JAJSS15 November   2023 LMK3H0102

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Interface Specification
  7. 6 Parameter Measurement Information
    1. 6.1 Output Format Configurations
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Block-Level Description
      2. 7.3.2 Device Configuration Control
      3. 7.3.3 OTP Mode
      4. 7.3.4 I2C Mode
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fail-Safe Inputs
      2. 7.4.2 Fractional Output Dividers
        1. 7.4.2.1 FOD Operation
        2. 7.4.2.2 Edge Combiner
        3. 7.4.2.3 Digital State Machine
        4. 7.4.2.4 Spread-Spectrum Clocking
        5. 7.4.2.5 Integer Boundary Spurs
      3. 7.4.3 Output Behavior
        1. 7.4.3.1 Output Format Selection
          1. 7.4.3.1.1 Output Format Types
            1. 7.4.3.1.1.1 LP-HCSL Termination
        2. 7.4.3.2 Output Slew Rate Control
        3. 7.4.3.3 REF_CTRL Operation
      4. 7.4.4 Output Enable
        1. 7.4.4.1 Output Enable Control
        2. 7.4.4.2 Output Enable Polarity
        3. 7.4.4.3 Output Disable Behavior
      5. 7.4.5 Device Default Settings
    5. 7.5 Programming
      1. 7.5.1 I2C Serial Interface
      2. 7.5.2 One-Time Programming Sequence
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Application Block Diagram Examples
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Example: Changing Output Frequency
      5. 8.2.5 Crosstalk
      6. 8.2.6 Application Curves
  10. 9 Power Supply Recommendations
    1. 9.1 Power-Up Sequencing
    2. 9.2 Decoupling Power Supply Inputs
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  13. 12Device Registers
    1. 12.1 Register Maps
      1. 12.1.1  R0 Register (Address = 0x0) [reset = 0x0861]
      2. 12.1.2  R1 Register (Address = 0x1) [reset = 0x5599]
      3. 12.1.3  R2 Register (Address = 0x2) [reset = 0xC28F]
      4. 12.1.4  R3 Register (Address = 0x3) [reset = 0x1801]
      5. 12.1.5  R4 Register (Address = 0x4) [reset = 0x0000]
      6. 12.1.6  R5 Register (Address = 0x5) [reset = 0x0000]
      7. 12.1.7  R6 Register (Address = 0x6) [reset = 0x2AA0]
      8. 12.1.8  R7 Register (Address = 0x7) [reset = 0x6503]
      9. 12.1.9  R8 Register (Address = 0x8) [reset = 0xC28F]
      10. 12.1.10 R9 Register (Address = 0x9) [reset = 0x0066]
      11. 12.1.11 R10 Register (Address = 0xA) [reset = 0x0010]
      12. 12.1.12 R11 Register (Address = 0xB) [reset = 0x0000]
      13. 12.1.13 R12 Register (Address = 0xC) [reset = 0xE800]
      14. 12.1.14 R27 Register (Address = 0x1B) [reset = 0x0000]
      15. 12.1.15 R28 Register (Address = 0x1C) [reset = 0x0000]
      16. 12.1.16 R32 Register (Address = 0x20) [reset = 0x0000]
      17. 12.1.17 R33 Register (Address = 0x21) [reset = 0x0000]
      18. 12.1.18 R146 Register (Address = 0x92) [reset = 0x0000]
      19. 12.1.19 R147 Register (Address = 0x93) [reset = 0x0000]
      20. 12.1.20 R148 Register (Address = 0x94) [reset = 0x0000]
      21. 12.1.21 R238 Register (Address = 0xEE) [reset = 0x0000]
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Option Addendum
    2. 14.2 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
  • RER|16
サーマルパッド・メカニカル・データ
発注情報

12.1.11 R10 Register (Address = 0xA) [reset = 0x0010]

R10 is shown in Table 12-23.

Return to the Summary Table.

Table 12-13 R10 Register Field Descriptions
Bit Field Type Reset Description
15 PUP_DTC_GAIN_CAL_EN R/W 0x0 Writing a '1' to this bit enables gain calibration on power up. This is recommended for applications where the clock frequencies differ from the default settings.
14:11 PROD_REVID R 0x0 Product revision identifier.
10 CLK_READY R 0x0 CLK_READY status. The REF_CTRL pin mirrors this status signal when the pin functions as a "clock ready" signal.
9 CRC_ERROR R 0x0 This bit indicates if there was a CRC error when programming the EFUSE of the device. If this bit is a '1', then an error has occurred. Outside of EFUSE programming, this bit can be ignored.
8 RB_PIN_15 R 0x0 Readback of the REF_CTRL pin.
7 RB_PIN_4 R 0x0 Readback of the OTP_SEL1/SDA pin.
6 RB_PIN_3 R 0x0 Readback of the OTP_SEL0/SCL pin.
5 RB_PIN_2 R 0x0 Readback of the FMT_ADDR pin.
4 DEV_IDLE_STATE_SEL R/W 0x1

This bit controls the behavior of the device when both outputs are disabled. Placing the device into a low-power state is not recommended for PCIe applications, as the time to re-enable the clocks is extended.

0h: When both outputs are disabled, the outputs are muted, and the device is placed into a low-power state.

1h: When both outputs are disabled, the outputs are muted. The device does not enter a low-power state.
3 Reserved R/W 0x0 Reserved. Only write '0' to this bit.
2 Reserved R/W 0x0 Reserved. Only write '0' to this bit.
1 PDN R/W 0x0

Writing a '1' to this bit forces a power down all analog logic blocks.
0 Reserved R/W 0x0 Reserved. Only write '0' to this bit.