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TPSM53602

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36-V, 2-A step-down power module in small 5.5-mm x 5-mm x 4-mm RLF QFN package with simple footprint

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Product details

Parameters

Iout (Max) (A) 2 Vin (Min) (V) 3.8 Vin (Max) (V) 36 Vout (Min) (V) 1 Vout (Max) (V) 7 Soft start Fixed Features EMI Tested, Enable, Light Load Efficiency, Power Good Operating temperature range (C) -40 to 125 Iq (Typ) (mA) 0.024 Regulated outputs (#) 1 Switching frequency (Typ) (kHz) 1400 Duty cycle (Max) (%) 98 Topology Buck, Inverting Buck-Boost, Synchronous Buck open-in-new Find other Buck modules (integrated inductor)

Package | Pins | Size

B3QFN (RDA) 15 28 mm² 5 x 5 open-in-new Find other Buck modules (integrated inductor)

Features

  • 5-mm × 5.5-mm × 4-mm routable lead-frame (RLF) QFN package
    • 85-mm2 solution size (single sided)
    • Low EMI: Meets CISPR11 radiated emissions
    • Excellent thermal performance:
      Up to 14 W output power at 85ºC, no airflow
    • Standard footprint: single large thermal pad and all pins accessible from perimeter
  • 3.8 V to 36 V input voltage range
  • Output voltage range: 1 V to 7 V
  • Efficiency up to 95%
  • Power-good flag
  • Precision enable
  • Built-in hiccup-mode short-circuit protection, over-temperature protection, start-up into pre-bias output, soft start, and UVLO
  • Operating IC junction range: –40°C to +125°C
  • Operating ambient range: –40°C to +105°C
  • Shock and vibration tested to Mil-STD-883D
  • Pin compatible with: 3-A TPSM53603
    and 4-A TPSM53604
  • Create a custom design using the TPSM53602 with the WEBENCH® Power Designer

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open-in-new Find other Buck modules (integrated inductor)

Description

The TPSM53602 power module is a highly integrated 2-A power solution that combines a 36-V input, step-down, DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally-enhanced QFN package. The 5-mm x 5.5-mm x 4-mm, 15-pin QFN package uses routable lead-frame technology for enhanced thermal performance, small footprint, and low EMI. The package footprint has all pins accessible from the perimeter and a single large thermal pad for simple layout and easy handling in manufacturing.

The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process. The full feature set includes power good, programmable UVLO, prebias start-up, overcurrent, and overtemperature protections, making the TPSM53602 an excellent device for powering a wide range of applications.

open-in-new Find other Buck modules (integrated inductor)
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Technical documentation

= Top documentation for this product selected by TI
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Type Title Date
* Datasheet TPSM53602 36-V Input, 2-A Power Module in RLF QFN Package datasheet Dec. 01, 2019
Application notes Soldering Requirements for BQFN Packages (Rev. C) Mar. 05, 2020
User guides Using the TPSM53604EVM, TPSM53603EVM, and TPSM53602EVM (Rev. B) Dec. 13, 2019

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

EVALUATION BOARDS Download
document-generic User guide
49
Description
The TPSM53602 evaluation board (EVM) is configured to evaluate the operation of the TPSM53602 power module for current up to 2 A. The input voltage range is 3.8 V to 36 V. The output voltage range is 1 V to 7 V. The evaluation board makes it easy to evaluate the TPSM53602 operation.
Features
  • 3.8-V to 36-V input voltage range
  • Up to 2 A of output current
  • 1-V to 7-V output voltage
  • 5 mm x 5.5 mm QFN package

Design tools & simulation

SIMULATION TOOLS Download
PSpice® for TI design and simulation tool
PSPICE-FOR-TI — PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Features
  • Leverages Cadence PSpice Technology
  • Preinstalled library with a suite of digital models to enable worst-case timing analysis
  • Dynamic updates ensure you have access to most current device models
  • Optimized for simulation speed without loss of accuracy
  • Supports simultaneous analysis of multiple products
  • (...)

CAD/CAE symbols

Package Pins Download
B3QFN (RDA) 15 View options

Ordering & quality

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