SLASFM1A June   2025  – December 2025 AFE10004-EP

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Switching Characteristics
    8. 5.8 Timing Diagrams
    9. 5.9 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1 Digital-to-Analog Converter (DAC) Overview
        1. 6.3.1.1 DAC Resistor String
        2. 6.3.1.2 DAC Register Structure
        3. 6.3.1.3 DAC Buffer Amplifier
      2. 6.3.2 Output Switch Overview
      3. 6.3.3 Temperature Sensors
        1. 6.3.3.1 Temperature Data Format
          1. 6.3.3.1.1 Standard Binary-to-Decimal Temperature Data Calculation Example
          2. 6.3.3.1.2 Standard Decimal-to-Binary Temperature Data Calculation Example
        2. 6.3.3.2 Temperature Sensor Conversion Rate
        3. 6.3.3.3 Remote Temperature Sensor
          1. 6.3.3.3.1 Series Resistance Cancellation
          2. 6.3.3.3.2 Differential Input Capacitance
          3. 6.3.3.3.3 Filtering
          4. 6.3.3.3.4 Sensor Fault
          5. 6.3.3.3.5 η-Factor Correction
          6. 6.3.3.3.6 Remote Temperature Offset Register
        4. 6.3.3.4 Temperature Sensor Alarm Functions
      4. 6.3.4 Look-Up Table (LUT) and Arithmetic-Logic Unit (ALU)
        1. 6.3.4.1 LUT and ALU Organization
        2. 6.3.4.2 LUT Coefficient to Register Mapping
        3. 6.3.4.3 LUT Input and Output Ranges
      5. 6.3.5 Memory
        1. 6.3.5.1 Operating Memory Page Storage
        2. 6.3.5.2 EEPROM Storage
          1. 6.3.5.2.1 EEPROM Integrity Check
      6. 6.3.6 Device Sequence Control
        1. 6.3.6.1 Depletion-Mode Field-Effect Transistor (FET) Bias Requirements
        2. 6.3.6.2 Sequence Control
          1. 6.3.6.2.1 Start-Up Sequence
          2. 6.3.6.2.2 Power-Down Sequence
          3. 6.3.6.2.3 Alarm Event
    4. 6.4 Device Functional Modes
      1. 6.4.1 Autonomous Operating Mode
      2. 6.4.2 Manual Operating Mode
        1. 6.4.2.1 DAC Input Overwrite
        2. 6.4.2.2 Temperature Sensor Overwrite
        3. 6.4.2.3 ALU Bypass
      3. 6.4.3 Interrupt Mode
    5. 6.5 Programming
      1. 6.5.1 I2C Serial Interface
        1. 6.5.1.1 I2C Bus Overview
        2. 6.5.1.2 I2C Bus Definitions
        3. 6.5.1.3 I2C Target Address Selection
        4. 6.5.1.4 I2C Read and Write Operations
        5. 6.5.1.5 I2C Timeout Function
        6. 6.5.1.6 I2C General-Call Reset
      2. 6.5.2 Serial Peripheral Interface (SPI)
        1. 6.5.2.1 SPI Bus Overview
        2. 6.5.2.2 SPI Frame Error Check
  8. Register Maps
    1. 7.1 I2C Register Maps
    2. 7.2 SPI Register Maps
    3. 7.3 Registers
      1. 7.3.1 I2C Registers
        1. 7.3.1.1 I2C Page 1: Device Configuration Register Information
          1. 7.3.1.1.1  Local Temperature High Byte Register (offset = 00h) [reset = N/A]
          2. 7.3.1.1.2  Local Temperature Low Byte Register (offset = 01h) [reset = N/A]
          3. 7.3.1.1.3  Remote Temperature High Byte Register (offset = 02h) [reset = N/A]
          4. 7.3.1.1.4  Remote Temperature Low Byte Register (offset = 03h) [reset = N/A]
          5. 7.3.1.1.5  Temperature Status Register (offset = 04h) [reset = N/A]
          6. 7.3.1.1.6  AMC Status Register (offset = 05h) [reset = N/A]
          7. 7.3.1.1.7  Software Reset Register (offset = 07h) [reset = 00h]
          8. 7.3.1.1.8  Configuration 1 Register (offset = 08h) [reset = 01h]
          9. 7.3.1.1.9  Configuration 2 Register (offset = 09h) [reset = 08h]
          10. 7.3.1.1.10 LUT Configuration Register (offset = 0Ah) [reset = 03h]
          11. 7.3.1.1.11 DAC Overwrite Enable Register (offset = 0Bh) [reset = 00h]
