CC2564

ACTIVE

Bluetooth® 4.0 with Enhanced Data Rate (EDR), Low Energy (LE) and ANT

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Product details

Parameters

Features BR / EDR / LE, Class 1 TX Power, Assisted A2DP/HFP 1.6 Operating temperature range (C) -40 to 85 Rating Catalog open-in-new Find other Bluetooth Low Energy products

Package | Pins | Size

VQFNP-MR (RVM) 76 64 mm² 8 x 8 open-in-new Find other Bluetooth Low Energy products

Features

  • TI’s Single-Chip Bluetooth Solution With Bluetooth
    Basic Rate (BR), Enhanced Data Rate (EDR), and
    Low Energy (LE) Support; Available in Two
    Variants:
    • Dual-Mode Bluetooth CC2564 Controller
    • Bluetooth CC2560 Controller
  • CC2564 Bluetooth 4.1 Controller Subsystem
    Qualified (QDID 58852); Compliant up to the HCI
    Layer
  • Highly Optimized for Low-Cost Designs:
    • Single-Ended 50-Ω RF Interface
    • Package Footprint: 76 Terminals, 0.6-mm Pitch,
      8-mm x 8-mm mrQFN
  • BR/EDR Features Include:
    • Up to 7 Active Devices
    • Scatternet: Up to 3 Piconets Simultaneously, 1
      as Master and 2 as Slaves
    • Up to 2 SCO Links on the Same Piconet
    • Support for All Voice Air-Coding – Continuously
      Variable Slope Delta (CVSD), A-Law, µ-Law,
      and Transparent (Uncoded)
    • CC2560B/CC2564B Devices Provide an
      Assisted Mode for HFP 1.6 Wideband Speech
      (WBS) Profile or A2DP Profile to Reduce Host
      Processing and Power
    • Support of Multiple Bluetooth Profiles With
      Enhanced QoS
  • LE Features Include:
    • Support of Up to 10 (CC2564B) Connections
    • Multiple Sniff Instances Tightly Coupled to
      Achieve Minimum Power Consumption
    • Independent Buffering for LE Allows Large
      Numbers of Multiple Connections Without
      Affecting BR/EDR Performance.
    • Built-In Coexistence and Prioritization Handling
      for BR/EDR and LE
  • Best-in-Class Bluetooth (RF) Performance
    (TX Power, RX Sensitivity, Blocking)
    • Class 1 TX Power Up to +10 dBm
    • –95 dbm Typical RX Sensitivity
    • Internal Temperature Detection and
      Compensation to Ensure Minimal Variation in
      RF Performance Over Temperature, No
      External Calibration Required
    • Improved Adaptive Frequency Hopping (AFH)
      Algorithm With Minimum Adaptation Time
    • Provides Longer Range, Including 2x Range
      Over Other LE-Only Solutions
  • Advanced Power Management for Extended
    Battery Life and Ease of Design
    • On-Chip Power Management, Including Direct
      Connection to Battery
    • Low Power Consumption for Active, Standby,
      and Scan Bluetooth Modes
    • Shutdown and Sleep Modes to Minimize Power
      Consumption
  • Physical Interfaces:
    • UART Interface With Support for Maximum
      Bluetooth Data Rates
      • UART Transport Layer (H4) With Maximum
        Rate of 4 Mbps
      • Three-Wire UART Transport Layer (H5) With
        Maximum Rate of 4 Mbps (CC2560B and
        CC2564B Only)
    • Fully Programmable Digital PCM-I2S Codec
      Interface
  • Flexibility for Easy Stack Integration and Validation
    Into Various Microcontrollers, Such as MSP430™
    and ARM® Cortex®-M3 and Cortex®-M4 MCUs
  • CC256x Bluetooth Hardware Evaluation Tool: PC-
    Based Application to Evaluate RF Performance of
    the Device and Configure Service Pack
  • Device Pin-to-Pin Compatible With Previous
    Devices or Modules
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Description

The TI CC256x device is a complete Bluetooth BR/EDR/LE HCI solution that reduces design effort and enables fast time to market. Based on TI’s seventh-generation Bluetooth core, the CC256x device provides a product-proven solution that is Bluetooth 4.1 compliant. When coupled with a microcontroller unit (MCU), this HCI device offers best-in-class RF performance with a range of about 2X compared to other Bluetooth LE-only solutions. Furthermore, TI’s power-management hardware and software algorithms provide significant power savings in all commonly used Bluetooth BR/EDR/LE modes of operation.

