SLASFM1A June   2025  – December 2025 AFE10004-EP

PRODUCTION DATA  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Digital-to-Analog Converter (DAC) Overview
        1. 6.3.1.1 DAC Resistor String
        2. 6.3.1.2 DAC Register Structure
        3. 6.3.1.3 DAC Buffer Amplifier
      2. 6.3.2 Output Switch Overview
      3. 6.3.3 Temperature Sensors
        1. 6.3.3.1 Temperature Data Format
          1. 6.3.3.1.1 Standard Binary-to-Decimal Temperature Data Calculation Example
          2. 6.3.3.1.2 Standard Decimal-to-Binary Temperature Data Calculation Example
        2. 6.3.3.2 Temperature Sensor Conversion Rate
        3. 6.3.3.3 Remote Temperature Sensor
          1. 6.3.3.3.1 Series Resistance Cancellation
          2. 6.3.3.3.2 Differential Input Capacitance
          3. 6.3.3.3.3 Filtering
          4. 6.3.3.3.4 Sensor Fault
          5. 6.3.3.3.5 η-Factor Correction
          6. 6.3.3.3.6 Remote Temperature Offset Register
        4. 6.3.3.4 Temperature Sensor Alarm Functions
      4. 6.3.4 Look-Up Table (LUT) and Arithmetic-Logic Unit (ALU)
        1. 6.3.4.1 LUT and ALU Organization
        2. 6.3.4.2 LUT Coefficient to Register Mapping
        3. 6.3.4.3 LUT Input and Output Ranges
      5. 6.3.5 Memory
        1. 6.3.5.1 Operating Memory Page Storage
        2. 6.3.5.2 EEPROM Storage
          1. 6.3.5.2.1 EEPROM Integrity Check
      6. 6.3.6 Device Sequence Control
        1. 6.3.6.1 Depletion-Mode Field-Effect Transistor (FET) Bias Requirements
        2. 6.3.6.2 Sequence Control
          1. 6.3.6.2.1 Start-Up Sequence
          2. 6.3.6.2.2 Power-Down Sequence
          3. 6.3.6.2.3 Alarm Event
    4. 6.4 Device Functional Modes
      1. 6.4.1 Autonomous Operating Mode
      2. 6.4.2 Manual Operating Mode
        1. 6.4.2.1 DAC Input Overwrite
        2. 6.4.2.2 Temperature Sensor Overwrite
        3. 6.4.2.3 ALU Bypass
      3. 6.4.3 Interrupt Mode
    5. 6.5 Programming
      1. 6.5.1 I2C Serial Interface
        1. 6.5.1.1 I2C Bus Overview
        2. 6.5.1.2 I2C Bus Definitions
        3. 6.5.1.3 I2C Target Address Selection
        4. 6.5.1.4 I2C Read and Write Operations
        5. 6.5.1.5 I2C Timeout Function
        6. 6.5.1.6 I2C General-Call Reset
      2. 6.5.2 Serial Peripheral Interface (SPI)
        1. 6.5.2.1 SPI Bus Overview
        2. 6.5.2.2 SPI Frame Error Check
  8. 7 Register Maps
    1. 7.1 I2C Register Maps
    2. 7.2 SPI Register Maps
    3. 7.3 Registers
      1. 7.3.1 I2C Registers
        1. 7.3.1.1 I2C Page 1: Device Configuration Register Information
          1. 7.3.1.1.1  Local Temperature High Byte Register (offset = 00h) [reset = N/A]
          2. 7.3.1.1.2  Local Temperature Low Byte Register (offset = 01h) [reset = N/A]
          3. 7.3.1.1.3  Remote Temperature High Byte Register (offset = 02h) [reset = N/A]
          4. 7.3.1.1.4  Remote Temperature Low Byte Register (offset = 03h) [reset = N/A]
          5. 7.3.1.1.5  Temperature Status Register (offset = 04h) [reset = N/A]
          6. 7.3.1.1.6  AMC Status Register (offset = 05h) [reset = N/A]
          7. 7.3.1.1.7  Software Reset Register (offset = 07h) [reset = 00h]
          8. 7.3.1.1.8  Configuration 1 Register (offset = 08h) [reset = 01h]