          12. 7.3.1.1.12 Drive Enable Register (offset: 0Ch) [reset = 00h]
          13. 7.3.1.1.13 Drive Enable Select Register (offset: 0Dh) [reset = 00h]
          14. 7.3.1.1.14 Alarm Configuration Register (offset: 0Eh) [reset = 4Fh]
          15. 7.3.1.1.15 Interrupt Mode Register (offset = 0Fh) [reset = 00h]
          16. 7.3.1.1.16 Local Temperature High Limit Register (offset = 10h) [reset = 7Fh]
          17. 7.3.1.1.17 Local Temperature Low Limit Register (offset = 11h) [reset = 80h]
          18. 7.3.1.1.18 Remote Temperature High Limit High Byte Register (offset = 12h) [reset = 7Fh]
          19. 7.3.1.1.19 Remote Temperature High Limit Low Byte Register (offset = 13h) [reset = F0h]
          20. 7.3.1.1.20 Remote Temperature Low Limit High Byte Register (offset = 14h) [reset = 80h]
          21. 7.3.1.1.21 Remote Temperature Low Limit Low Byte Register (offset = 15h) [reset = 00h]
          22. 7.3.1.1.22 Remote Temperature Offset High Byte Register (offset = 16h) [reset = 00h]
          23. 7.3.1.1.23 Remote Temperature Offset Low Byte Register (offset = 17h) [reset = 00h]
          24. 7.3.1.1.24 THERM Hysteresis Register (offset = 1Ah) [reset = 0Ah]
          25. 7.3.1.1.25 Consecutive ALERT Register (offset = 1Bh) [reset = 01h]
          26. 7.3.1.1.26 η-Factor Correction Register (offset = 1Ch) [reset = 00h]
          27. 7.3.1.1.27 Digital Filter Control Register (offset = 1Dh) [reset = 00h]
          28. 7.3.1.1.28 Version ID Register (offset = 1Eh) [reset = 00h]
          29. 7.3.1.1.29 Device ID Register (offset = 1Fh) [reset = A3h]
          30. 7.3.1.1.30 Temperature Overwrite High Byte Register (offset = 22h) [reset = 00h]
          31. 7.3.1.1.31 Temperature Overwrite Low Byte Register (offset = 23h) [reset = 00h]
          32. 7.3.1.1.32 Reset Status Register (offset = 24h) [reset = N/A]
          33. 7.3.1.1.33 One-Shot Temperature Register (offset = 28h) [reset = 00h]
          34. 7.3.1.1.34 Software Alarm Register (offset = 2Ah) [reset = 00h]
        2. 7.3.1.2 I2C Page 2: DAC Configuration Register Information
          1. 7.3.1.2.1  DAC0 Input Data Register (offset = 00h - 01h) [reset = 00h]
          2. 7.3.1.2.2  DAC1 Input Data Register (offset = 02h - 03h) [reset = 00h]
          3. 7.3.1.2.3  DAC2 Input Data Register (offset = 04h - 05h) [reset = 00h]
          4. 7.3.1.2.4  DAC3 Input Data Register (offset = 06h - 07h) [reset = 00h]
          5. 7.3.1.2.5  DAC0 Overwrite Register (offset = 08h - 09h) [reset = 00h]
          6. 7.3.1.2.6  DAC1 Overwrite Register (offset = 0Ah - 0Bh) [reset = 00h]
          7. 7.3.1.2.7  DAC2 Overwrite Register (offset = 0Ch - 0Dh) [reset = 00h]
          8. 7.3.1.2.8  DAC3 Overwrite Register (offset = 0Eh - 0Fh) [reset = 00h]
          9. 7.3.1.2.9  CLAMP1 Overwrite Register (offset: 10h - 11h) [reset = 00h]
          10. 7.3.1.2.10 CLAMP2 Overwrite Register (offset: 12h - 13h) [reset = 00h]
          11. 7.3.1.2.11 CLAMP1 Input Data Register (offset: 18h - 19h) [reset = 00h]
          12. 7.3.1.2.12 CLAMP2 Input Data Register (offset: 1Ah - 1Bh) [reset = 00h]
          13. 7.3.1.2.13 DAC0 LUT Data Register (offset = 20h - 21h) [reset = 00h]
          14. 7.3.1.2.14 DAC1 LUT Data Register (offset = 22h - 23h) [reset = 00h]
          15. 7.3.1.2.15 DAC2 LUT Data Register (offset = 24h - 25h) [reset = 00h]
          16. 7.3.1.2.16 DAC3 LUT Data Register (offset = 26h - 27h) [reset = 00h]
          17. 7.3.1.2.17 Broadcast Register (offset = 30h - 31h) [reset = 00h]
        3. 7.3.1.3 I2C Page 4: LUT0 and LUT1 Configuration Register Information