The TI Dual-Mode Bluetooth Stack software is certified and provided royalty free for TI’s MSP430 and ARM Cortex-M3 and Cortex-M4 MCUs. Other MPUs can be supported through TI’s third party. iPod® (MFi) protocol is supported by add-on software packages. For more information, see TI Dual-Mode Bluetooth Stack. Some of the profiles supported include the following:

  • Serial port profile (SPP)
  • Advanced audio distribution profile (A2DP)
  • Audio/video remote control profile (AVRCP)
  • Handsfree profile (HFP)
  • Human interface device (HID)
  • Generic attribute profile (GATT)
  • Several Bluetooth LE profiles and services

In addition to software, this solution consists of multiple reference designs with a low BOM cost, including a new Bluetooth audio sink reference design for customers to create a variety of applications for low-end, low-power audio solutions.

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Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 28
Type Title Date
* Datasheet CC256x Dual-Mode Bluetooth Controller datasheet (Rev. E) Mar. 12, 2014
Selection guides CC256x Getting Started Guide (Rev. B) Jun. 26, 2020
Application notes Bluetooth Basic Rate/Enhanced Data Rate – Bluetooth Impersonation AttackS (BIAS) May 18, 2020
Application notes Bluetooth Low Energy, Basic Rate/Enhanced Data Rate – Method Confusion Pairing V May 18, 2020
Application notes CE Regulations for SRDs Operating in License-Free 2.4GHz/5GHz Bands-WiFi Devices Apr. 15, 2020
Application notes Capturing Bluetooth Host Controller Interface (HCI) Logs Jan. 07, 2019
Application notes CC2564 HFP/HID/SPP Integration Demonstration Nov. 20, 2018
White papers Wireless Connectivity For The Internet of Things, One Size Does Not Fit All (Rev. A) Oct. 16, 2017
White papers Which TI Bluetooth® solution should I choose? May 05, 2017
White papers White Paper: Why Classic Bluetooth® (BR/EDR)? May 04, 2017
Technical articles Introducing TI’s dual-mode Bluetooth® 4.2 CC2564C solution Dec. 13, 2016
Application notes CC256XQFN PCB Guidelines (Rev. B) Oct. 28, 2016
User guides CC256x Hardware Design Checklist (Rev. A) Oct. 28, 2016
Technical articles Driving industrial markets with TI’s dual-mode Bluetooth® module May 05, 2016
Technical articles What’s new with TI Bluetooth low energy? See it all at Bluetooth World 2016 Mar. 10, 2016
Technical articles The dual-mode Bluetooth® module you’ve been waiting for is here Feb. 17, 2016
More literature Dual-mode Bluetooth CC256x solutions (Rev. C) Feb. 03, 2016
User guides Dual-Mode Bluetooth CC2564 Evaluation Board User Guide Dec. 28, 2015
User guides Dual-Mode Bluetooth CC2564 Evaluation Board Quick Start Guide Oct. 01, 2015
White papers Understanding Wireless Connectivity in the Industrial IoT Jul. 22, 2015
User guides Dual-Mode Bluetooth CC2564 Module With Integrated Antenna Evaluation Board Jul. 07, 2015
User guides CC2564MODA Evaluation Board Quick Start Guide Jul. 01, 2015
User guides CC256x QFN EM User Guide Wiki Jun. 16, 2015
White papers Three Flavors of Bluetooth: Which One to Choose? Mar. 25, 2014
More literature TI: The IoT technology leader Nov. 01, 2013
More literature The Evolution of the Internet of Things Sep. 09, 2013
Application notes DN035 -- Antenna Quick Guide (Rev. A) Feb. 12, 2013
Application notes AN058 -- Antenna Selection Guide (Rev. B) Oct. 06, 2010

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
20
Description

The BOOST-CC2564MODA BoosterPack™ plug-in module is intended for evaluation and design purposes of the dual-mode Bluetooth® CC2564 module with integrated antenna (CC2564MODA).  The CC2564MODA module is based on TI's dual-mode Bluetooth® CC2564B Controller, which reduces design (...)

Features
  • Dual-mode (Bluetooth & Bluetooth low energy) Bluetooth Specification v4.1

  • Integrated antenna on CC2564MODA  for ready to use application

  • FCC, IC, CE certified with a certified and royalty-free TI Bluetooth stack, getting started guide, demos, and UART and PCM/I2S Interface

  • Class 1.5 Transmit Power (...)

EVALUATION BOARDS Download
document-generic User guide
59
Description

The Bluetooth and MSP430 Audio Source reference design can be used by customers to create a variety of applications for low-end, low-power audio source solutions for applications including toys, projectors, smart remotes and any audio streaming accessories. This reference design is a cost-effective (...)

