SBASAW9 December   2024 ADC168M102R-SEP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Analog
        1. 6.3.1.1 Analog Inputs
        2. 6.3.1.2 Analog-to-Digital Converters (ADCs)
        3. 6.3.1.3 CONVST
        4. 6.3.1.4 CLOCK
        5. 6.3.1.5 RESET
        6. 6.3.1.6 REFIOx
      2. 6.3.2 Digital
        1. 6.3.2.1 Mode Selection Pins M0 and M1
        2. 6.3.2.2 Half-Clock Mode (Default Mode After Power-Up and Reset)
        3. 6.3.2.3 Full-Clock Mode (Allowing Conversion and Data Readout Within 1µs, Supported In Dual Output Modes)
        4. 6.3.2.4 2-Bit Counter
    4. 6.4 Device Functional Modes
      1. 6.4.1 Power-Down Modes and Reset
        1. 6.4.1.1 Power-Down Mode
        2. 6.4.1.2 Sleep Mode
        3. 6.4.1.3 Auto-Sleep Mode
        4. 6.4.1.4 Reset
    5. 6.5 Programming
      1. 6.5.1 Read Data Input (RD)
      2. 6.5.2 Serial Data Outputs (SDOx)
        1. 6.5.2.1 Mode I
        2. 6.5.2.2 Mode II (Half-Clock Mode Only)
        3. 6.5.2.3 Special Read Mode II (Half-Clock Mode Only)
        4. 6.5.2.4 Mode III
        5. 6.5.2.5 Fully Differential Mode IV (Half-Clock Mode Only)
        6. 6.5.2.6 Special Mode IV (Half-Clock Mode Only)
      3. 6.5.3 Programming the Reference DAC
  8. 7 Register Map
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
        1. 8.4.1.1 Grounding
        2. 8.4.1.2 Digital Interface
      2. 8.4.2 Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Electrostatic Discharge Caution
    3. 9.3 Glossary
    4. 9.4 Trademarks
    5. 9.5 Receiving Notification of Documentation Updates
    6. 9.6 Support Resources
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

5.1 Absolute Maximum Ratings

over operating ambient temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Supply voltage, AVDD to AGND or DVDD to DGND –0.3 6 V
Supply voltage, DVDD to AVDD –0.3 1.2 x AVDD(2) V
Analog and reference input voltage with respect to AGND AGND – 0.3 AVDD + 0.3 V
Digital input voltage with respect to DGND DGND – 0.3 DVDD + 0.3 V
Ground voltage difference, AGND – DGND –0.3 0.3 V
Input current to any pin except supply pins –10 10 mA
Junction temperature, TJ 150 °C
Storage temperature, Tstg –65 150 °C
(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions. If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.
(2) Exceeding the specified limit causes an increase of the DVDD leakage current and leads to malfunction of the device.