          1. 7.3.1.3.1 DELTA HAMM Registers (offset = 00h - 63h) [reset = 00h (even addresses), FFh (odd addresses)]
          2. 7.3.1.3.2 DAC0 BASE HAMM Registers (offset = 64h - 67h) [reset = 00h]
          3. 7.3.1.3.3 DAC1 BASE HAMM Registers (offset = 68h - 6Bh) [reset = 00h]
        4. 7.3.1.4 I2C Page 5: LUT2 and LUT3 Configuration Register Information
          1. 7.3.1.4.1 DELTA HAMM Registers (offset = 00h - 63h) [reset = 00h (even addresses, FFh (odd addresses)]
          2. 7.3.1.4.2 DAC2 BASE HAMM Registers (offset = 64h - 67h) [reset = 00h]
          3. 7.3.1.4.3 DAC3 BASE HAMM Registers (offset = 68h - 6Bh) [reset = 00h]
        5. 7.3.1.5 I2C Page 15: Notepad Register Information
          1. 7.3.1.5.1 Notepad Registers (offset = 00h to 13h) [reset = 00h]
          2. 7.3.1.5.2 EEPROM Burn Register (offset = 7Ch) [reset = 00h]
      2. 7.3.2 SPI Registers
        1. 7.3.2.1 SPI Page 1: Device Configuration Register Information
          1. 7.3.2.1.1  Local Temperature Register (offset = 00h) [reset = N/A]
          2. 7.3.2.1.2  Remote Temperature Register (offset = 02h) [reset = N/A]
          3. 7.3.2.1.3  Status Register (offset = 04h) [reset = N/A]
          4. 7.3.2.1.4  Software Reset Register (offset = 06h) [reset = 0000h]
          5. 7.3.2.1.5  Configuration Register (offset = 08h) [reset = 0108h]
          6. 7.3.2.1.6  LUT/DAC Configuration Register (offset = 0Ah) [reset = 0300h]
          7. 7.3.2.1.7  Drive Enable Configuration Register (offset: 0Ch) [reset = 0000h]
          8. 7.3.2.1.8  Alarm Configuration Register (offset: 0Eh) [reset = 4F00h]
          9. 7.3.2.1.9  Local Temperature Limit Register (offset = 10h) [reset = 7F80h]
          10. 7.3.2.1.10 Remote Temperature High Limit Register (offset = 12h) [reset = 7FF0h]
          11. 7.3.2.1.11 Remote Temperature Low Limit Register (offset = 14h) [reset = 8000h]
          12. 7.3.2.1.12 Remote Temperature Offset Register (offset = 16h) [reset = 0000h]
          13. 7.3.2.1.13 Temperature Configuration 1 Register (offset = 1Ah) [reset = 0A01h]
          14. 7.3.2.1.14 Temperature Configuration 2 Register (offset = 1Ch) [reset = 0000h]
          15. 7.3.2.1.15 Device ID Register (offset = 1Eh) [reset = 00A3h]
          16. 7.3.2.1.16 Temperature Overwrite Register (offset = 22h) [reset = 0000h]
          17. 7.3.2.1.17 Reset Status Register (offset = 24h) [reset = N/A]
          18. 7.3.2.1.18 One-Shot Temperature Register (offset = 28h) [reset = 0000h]
          19. 7.3.2.1.19 Software Alarm Register (offset = 2Ah) [reset = 0000h]
        2. 7.3.2.2 SPI Page 2: DAC Configuration Register Information
          1. 7.3.2.2.1  DAC0 Input Data Register (offset = 00h) [reset = 0000h]
          2. 7.3.2.2.2  DAC1 Input Data Register (offset = 02h) [reset = 0000h]
          3. 7.3.2.2.3  DAC2 Input Data Register (offset = 04h) [reset = 0000h]
          4. 7.3.2.2.4  DAC3 Input Data Register (offset = 06h) [reset = 0000h]
          5. 7.3.2.2.5  DAC0 Overwrite Register (offset = 08h) [reset = 0000h]
          6. 7.3.2.2.6  DAC1 Overwrite Register (offset = 0Ah) [reset = 0000h]
          7. 7.3.2.2.7  DAC2 Overwrite Register (offset = 0Ch) [reset = 0000h]
          8. 7.3.2.2.8  DAC3 Overwrite Register (offset = 0Eh) [reset = 0000h]
          9. 7.3.2.2.9  CLAMP1 Overwrite Register (offset: 10h) [reset = 0000h]
          10. 7.3.2.2.10 CLAMP2 Overwrite Register (offset: 12h) [reset = 0000h]
          11. 7.3.2.2.11 CLAMP1 Input Data Register (offset: 18h) [reset = 0000h]