Features
  • Enables Bluetooth audio (SBC encode/decode) with low cost, low power MSP430F5229
  • Design offloads audio processing from MCU to the Bluetooth device which enables low power audio
  • Cost-effective low end wireless audio solution with a four layer layout and QFN packages
  • Core of the solution is TI's (...)
EVALUATION BOARDS Download
document-generic User guide
19.99
Description

The CC2564MODAEM evaluation board contains the Bluetooth BR/EDR/LE HCI solution. Based on TI's CC2564B dual-mode Bluetooth single-chip device, the bCC2564MODA is intended for evaluation and design purposes, reducing design effort and enabling fast time to market.


For a complete evaluation solution (...)

Features
  • Dual-mode (Bluetooth & Bluetooth low energy ) Bluetooth Specification v4.1
  • Integrated antenna on CC2564MODA for ready-to-use application
  • The device is FCC, IC, CE certified with a certified and royalty-free TI Bluetooth Stack, getting started guide, demos, and UART and PCM/I2S Interface
  • Class 1.5 (...)
EVALUATION BOARDS Download
document-generic User guide
19.99
Description

The CC2564MODNEM evaluation board contains the CC2564MODN device and is intended for evaluation and design purposes.

For a complete evaluation solution, the CC2564MODNEM board plugs directly into our hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X and kits for our other (...)

Features
  • CC2564MODN device in the QFM (MOE) package
  • Bluetooth Specification v4.1
  • Dual mode: Bluetooth and Bluetooth Low Energy
  • FCC, IC, CE certified
  • Class 1.5 Transmit Power (10 dBm)
  • High sensitivity (-93 dBm typical)
  • UART interface: control and data
  • PCM/I2S interface: voice and audio
  • 4-layer PCB design
  • 1.8-V LDO (...)
EVALUATION BOARDS Download
document-generic User guide
59
Description

The CC256XQFNEM evaluation board contains the CC2564B device and is intended for evaluation and design purposes for the CC256x devices.

For a complete evaluation solution, the CC256XQFNEM board plugs directly into the TI hardware development kits: MSP-EXP430F5529, MSP-EXP430F5438, DK-TM4C129X and (...)

Features
  • CC2564B device (QFN package)
  • Bluetooth Specification v4.1
  • Dual Mode - Bluetooth & Bluetooth low energy
  • FCC, IC, CE certified
  • Class 1.5 Transmit Power (+12dBm)
  • High sensitivity (-93 dBm typ.)
  • UART Interface - Control and Data
  • PCM/I2S Interface - Voice and Audio
  • 4 Layer PCB design
  • 1.8 LDO (LP2985-18)
  • 3 Voltage (...)
EVALUATION BOARDS Download
document-generic User guide
24.99
Description

Powered by hardware encryption accelerator-enabled MCUs, the  Crypto Connected LaunchPad enables you to develop high performance, data protected, connected IoT applications from secure cloud connection, building/factory automation and smart grid to industrial controls.

The TM4C129E Crypto Connected (...)

Features
  • High performance TM4C129ENCPDT MCU:
    • 120MHz 32-bit ARM® Cortex®-M4-based microcontrollers CPU with floating point
    • 1MB Flash, 256KB SRAM, 6KB EEPROM
    • Crypto acceleration hardware
    • Integrated 10/100 Ethernet MAC+PHY, 8x 32-bit timers
    • Dual 12-bit 2MSPS ADCs, motion control PWMs
    • USB H/D/O, and many additional (...)
EVALUATION BOARDS Download
document-generic User guide
175
Description
Get Software

The MSP430F5438 Experimenter Board (MSP-EXP430F5438) is a microcontroller development for highly integrated, high performance MSP430F5438 MCUs. It features a 100-pin socket which supports the MSP430F5438A  and other devices with similar pinout. The socket allows for quick upgrades (...)

Features
  • 100-pin socket for MSP430F5438A MCU:
    • Digital I/O Pins: 34
    • Accessible analog inputs (12-bit ADC): 5
    • PWM outputs: 12
    • Flash Memory (MSP430F5438): 256KB
    • RAM (MSP430F5438): 16KB
    • Clock Speed (MSP430F5438): 18MHz
    • Communication (MSP430F5438) 
      • 4x UART/LIN/IrDA/SPI
      • 4x I2C/SPI
  • Power Supply sources: USB, FET, 2x AA (...)
EVALUATION BOARDS Download
document-generic User guide
175
Description

Special Note:

The MSP430F5529 USB microcontroller development kit is not supported by the Mac or Linux versions of the Code Composer Studio™ Integrated Development Environment. If you want to work with these operating systems, we suggest you select one of the many MSP LaunchPads.  

