SNAS849 December   2024 LMX2624-SP

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions
  6. 5 Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Timing Diagrams
  7. 6 Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Reference Oscillator Input
      2. 6.3.2  Reference Path
        1. 6.3.2.1 OSCin Doubler (OSC_2X)
        2. 6.3.2.2 Pre-R Divider (PLL_R_PRE)
        3. 6.3.2.3 Post-R Divider (PLL_R)
      3. 6.3.3  State Machine Clock
      4. 6.3.4  PLL Phase Detector and Charge Pump
      5. 6.3.5  N Divider and Fractional Circuitry
      6. 6.3.6  MUXout Pin
        1. 6.3.6.1 Serial Data Output for Readback
        2. 6.3.6.2 Lock Detect Indicator Set as Type “VCOcal” or "Vtune and VCOcal"
      7. 6.3.7  VCO (Voltage-Controlled Oscillator)
        1. 6.3.7.1 VCO Calibration
          1. 6.3.7.1.1 Double Buffering (Shadow Registers)
        2. 6.3.7.2 Watchdog Feature
        3. 6.3.7.3 RECAL Feature
        4. 6.3.7.4 Determining the VCO Gain
      8. 6.3.8  Channel Divider
      9. 6.3.9  Output Mute Pin and Ping Pong Approaches
      10. 6.3.10 Output Frequency Doubler
      11. 6.3.11 Output Buffer
      12. 6.3.12 Power-Down Modes
      13. 6.3.13 Pin-Mode Integer Frequency Generation
      14. 6.3.14 Treatment of Unused Pins
      15. 6.3.15 Phase Synchronization
        1. 6.3.15.1 General Concept
        2. 6.3.15.2 Categories of Applications for SYNC
        3. 6.3.15.3 Procedure for Using SYNC
        4. 6.3.15.4 SYNC Input Pin
      16. 6.3.16 Phase Adjust
      17. 6.3.17 Fine Adjustments for Phase Adjust and Phase SYNC
      18. 6.3.18 SYSREF
        1. 6.3.18.1 Programmable Fields
        2. 6.3.18.2 Input and Output Pin Formats
          1. 6.3.18.2.1 SYSREF Output Format
        3. 6.3.18.3 Examples
        4. 6.3.18.4 SYSREF Procedure
    4. 6.4 Device Functional Modes
    5. 6.5 Programming
      1. 6.5.1 Recommended Initial Power-Up Sequence
      2. 6.5.2 Recommended Sequence for Changing Frequencies
  8. 7 Register Maps
    1. 7.1 Device Registers
  9. 8 Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 OSCin Configuration
      2. 8.1.2 OSCin Slew Rate
      3. 8.1.3 RF Output Buffer Power Control
      4. 8.1.4 RF Output Buffer Pullup
      5. 8.1.5 RF Output Treatment for the Complimentary Side
        1. 8.1.5.1 Single-ended Termination of Unused Output
    2. 8.2 Typical Application
      1. 8.2.1 Design Requirements
      2. 8.2.2 Detailed Design Procedure
      3. 8.2.3 Application Curve
    3. 8.3 Power Supply Recommendations
    4. 8.4 Layout
      1. 8.4.1 Layout Guidelines
      2. 8.4.2 Layout Example
      3. 8.4.3 Footprint Example on PCB Layout
      4. 8.4.4 Radiation Environments
        1. 8.4.4.1 Total Ionizing Dose
        2. 8.4.4.2 Single Event Effect
  10. 9 Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Documentation Support
      1. 9.2.1 Related Documentation
    3. 9.3 Receiving Notification of Documentation Updates
    4. 9.4 Support Resources
    5. 9.5 Trademarks
    6. 9.6 Electrostatic Discharge Caution
    7. 9.7 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Engineering Samples
    2. 11.2 Package Option Addendum
    3. 11.3 Tape and Reel Information

6.3.8 Channel Divider

To go below the VCO lower bound of 7500MHz, the channel divider can be used. The channel divider consists of six segments, and the total division value is equal to the multiplication of them. Therefore, not all values are valid.

LMX2624-SP Channel Divider Figure 6-2 Channel Divider

When the channel divider is used, there are limitations on the values. Table 6-9 shows how these values are implemented.

Table 6-9 Channel Divider Segments
EQUIVALENT DIVISION VALUE FREQUENCY LIMITATION OutMin (MHz) OutMax (MHz) CHDIV[4:0]
2 None 3750 7500 1
4 1875 3750 2
6 fVCO ≤ 12GHz 1250 2000
8 937.5 1500 4
12 625 1000 5
16 468.75 750 6
24 312.5 500 7
32 234.375 375 8
48 156.25 250 9
64 117.1875 187.5 10
96 78.125 125 11
128 58.59375 93.75 12
192 39.0625 62.5 13
256 29.296875 46.875 14
384 19.53125 31.25 15
512 14.6484375 23.4375 16
768 9.765625 15.625 17
1024 7.32421875 11.71875 18
1536 4.8828125 7.8125 19

The channel divider is powered up whenever an output (OUTMUXx) is selected to the channel divider or SysRef, regardless of whether the output is powered down or not. When an output is not used, TI recommends selecting the VCO output to verify that the channel divider is not unnecessarily powered up.

Table 6-10 Channel Divider
RFOUTA RFOUTB CHANNEL DIVIDER (CDIV) Status
Channel Divider Channel Divider Powered up
Channel Divider VCO Powered up
VCO Channel Divider Powered up
Doubler Channel Divider Powered up
VCO VCO Powered down
VCO Doubler Powered down
Doubler VCO Powered down
Doubler Doubler Powered down