          12. 7.3.2.2.12 CLAMP2 Input Data Register (offset: 1Ah) [reset = 0000h]
          13. 7.3.2.2.13 DAC0 LUT Data Register (offset = 20h) [reset = 0000h]
          14. 7.3.2.2.14 DAC1 LUT Data Register (offset = 22h) [reset = 0000h]
          15. 7.3.2.2.15 DAC2 LUT Data Register (offset = 24h) [reset = 0000h]
          16. 7.3.2.2.16 DAC3 LUT Data Register (offset = 26h) [reset = 0000h]
          17. 7.3.2.2.17 Broadcast Register (offset = 30h) [reset = 0000h]
        3. 7.3.2.3 SPI Page 4: LUT0 and LUT1 Configuration Register Information
          1. 7.3.2.3.1 DELTA Registers (offset = 00h - 62h) [reset = 00FFh]
          2. 7.3.2.3.2 DAC0 BASE Registers (offset = 64h - 66h) [reset = 0000h]
          3. 7.3.2.3.3 DAC1 BASE Registers (offset = 68h - 6Ah) [reset = 0000h]
        4. 7.3.2.4 SPI Page 5: LUT2 and LUT3 Configuration Register Information
          1. 7.3.2.4.1 DELTA Registers (offset = 00h - 62h) [reset = 00FFh]
          2. 7.3.2.4.2 DAC2 BASE Registers (offset = 64h - 66h) [reset = 0000h]
          3. 7.3.2.4.3 DAC3 BASE Registers (offset = 68h - 6Ah) [reset = 0000h]
        5. 7.3.2.5 SPI Page 15: Notepad Register Information
          1. 7.3.2.5.1 Notepad Registers (offset = 00h to 12h) [reset = 0000h]
          2. 7.3.2.5.2 EEPROM Burn Register (offset = 7Ch) [reset = 0000h]
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Output Switching Timing
    2. 8.2 Typical Applications
      1. 8.2.1 Temperature-Compensated Bias Generator for an LDMOS Power Amplifier (PA)
        1. 8.2.1.1 Design Requirements
        2. 8.2.1.2 Detailed Design Procedure
          1. 8.2.1.2.1 Supply Voltage Selection
          2. 8.2.1.2.2 DAC Output Voltage Range
          3. 8.2.1.2.3 Temperature-Sensing Applications
          4. 8.2.1.2.4 PAVDD Isolation From the Power Amplifier
        3. 8.2.1.3 Application Curves
      2. 8.2.2 Temperature-Compensated Bias Generator for a Gallium Nitride (GaN) Power Amplifier (PA)
        1. 8.2.2.1 Design Requirements
        2. 8.2.2.2 Detailed Design Procedure
          1. 8.2.2.2.1 Supply Voltage Selection
          2. 8.2.2.2.2 DAC Output Voltage Range
        3. 8.2.2.3 Application Curves
    3. 8.3 Initialization Setup
    4. 8.4 Power Supply Recommendations
    5. 8.5 Layout
      1. 8.5.1 Layout Guidelines
      2. 8.5.2 Layout Example
        1. 8.5.2.1 Positive Output Range Layout Example
        2. 8.5.2.2 Negative Output Range Layout Example
  10. Device and Documentation Support
    1. 9.1 Documentation Support
      1. 9.1.1 Related Documentation
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Electrical Characteristics

all minimum and maximum specifications at TJ = –55℃ to +125℃ and all typical specifications at TJ = 25℃, VDD = 4.5V to 5.5V, VIO = 1.65V to 3.6V, positive output range: VCC = 4.5V to 5.5V, VSS = GND, negative output range: VSS = –11V to –4.5V, VCC = GND, and DAC outputs unloaded (unless otherwise noted)
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
DAC CHARACTERISTICS(1)
Resolution 13 Bits
Full-scale output voltage Set at start-up through auto-range detection –10 0 V
Set at start-up through auto-range detection 0 10
DNL Differential nonlinearity Specified 13-bit monotonic –1 1 LSB
INL Integral nonlinearity –4 4 LSB
TUE Total unadjusted error –0.4 ±0.1 0.4 %FSR
Total adjusted error After one point calibration at 25℃,
DAC output at 1/4 of full-scale range
–0.06 ±0.01 0.06 %FSR
Offset error Positive output range –24 ±5 24 mV
Negative output range –24 ±5 24
Offset error temperature drift ±2 ppm/°C
