JAJSS15 November   2023 LMK3H0102

ADVANCE INFORMATION  

  1.   1
  2. 1 特長
  3. 2 アプリケーション
  4. 3 概要
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 I2C Interface Specification
  7. 6 Parameter Measurement Information
    1. 6.1 Output Format Configurations
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Block-Level Description
      2. 7.3.2 Device Configuration Control
      3. 7.3.3 OTP Mode
      4. 7.3.4 I2C Mode
    4. 7.4 Device Functional Modes
      1. 7.4.1 Fail-Safe Inputs
      2. 7.4.2 Fractional Output Dividers
        1. 7.4.2.1 FOD Operation
        2. 7.4.2.2 Edge Combiner
        3. 7.4.2.3 Digital State Machine
        4. 7.4.2.4 Spread-Spectrum Clocking
        5. 7.4.2.5 Integer Boundary Spurs
      3. 7.4.3 Output Behavior
        1. 7.4.3.1 Output Format Selection
          1. 7.4.3.1.1 Output Format Types
            1. 7.4.3.1.1.1 LP-HCSL Termination
        2. 7.4.3.2 Output Slew Rate Control
        3. 7.4.3.3 REF_CTRL Operation
      4. 7.4.4 Output Enable
        1. 7.4.4.1 Output Enable Control
        2. 7.4.4.2 Output Enable Polarity
        3. 7.4.4.3 Output Disable Behavior
      5. 7.4.5 Device Default Settings
    5. 7.5 Programming
      1. 7.5.1 I2C Serial Interface
      2. 7.5.2 One-Time Programming Sequence
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Application Block Diagram Examples
      2. 8.2.2 Design Requirements
      3. 8.2.3 Detailed Design Procedure
      4. 8.2.4 Example: Changing Output Frequency
      5. 8.2.5 Crosstalk
      6. 8.2.6 Application Curves
  10. 9 Power Supply Recommendations
    1. 9.1 Power-Up Sequencing
    2. 9.2 Decoupling Power Supply Inputs
  11. 10Layout
    1. 10.1 Layout Guidelines
    2. 10.2 Layout Example
  12. 11Device and Documentation Support
    1. 11.1 Documentation Support
      1. 11.1.1 Related Documentation
    2. 11.2 ドキュメントの更新通知を受け取る方法
    3. 11.3 サポート・リソース
    4. 11.4 Trademarks
    5. 11.5 静電気放電に関する注意事項
    6. 11.6 用語集
  13. 12Device Registers
    1. 12.1 Register Maps
      1. 12.1.1  R0 Register (Address = 0x0) [reset = 0x0861]
      2. 12.1.2  R1 Register (Address = 0x1) [reset = 0x5599]
      3. 12.1.3  R2 Register (Address = 0x2) [reset = 0xC28F]
      4. 12.1.4  R3 Register (Address = 0x3) [reset = 0x1801]
      5. 12.1.5  R4 Register (Address = 0x4) [reset = 0x0000]
      6. 12.1.6  R5 Register (Address = 0x5) [reset = 0x0000]
      7. 12.1.7  R6 Register (Address = 0x6) [reset = 0x2AA0]
      8. 12.1.8  R7 Register (Address = 0x7) [reset = 0x6503]
      9. 12.1.9  R8 Register (Address = 0x8) [reset = 0xC28F]
      10. 12.1.10 R9 Register (Address = 0x9) [reset = 0x0066]
      11. 12.1.11 R10 Register (Address = 0xA) [reset = 0x0010]
      12. 12.1.12 R11 Register (Address = 0xB) [reset = 0x0000]
      13. 12.1.13 R12 Register (Address = 0xC) [reset = 0xE800]
      14. 12.1.14 R27 Register (Address = 0x1B) [reset = 0x0000]
      15. 12.1.15 R28 Register (Address = 0x1C) [reset = 0x0000]
      16. 12.1.16 R32 Register (Address = 0x20) [reset = 0x0000]
      17. 12.1.17 R33 Register (Address = 0x21) [reset = 0x0000]
      18. 12.1.18 R146 Register (Address = 0x92) [reset = 0x0000]
      19. 12.1.19 R147 Register (Address = 0x93) [reset = 0x0000]
      20. 12.1.20 R148 Register (Address = 0x94) [reset = 0x0000]
      21. 12.1.21 R238 Register (Address = 0xEE) [reset = 0x0000]
  14. 13Revision History
  15. 14Mechanical, Packaging, and Orderable Information
    1. 14.1 Package Option Addendum
    2. 14.2 Tape and Reel Information

パッケージ・オプション

メカニカル・データ（パッケージ｜ピン）
  • RER|16
サーマルパッド・メカニカル・データ
発注情報

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VDD Device supply voltage –0.3 3.9 V
VDDO Output supply voltage –0.3 3.9 V
VIN Logic input voltage (VDD = VDDO = -0.3 to 3.9 V) –0.3 3.9 V
VOUT Voltage applied to OUTx_P and OUTx_N pins (when outputs are high or low) –0.3 VDDO_x + 0.3 V
Voltage applied to OUTx_P and OUTx_N pins (when outputs are LVCMOS tri-state) –0.3 1.89 V
Voltage applied to OUTx_P and OUTx_N pins (when outputs are LP-HCSL or LVDS tri-state) –0.3 1.5 V
TJ Junction temperature 105 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.