DSLVDS1048
- Designed for Signal Rates up to 400 Mbps
- Flow-Through Pinout Simplifies PCB Layout
- 150-ps Channel-to-Channel Skew (Typical)
- 100-ps Differential Skew (Typical)
- 2.7-ns Maximum Propagation Delay
- 3.3-V Power Supply Design
- High Impedance LVDS Inputs on Power Down
- Low Power Design (40 mW at 3.3-V Static)
- Interoperable With Existing 5-V LVDS Drivers
- Accepts Small Swing (350 mV Typical) Differential Signal Levels
- Supports Input Failsafe
- Open, Short, and Terminated
- 0 V to −100 mV Threshold Region
- Operating Temperature Range: –40°C to +85°C
- Meets or Exceeds ANSI/TIA/EIA-644 Standard
- Available in TSSOP Package
The DSLVDS1048 device is a quad CMOS flow-through differential line receiver designed for applications requiring ultra-low power dissipation and high data rates. The device is designed to support data rates in excess of 400 Mbps (200 MHz) using Low Voltage Differential Signaling (LVDS) technology.
The DSLVDS1048 accepts low voltage (350 mV typical) differential input signals and translates them to 3-V CMOS output levels. The receiver supports a TRI-STATE function that may be used to multiplex outputs. The receiver also supports open, shorted, and terminated (100-Ω) input fail-safe. The receiver output is HIGH for all fail-safe conditions. The DSLVDS1048 has a flow-through pinout for easy PCB layout.
The EN and EN* inputs are ANDed together and control the TRI-STATE outputs. The enables are common to all four receivers. The DSLVDS1048 and companion LVDS line driver (for example, DSLVDS1047) provide a new alternative to high-power PECL/ECL devices for high-speed point-to-point interface applications.
技術文件
| 類型 | 標題 | 日期 | ||
|---|---|---|---|---|
| * | Data sheet | DSLVDS1048 3.3-V LVDS Quad Channel High-Speed Differential Line Receiver datasheet | PDF | HTML | 2018年 9月 27日 |
| Application note | Applications of Low-Voltage Differential Signaling (LVDS) in LED Walls | 2020年 10月 29日 | ||
| Application note | Applications of Low-Voltage Differential Signaling (LVDS) in Ultrasound Scanners | 2019年 6月 29日 | ||
| Application brief | LVDS to Improve EMC in Motor Drives | 2018年 9月 27日 | ||
| Application brief | How Far, How Fast Can You Operate LVDS Drivers and Receivers? | 2018年 8月 3日 | ||
| Application brief | How to Terminate LVDS Connections with DC and AC Coupling | 2018年 5月 16日 | ||
| Application note | An Overview of LVDS Technology | 1998年 10月 5日 |
設計與開發
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更快、更平價、更穩固：透過全新序列通訊技術在隔離中實現 200 Mbps 的傳輸量——快速序列介面 (FSI)
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FSI 轉接器電路板是一款評估板，可協助理解 C2000 FSI (...)
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在 PSpice for TI 設計與模擬工具中，您可以搜尋 TI (...)
TINA-TI — 基於 SPICE 的類比模擬程式
| 封裝 | 針腳 | CAD 符號、佔位空間與 3D 模型 |
|---|---|---|
| TSSOP (PW) | 16 | Ultra Librarian |
訂購與品質
- RoHS
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