          9. 7.3.1.1.9  Configuration 2 Register (offset = 09h) [reset = 08h]
          10. 7.3.1.1.10 LUT Configuration Register (offset = 0Ah) [reset = 03h]
          11. 7.3.1.1.11 DAC Overwrite Enable Register (offset = 0Bh) [reset = 00h]
          12. 7.3.1.1.12 Drive Enable Register (offset: 0Ch) [reset = 00h]
          13. 7.3.1.1.13 Drive Enable Select Register (offset: 0Dh) [reset = 00h]
          14. 7.3.1.1.14 Alarm Configuration Register (offset: 0Eh) [reset = 4Fh]
          15. 7.3.1.1.15 Interrupt Mode Register (offset = 0Fh) [reset = 00h]
          16. 7.3.1.1.16 Local Temperature High Limit Register (offset = 10h) [reset = 7Fh]
          17. 7.3.1.1.17 Local Temperature Low Limit Register (offset = 11h) [reset = 80h]
          18. 7.3.1.1.18 Remote Temperature High Limit High Byte Register (offset = 12h) [reset = 7Fh]
          19. 7.3.1.1.19 Remote Temperature High Limit Low Byte Register (offset = 13h) [reset = F0h]
          20. 7.3.1.1.20 Remote Temperature Low Limit High Byte Register (offset = 14h) [reset = 80h]
          21. 7.3.1.1.21 Remote Temperature Low Limit Low Byte Register (offset = 15h) [reset = 00h]
          22. 7.3.1.1.22 Remote Temperature Offset High Byte Register (offset = 16h) [reset = 00h]
          23. 7.3.1.1.23 Remote Temperature Offset Low Byte Register (offset = 17h) [reset = 00h]
          24. 7.3.1.1.24 THERM Hysteresis Register (offset = 1Ah) [reset = 0Ah]
          25. 7.3.1.1.25 Consecutive ALERT Register (offset = 1Bh) [reset = 01h]
          26. 7.3.1.1.26 η-Factor Correction Register (offset = 1Ch) [reset = 00h]
          27. 7.3.1.1.27 Digital Filter Control Register (offset = 1Dh) [reset = 00h]
          28. 7.3.1.1.28 Version ID Register (offset = 1Eh) [reset = 00h]
          29. 7.3.1.1.29 Device ID Register (offset = 1Fh) [reset = A3h]
          30. 7.3.1.1.30 Temperature Overwrite High Byte Register (offset = 22h) [reset = 00h]
          31. 7.3.1.1.31 Temperature Overwrite Low Byte Register (offset = 23h) [reset = 00h]
          32. 7.3.1.1.32 Reset Status Register (offset = 24h) [reset = N/A]
          33. 7.3.1.1.33 One-Shot Temperature Register (offset = 28h) [reset = 00h]
          34. 7.3.1.1.34 Software Alarm Register (offset = 2Ah) [reset = 00h]
        2. 7.3.1.2 I2C Page 2: DAC Configuration Register Information
          1. 7.3.1.2.1  DAC0 Input Data Register (offset = 00h - 01h) [reset = 00h]
          2. 7.3.1.2.2  DAC1 Input Data Register (offset = 02h - 03h) [reset = 00h]
          3. 7.3.1.2.3  DAC2 Input Data Register (offset = 04h - 05h) [reset = 00h]
          4. 7.3.1.2.4  DAC3 Input Data Register (offset = 06h - 07h) [reset = 00h]
          5. 7.3.1.2.5  DAC0 Overwrite Register (offset = 08h - 09h) [reset = 00h]
          6. 7.3.1.2.6  DAC1 Overwrite Register (offset = 0Ah - 0Bh) [reset = 00h]
          7. 7.3.1.2.7  DAC2 Overwrite Register (offset = 0Ch - 0Dh) [reset = 00h]
          8. 7.3.1.2.8  DAC3 Overwrite Register (offset = 0Eh - 0Fh) [reset = 00h]
          9. 7.3.1.2.9  CLAMP1 Overwrite Register (offset: 10h - 11h) [reset = 00h]
          10. 7.3.1.2.10 CLAMP2 Overwrite Register (offset: 12h - 13h) [reset = 00h]
          11. 7.3.1.2.11 CLAMP1 Input Data Register (offset: 18h - 19h) [reset = 00h]
