.4 18.31 19.1 µA/A
IOCP IOUT Current limit trip (Circuit-Breaker) threshold RIMON = 2.55kΩ, VIREF = 1V 21.0 21.7 22.3 A
SHORT-CIRCUIT PROTECTION
IFFT Fixed fast trip threshold in steady state (TPS16890) PG asserted High 73 A
IFFT Fixed fast trip threshold in steady state (TPS1689A) PG asserted High 83 A
IFFT Fixed fast trip threshold in steady state (TPS16890) PG asserted High; TJ = 25°C to 125°C 55 A
IFFT Fixed fast trip threshold in steady state (TPS1689A) PG asserted High; TJ = 25°C to 125°C 65 A
ISFT Scalable fast trip current:IOCP ratio DEVICE_CONFIG [12:11] = 11 1.5  A/A
ISFT Scalable fast trip current:IOCP ratio DEVICE_CONFIG [12:11] = 10 A/A
ISFT Scalable fast trip current:IOCP ratio DEVICE_CONFIG [12:11] = 01 2.5  A/A
SFT(SAT) Scalable fast trip current:Istart-up peak ratio During Powerup, PGOOD Low 2 A/A
ACTIVE CURRENT SHARING
RON(ACS) RON during Active current sharing VILIM > 1.1 × (1/3) × VIREF 4.38 7 mΩ
GIMON(ACS) IMON:IOUT ratio during active current limiting PG asserted High, VILIM > 1.1 × VIREF 17.24 18.49 19.84 µA/A
CLREF(ACS) Ratio of Active current sharing trigger threshold to steady state circuit-breaker threshold PG asserted High 36.67 %
INRUSH CURRENT PROTECTION (DVDT)
IDVDT dVdt Pin Charging Current DEVICE_CONFIG[10:9] = 11 2.4 3 3.6 µA
IDVDT dVdt Pin Charging Current DEVICE_CONFIG[10:9] = 10 1.5 2 2.5 µA
IDVDT dVdt Pin Charging Current DEVICE_CONFIG[10:9] = 01 0.75 1 1.25 µA
IDVDT dVdt Pin Charging Current DEVICE_CONFIG[10:9] = 00 0.35 0.5 0.65 µA
GDVDT dVdt Gain  0.4V < VdVdt  < 2.4V 22 25 28 V/V
RDVDT dVdt Pin to GND Discharge Resistance 500
GHI
VGS(GHI) Rising  G-S Threshold when GHI/PG is asserted 7 V
RON(GHI) Ron When GHI/PG is asserted 3.8
QUICK OUTPUT DISCHARGE (QOD)
IQOD Quick Output Discharge pull-down current VSD(R) < VEN < VUVLO, VIN = 50V 22 mA
TEMPERATURE SENSOR OUTPUT (TEMP)
GTMP TEMP sensor gain VIN = 50V 2.73 mV/℃
VTMP TEMP pin output voltage TJ = 25 ℃, VIN = 50V 670 678 690 mV
ITMPSRC TEMP pin sourcing current VIN = 50V 119 µA
ITMPSNK TEMP pin sinking current VIN = 50V 10 µA
OVERTEMPERATURE PROTECTION (OTP)
TSD Absolute Thermal Shutdown Rising Threshold TJ Rising, , VIN = 50V 150 °C
TSDHYS Absolute Thermal shutdown hysteresis TJ Falling, VIN = 50V 13 °C
FET HEALTH MONITOR
VDSFLT FET D-S Fault Threshold SWEN = L, VIN = 50V 0.5 V
VDSOK FET D-S Fault Recovery Threshold  SWEN = L, VIN = 50V 0.64 V
ADDRESS SELECT (ADDR0/ADDR1)
IADDRx ADDR0 pin pull-up current 3.85 5.05 6.25 µA
ADDR1 pin pull-up current 3.85 5.05 6.25 µA
IOC_BKP Back-up overcurrent protection threshold IMON short to GND 38.3 A