SBASAW9 December   2024 ADC168M102R-SEP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog
        1. 6.3.1.1 Analog Inputs
        2. 6.3.1.2 Analog-to-Digital Converters (ADCs)
        3. 6.3.1.3 CONVST
        4. 6.3.1.4 CLOCK
        5. 6.3.1.5 RESET
        6. 6.3.1.6 REFIOx
      2. 6.3.2 Digital
        1. 6.3.2.1 Mode Selection Pins M0 and M1
        2. 6.3.2.2 Half-Clock Mode (Default Mode After Power-Up and Reset)
        3. 6.3.2.3 Full-Clock Mode (Allowing Conversion and Data Readout Within 1µs, Supported In Dual Output Modes)
        4. 6.3.2.4 2-Bit Counter
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power-Down Modes and Reset
        1. 6.4.1.1 Power-Down Mode
        2. 6.4.1.2 Sleep Mode
        3. 6.4.1.3 Auto-Sleep Mode
        4. 6.4.1.4 Reset
    5. 6.5 Programming
      1. 6.5.1 Read Data Input (RD)
      2. 6.5.2 Serial Data Outputs (SDOx)
        1. 6.5.2.1 Mode I
        2. 6.5.2.2 Mode II (Half-Clock Mode Only)
        3. 6.5.2.3 Special Read Mode II (Half-Clock Mode Only)
        4. 6.5.2.4 Mode III
        5. 6.5.2.5 Fully Differential Mode IV (Half-Clock Mode Only)
        6. 6.5.2.6 Special Mode IV (Half-Clock Mode Only)
      3. 6.5.3 Programming the Reference DAC
  8. 7 Register Map
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Grounding
        2. 8.4.1.2 Digital Interface
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Electrostatic Discharge Caution
    3. 9.3 Glossary
    4. 9.4 Trademarks
    5. 9.5 Receiving Notification of Documentation Updates
    6. 9.6 Support Resources
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.4.1 Layout Guidelines

For optimum performance, consider the physical layout of the ADC168M102R-SEP circuitry, particularly if the device is used at the maximum throughput rate. In this case, use a fixed phase relationship between CLOCK and CONVST.

Additionally, the high-performance SAR architecture is sensitive to glitches or sudden changes that occur just before latching the output of the internal analog comparator. The power supply, reference, ground connections, and digital inputs are potential sources of such interruptions. Therefore, when operating an n-bit SAR converter, there are n windows where large external transient voltages (glitches) potentially affect the conversion result. Such glitches originate from switching power supplies, nearby digital logic, or high-power devices. The degree of impact depends on the reference voltage, layout, and the actual timing of the external event.

With this possibility in mind, make sure power to the device is clean and well-bypassed. Place a 1µF ceramic bypass capacitor at each supply pin (connected to the corresponding ground pin) as close to the device as possible.

If the reference voltage is external, make sure the operational amplifier is able to drive the 22µF capacitor without oscillation. A series resistor between the driver output and the capacitor is potentially required. To minimize any code-dependent voltage drop on this path, use a small value for this resistor (10Ω max). TI's REF50xx family is able to directly drive such a capacitive load.