          12. 7.3.1.2.12 CLAMP2 Input Data Register (offset: 1Ah - 1Bh) [reset = 00h]
          13. 7.3.1.2.13 DAC0 LUT Data Register (offset = 20h - 21h) [reset = 00h]
          14. 7.3.1.2.14 DAC1 LUT Data Register (offset = 22h - 23h) [reset = 00h]
          15. 7.3.1.2.15 DAC2 LUT Data Register (offset = 24h - 25h) [reset = 00h]
          16. 7.3.1.2.16 DAC3 LUT Data Register (offset = 26h - 27h) [reset = 00h]
          17. 7.3.1.2.17 Broadcast Register (offset = 30h - 31h) [reset = 00h]
        3. 7.3.1.3 I2C Page 4: LUT0 and LUT1 Configuration Register Information
          1. 7.3.1.3.1 DELTA HAMM Registers (offset = 00h - 63h) [reset = 00h (even addresses), FFh (odd addresses)]
          2. 7.3.1.3.2 DAC0 BASE HAMM Registers (offset = 64h - 67h) [reset = 00h]
          3. 7.3.1.3.3 DAC1 BASE HAMM Registers (offset = 68h - 6Bh) [reset = 00h]
        4. 7.3.1.4 I2C Page 5: LUT2 and LUT3 Configuration Register Information
          1. 7.3.1.4.1 DELTA HAMM Registers (offset = 00h - 63h) [reset = 00h (even addresses, FFh (odd addresses)]
          2. 7.3.1.4.2 DAC2 BASE HAMM Registers (offset = 64h - 67h) [reset = 00h]
          3. 7.3.1.4.3 DAC3 BASE HAMM Registers (offset = 68h - 6Bh) [reset = 00h]
        5. 7.3.1.5 I2C Page 15: Notepad Register Information
          1. 7.3.1.5.1 Notepad Registers (offset = 00h to 13h) [reset = 00h]
          2. 7.3.1.5.2 EEPROM Burn Register (offset = 7Ch) [reset = 00h]
      2. 7.3.2 SPI Registers
        1. 7.3.2.1 SPI Page 1: Device Configuration Register Information
          1. 7.3.2.1.1  Local Temperature Register (offset = 00h) [reset = N/A]
          2. 7.3.2.1.2  Remote Temperature Register (offset = 02h) [reset = N/A]
          3. 7.3.2.1.3  Status Register (offset = 04h) [reset = N/A]
          4. 7.3.2.1.4  Software Reset Register (offset = 06h) [reset = 0000h]
          5. 7.3.2.1.5  Configuration Register (offset = 08h) [reset = 0108h]
          6. 7.3.2.1.6  LUT/DAC Configuration Register (offset = 0Ah) [reset = 0300h]
          7. 7.3.2.1.7  Drive Enable Configuration Register (offset: 0Ch) [reset = 0000h]
          8. 7.3.2.1.8  Alarm Configuration Register (offset: 0Eh) [reset = 4F00h]
          9. 7.3.2.1.9  Local Temperature Limit Register (offset = 10h) [reset = 7F80h]
          10. 7.3.2.1.10 Remote Temperature High Limit Register (offset = 12h) [reset = 7FF0h]
          11. 7.3.2.1.11 Remote Temperature Low Limit Register (offset = 14h) [reset = 8000h]
          12. 7.3.2.1.12 Remote Temperature Offset Register (offset = 16h) [reset = 0000h]
          13. 7.3.2.1.13 Temperature Configuration 1 Register (offset = 1Ah) [reset = 0A01h]
          14. 7.3.2.1.14 Temperature Configuration 2 Register (offset = 1Ch) [reset = 0000h]
          15. 7.3.2.1.15 Device ID Register (offset = 1Eh) [reset = 00A3h]
          16. 7.3.2.1.16 Temperature Overwrite Register (offset = 22h) [reset = 0000h]
          17. 7.3.2.1.17 Reset Status Register (offset = 24h) [reset = N/A]
          18. 7.3.2.1.18 One-Shot Temperature Register (offset = 28h) [reset = 0000h]
          19. 7.3.2.1.19 Software Alarm Register (offset = 2Ah) [reset = 0000h]
        2. 7.3.2.2 SPI Page 2: DAC Configuration Register Information