Gain error –0.3 ±0.01 0.3 %FSR
Gain error temperature drift ±5 ppm/°C
Zero-scale error Positive output range: all zeros code 0 5 24 mV
Negative output range: all ones code –24 –5 0
Zero-scale error temperature drift ±2 ppm/°C
Full-scale error Positive output range: all ones code –0.25 ±0.03 0.25 %FSR
Negative output range: all zeros code –0.4 ±0.05 0.4
Full-scale error temperature drift ±5 ppm/°C
Load current(2) Source with 1V headroom from VCC,
high-current mode,
number of active channels ≤ 2
100 mA
Sink with 1V headroom from VSS,
high- and normal-current modes
20
Short circuit current, source(2) Start-up current mode 12 mA
Normal-current mode 70
High-current mode 120
Short circuit current, sink(2) Start-up current mode 12 mA
Normal-current mode 40
High-current mode 40
Capacitive load stability 0 15 µF
DC output impedance DAC[0,3], midscale code 10 Ω
DAC[1,2], CLAMP[1,2], midscale code 3
Output voltage settling time CL = 15 µF, 2.5V step to within 2.5mV 400 µs
Output noise 0.1Hz to 10Hz, midscale code 70 µVPP
Output noise density 1kHz, midscale code 700 nV/√Hz
AC PSRR Midscale code, frequency = 60Hz,
amplitude = 200mVPP superimposed on VCC or VSS
  75   dB
Midscale code, frequency = 60Hz,
amplitude = 200mVPP superimposed on VDD
60
DC PSRR Midscale code, VDD = 5V ± 10%,
VCC = 5V ± 10%, VSS = –10V ± 10%
0.15 mV/V
Channel-to-channel DC crosstalk Measured DAC output at midscale, all other DAC outputs at full-scale, CLAMP outputs at zero-scale 150 µV
AUTO-RANGE THRESHOLD DETECTOR
VSSTH Auto-supply monitor threshold Narrow VSS supply failure detect (default) –3.8 –2.8 V
VSSWTH Auto-supply monitor threshold Wide VSS supply failure detect, set by register write or loaded from EEPROM –6.8 –5.8 V
VCCTH Auto-supply monitor threshold VCC supply failure detect 2.3 3.3 V
OUTPUT SWITCH DC CHARACTERISTICS
R1,2 On resistance between DAC[1,2] and OUT[1,2] or CLAMP[1,2] and OUT[1,2] Negative output range, 1.5V headroom from VSS 2 3 Ω
Positive output range, 1.5V headroom from VDD 2 3
R0,3 On resistance between DAC buffers and DAC[0,3] or between DAC[0,3] and CLAMP[1,2] Negative output range, 1.5V headroom from VSS 9 14 Ω
Positive output range, 1.5V headroom from VCC 10 16
COUT OUT[1,2] output impedance 100 pF
LOCAL TEMPERATURE SENSOR CHARACTERISTICS
Operating junction temperature –55 150 °C
Accuracy TJ = –55°C to +125°C 1.25 2.5 °C
Resolution LSB size 0.0625 °C
Update time 32 conversions per second 31.25 ms
REMOTE TEMPERATURE SENSOR CHARACTERISTICS (Using 2N3906 Transistor)
Operating junction temperature –55 150 °C
Accuracy TDIODE = –55°C to +150°C 1.25 2.5 °C
Resolution LSB size 0.0625 °C
Update time 32 conversions per second 31.25 ms
DIGITAL INPUTS
VIH High-level input voltage 1.3 V
VIL Low-level input voltage 0.45 V
Hysteresis voltage 90 mV
Input current 1 µA
Input pin capacitance 5 pF
DIGITAL OUTPUTS
VOH High-level output voltage Load current = 1mA VIO – 0.2 V
VOL Low-level output voltage Load current= –1mA 0.4 V
Output pin capacitance 5 pF
POWER REQUIREMENTS
IVDD VDD supply current Positive output range 5 mA
Negative output range 5
IVCC VCC supply current Positive output range, midscale output 3 mA
IVSS VSS supply current Negative output range, 1/4 of full-scale output 3 mA
IVIO VIO supply current 10 µA
End point fit between codes 64 to 8128 for negative output range and 64 to 4032 for positive output range.
Overload condition protection. Junction temperature potentially exceeds during current limit. Operation greater than the specified maximum junction temperature potentially impairs device reliability.