The MSP430F5529 (...)

Features
  • Integrated MSP430F5529:
    • 128KB Flash / 8KB SRAM (10kB if USB is disabled)
    • Full-Speed USB 2.0
    • 16-Bit RISC Architecture up to 25-MHz
    • 3x Timer_A Blocks, 1x Timer_B Block
    • 2x USCI (UART/SPI/I2C) Blocks, 16Ch 12-Bit ADC12_A, 12Ch Comp_B, 63 I/Os
  • USB Development Platform
  • 5-pad capacitive touch strip (button or (...)
DEVELOPMENT KITS Download
document-generic User guide
199
Description

The TM4C129x Connected Development Kit is a versatile and feature-rich engineering platform that highlights the 120-MHz TM4C129XNCZAD IoT Enabled ARM Cortex-M4F based microcontroller, including an integrated 10/100 Ethernet MAC + PHY as well as many other key features.

Features

The IoT Enabled ARM Cortex-M4F MCU TM4C129X Connected Development Kit offers these features:

  • Color LCD interface
  • USB 2.0 OTG | Host | Device port
  • TI wireless EM connection
  • BoosterPack™ and BoosterPack XL interfaces
  • Quad SSI-supported 512-Mbit Flash memory
  • MicroSD slot
  • Expansion interface headers: MCU (...)
INTERFACE ADAPTERS Download
document-generic User guide
Description

TI's Dual-mode Bluetooth stack on STM32F4 MCUs software for Bluetooth + Bluetooth Low Energy enables the STM32 ARM Cortex M4 and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified for CC256XSTBTBLESW (QDID 69887 (...)

Features
  • Supports Dual-mode Bluetooth 4.0 - Bluetooth certified and royalty free
  • The Bluetooth stack is fully qualified (QDID 69887 and QDID 69886)
  • Fully Thread safe
  • Supports threaded (RTOS) and non-threaded (No OS) environment
  • Fully Documented API Interface
  • Works with any STM32F4 MCU
  • Sample Apps are available for (...)

Software development

SOFTWARE DEVELOPMENT KITS (SDK) Download
TI Dual-Mode Bluetooth® Stack
TIBLUETOOTHSTACK-SDK

TI’s dual-mode Bluetooth stack enables Bluetooth + Bluetooth Low Energy and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0/4.1/4.2 specification. The Bluetooth stack is fully Bluetooth Special Interest Group (SIG) qualified, certified and royalty-free (...)

Features
  • Supports Dual-mode Bluetooth 4.0/4.10 - Bluetooth certified and royalty free
  • 4.2 Low Energy Secure Connect supported
  • Fully SIG qualified
  • Protocols/Profiles can be selectively enabled/disabled
  • Fully Documented API Interface
  • Classic Profiles Available (varies between the different platforms, see specific (...)
DRIVERS & LIBRARIES Download
TI dual-mode Bluetooth® stack on TM4C MCUs
CC256XM4BTBLESW TI’s Dual-mode Bluetooth stack on TM4C MCUs software for Bluetooth + Bluetooth Low Energy enables the TM4C12x MCU and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849), provides (...)
Features
  • Supports Dual-mode Bluetooth 4.0 - Bluetooth certified and royaly free
  • The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849)
  • Fully Thread safe
  • Supports threaded (RTOS) and non-threaded (No OS) environment
  • Fully Documented API Interface
  • Works with any TM4C MCU with Flash >= 128KB
  • Sample Apps (...)
DRIVERS & LIBRARIES Download
TI Dual-mode Bluetooth Stack on MSP432 MCUs
CC256XMS432BTBLESW TI’s Dual-mode Bluetooth stack on MSP432 MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP432 MCU and is comprised of Single Mode and Dual-mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 69887 and QDID 69886), provides (...)
Features
  • Supports Dual-mode Bluetooth 4.0 - Bluetooth certified and royaly free
  • Bluetooth stack is fully qualified (QDID 69887 and QDID 69886)
  • Fully Thread safe
  • Sample apps are available for the MSP-EXP432P401R
  • Fully Documented API Interface
  • Supports CCS, IAR, KEIL IDE
  • DRIVERS & LIBRARIES Download
    TI Dual-mode Bluetooth® stack on MSP430™ MCUs
    CC256XMSPBTBLESW TI’s Dual-mode Bluetooth stack on MSP430™ MCUs software for Bluetooth + Bluetooth Low Energy enables the MSP430 MCU and is comprised of Single Mode and Dual Mode offerings implementing the Bluetooth 4.0 specification. The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849 (...)
    Features
    • Supports Dual-mode Bluetooth 4.0 - Bluetooth certified and royaly free
    • The Bluetooth stack is fully qualified (QDID 37180 and QDID 42849)
    • Fully Thread safe
    • Supports non-threaded (No OS) environment
    • Fully Documented API Interface
    • Works with any MSP430 MCU with Flash >= 128KB and RAM >= 8KB
    • Sample Apps are (...)