          1. 7.3.2.2.1  DAC0 Input Data Register (offset = 00h) [reset = 0000h]
          2. 7.3.2.2.2  DAC1 Input Data Register (offset = 02h) [reset = 0000h]
          3. 7.3.2.2.3  DAC2 Input Data Register (offset = 04h) [reset = 0000h]
          4. 7.3.2.2.4  DAC3 Input Data Register (offset = 06h) [reset = 0000h]
          5. 7.3.2.2.5  DAC0 Overwrite Register (offset = 08h) [reset = 0000h]
          6. 7.3.2.2.6  DAC1 Overwrite Register (offset = 0Ah) [reset = 0000h]
          7. 7.3.2.2.7  DAC2 Overwrite Register (offset = 0Ch) [reset = 0000h]
          8. 7.3.2.2.8  DAC3 Overwrite Register (offset = 0Eh) [reset = 0000h]
          9. 7.3.2.2.9  CLAMP1 Overwrite Register (offset: 10h) [reset = 0000h]
          10. 7.3.2.2.10 CLAMP2 Overwrite Register (offset: 12h) [reset = 0000h]
          11. 7.3.2.2.11 CLAMP1 Input Data Register (offset: 18h) [reset = 0000h]
          12. 7.3.2.2.12 CLAMP2 Input Data Register (offset: 1Ah) [reset = 0000h]
          13. 7.3.2.2.13 DAC0 LUT Data Register (offset = 20h) [reset = 0000h]
          14. 7.3.2.2.14 DAC1 LUT Data Register (offset = 22h) [reset = 0000h]
          15. 7.3.2.2.15 DAC2 LUT Data Register (offset = 24h) [reset = 0000h]
          16. 7.3.2.2.16 DAC3 LUT Data Register (offset = 26h) [reset = 0000h]
          17. 7.3.2.2.17 Broadcast Register (offset = 30h) [reset = 0000h]
        3. 7.3.2.3 SPI Page 4: LUT0 and LUT1 Configuration Register Information
          1. 7.3.2.3.1 DELTA Registers (offset = 00h - 62h) [reset = 00FFh]
          2. 7.3.2.3.2 DAC0 BASE Registers (offset = 64h - 66h) [reset = 0000h]
          3. 7.3.2.3.3 DAC1 BASE Registers (offset = 68h - 6Ah) [reset = 0000h]
        4. 7.3.2.4 SPI Page 5: LUT2 and LUT3 Configuration Register Information
          1. 7.3.2.4.1 DELTA Registers (offset = 00h - 62h) [reset = 00FFh]
          2. 7.3.2.4.2 DAC2 BASE Registers (offset = 64h - 66h) [reset = 0000h]
          3. 7.3.2.4.3 DAC3 BASE Registers (offset = 68h - 6Ah) [reset = 0000h]
        5. 7.3.2.5 SPI Page 15: Notepad Register Information
          1. 7.3.2.5.1 Notepad Registers (offset = 00h to 12h) [reset = 0000h]
          2. 7.3.2.5.2 EEPROM Burn Register (offset = 7Ch) [reset = 0000h]
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Switching Timing
    2. 8.2 Typical Applications
      1. 8.2.1 Temperature-Compensated Bias Generator for an LDMOS Power Amplifier (PA)
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Supply Voltage Selection
          2. 8.2.1.2.2 DAC Output Voltage Range
          3. 8.2.1.2.3 Temperature-Sensing Applications
          4. 8.2.1.2.4 PAVDD Isolation From the Power Amplifier
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Temperature-Compensated Bias Generator for a Gallium Nitride (GaN) Power Amplifier (PA)
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Supply Voltage Selection
          2. 8.2.2.2.2 DAC Output Voltage Range
        3. 8.2.2.3 Application Curves
    3. 8.3 Initialization Setup
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
        1. 8.5.2.1 Positive Output Range Layout Example
        2. 8.5.2.2 Negative Output Range Layout Example
  10. 9 Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

8.1.1 Output Switching Timing

The externally applied output capacitors allow for noise filtering, and enable fast switching on the output channels of the device. Large capacitors can be connected to the output of the static channels: DAC1, DAC2, CLAMP1, and CLAMP2. Capacitors of lower values can be connected to the dynamic channels, DAC0, DAC3, OUT1, and OUT2. This capacitor arrangement means that the larger capacitors can quickly charge the smaller capacitors instead of relying on the DAC output buffers.

Figure 8-1 shows a simplified model of switch arrangement for the OUT1 channel. The on-resistance of the switches are represented by RSW1 and RSW2.The on-resistance is specified for the channels in the Electrical Characteristics. The resistance primarily limits the settling time of VOUT1 after a switching event, as the settling time is essentially an RC function.

AFE10004-EP Switching TransientsFigure 8-1 Switching Transients

For example, consider the case where DRVEN1 changes from a low-state to a high-state. The steady-state of VOUT1 is equal to VCLAMP before the switch event. After the DRVEN1 goes high, SW2 closes, connecting COUT1 and CDAC1 to each other. As these capacitors are now in parallel, the voltages across each equalize to a new voltage. This voltage, described as VCDAC||COUT in the following equation, can be calculated by finding the charge stored in each capacitor. The total charge on the two capacitors in parallel is equal to the sum of the charge of each capacitor.

Equation 9. QCDACCOUT=QCDAC+QCOUT
Equation 10. VCDACCOUT(CDAC1+COUT1)=VDAC1×CDAC1+VOUT1×COUT1
Equation 11. VCDACCOUT=VDAC1×CDAC1+VOUT1×COUT1CDAC1+COUT1

The time required for the two output to equalize, described as the Capacitive Settling Period in Figure 8-2, is calculated using the equation below. As CLAMP1 is lower potential than DAC1, VOUT1 can be expressed as a charging function.

Equation 12. VOUT1(t)=(VCDACCOUT-VOUT1(t0))(1-e-tRSW1×COUT1)+VOUT1(t0)

During the capacitive settling period, VDAC1 is expressed as a discharging RC function.

Equation 13. VDAC1(t)=VDAC1(t0)-(VDAC1(t0)-VCDACCOUT)(1-e-tRSW1×COUT1)
AFE10004-EP Switching TimingFigure 8-2 Switching Timing

Connecting the capacitors together allows the output to change to VCDAC||COUT quickly, but after that period, the DAC output buffer continues to charge COUT1 to the VDAC1 value. The settling time for that final transition depends on the RC function formed by the series resistance on the DAC output, the switch resistance, and the capacitive load on the DAC. In addition, the output current of the DAC is limited.

Figure 8-3 and Figure 8-4 show the switching transients in the application with 10µF capacitors on the static channels and 100nF capacitors on the dynamic channels. Figure 8-5 shows the small-signal settling time of the OUT signal switching to the DAC output.

AFE10004-EP CLAMP-to-DAC Switch ResponseFigure 8-3 CLAMP-to-DAC Switch Response
AFE10004-EP CLAMP-to-DAC Small Transient Switch ResponseFigure 8-5 CLAMP-to-DAC Small Transient Switch Response
AFE10004-EP DAC-to-CLAMP Switch ResponseFigure 8-4 DAC-to-CLAMP Switch Response

Large capacitor values are potentially prohibitive in applications where small component size is required. This requirement results in capacitor selection where the capacitors on static channels are not orders-of-magnitude larger than the dynamic channels. For example, with 10nF and 1nF for the static and dynamic channels, respectively, the DAC settling capability dominates the charging time. Figure 8-6 shows the switch response for this case.

AFE10004-EP Low-Capacitance Switch ResponseFigure 8-6 Low-Capacitance Switch Response