    Design tools & simulation

    CALCULATION TOOLS Download
    Third party wireless module search tool
    3P-WIRELESS-MODULES The third party wireless module search tool helps developers to identify products that meet their end equipment specifications and procure production ready wireless modules. The third party module vendors included in the search tool are independent third party companies with expertise in designing (...)
    Features
    • Modules listed are based on TI wireless technology supporting Wi-Fi®, Bluetooth®, Zigbee®, Sub-1 GHz, Sigfox, 2.4 GHz, multi-band connectivity and more
    • Modules integrate clocks, SPI flash and passive components
    • Listings included for hardware customization, software integration and cloud services
    • Listings (...)
    CALCULATION TOOLS Download
    CC256x Bluetooth Hardware Evaluation Tool
    SWRC256 The CC256x Bluetooth Hardware Evaluation Tool is a Texas Instruments (TI) tool which can be downloaded as a complete package from the TI web site. It is a very intuitive, user-friendly tool to evaluate TI's Bluetooth chips. More specifically, it is used to configure the BT chip's properties through (...)
    Features
    • Set device properties such as baud rate, sleep mode, XTAL support, etc.
    • RF performance testing
    • FCC certification testing
    • SIG certification testing
    DESIGN TOOLS Download
    Hardware design reviews for CC256x devices
    DUALMODE-BT-DESIGN-REVIEWS To get started with the dual-mode Bluetooth® hardware design review process:
    • Step 1: Before requesting a review, it is important that to review the technical documentation and design & development resources available on the corresponding product page (see CC256x product page links below).
    • Step 2 (...)
    document-generic User guide
    SCHEMATICS Download
    TIDC065.ZIP (2429 KB)
    CERTIFICATIONS Download
    Radio certification for Dual Mode Bluetooth
    CC256X-CERTIFICATION — Are you looking for CC256x module certification support? CC256x-CERTIFCATION provides the relevant information and support for successful certification of your product. Within this page you will find the latest certification reports of our Modules as well as our evaluation boards.
    Features
    • The CC256X-REPORTS link provides access to Dual mode BTcertification reports for:
      • CC256x modules
      • CC256x Evaluation boards (note: reports for evaluation boards are for reference only)
    • The CC256X-REQUEST link provides:
      • A TI letter of authorization for FCC and ISED when requested by the customer's regulatory (...)

    Reference designs

    REFERENCE DESIGNS Download
    Bluetooth and MSP430 Audio Sink Reference Design
    BT-MSPAUDSINK-RD TI's Bluetooth + MSP430 Audio sink reference design can be used by customers to create a variety of applications for low end, low power audio solutions. Some application possibilities - toys, low end bluetooth speakers, audio streaming accessories. This reference design is a cost effective audio (...)
    document-generic Schematic document-generic User guide
    REFERENCE DESIGNS Download
    CC256x Bluetooth® Reference Design
    CC256XEM-RD This CC256x Bluetooth® evaluation module reference design is an RF reference design with antenna which can be easily connected to many Microcontroller Units (MCUs), such as TI's MSP430 or Tiva C series MCUs. The reference design can be copied into your board, allowing for a cost-effective design (...)
    document-generic Schematic document-generic User guide
    REFERENCE DESIGNS Download
    Low Noise and Small Form Factor Power Management Reference Design for CC256X Bluetooth Controller
    TIDA-00598 The TIDA-00598 features a low noise and size optimized power management solution which regulates 5V to 3.3V and 1.8V required to operate the CC256X Bluetooth controller.  These regulated voltage rails can also be used to power other components in the system as microcontroller, level shifters (...)
    document-generic Schematic document-generic User guide
    REFERENCE DESIGNS Download
    Bluetooth and MSP MCU Audio Source Reference Design
    BT-MSPAUDSOURCE-RD The Bluetooth and low-power MSP microcontroller Audio Source reference design can be used by customers to create a variety of applications for low-end, low-power audio source solutions for applications including toys, projectors, smart remotes and any audio streaming accessories. This reference (...)
    document-generic Schematic document-generic User guide

    CAD/CAE symbols

    Package Pins Download
    VQFNP-MR (RVM) 76 View options

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