STDA033 October   2026 MSPM0G3105-Q1 , MSPM0G3106-Q1 , MSPM0G3107-Q1 , MSPM0G3505-Q1 , MSPM0G3506-Q1 , MSPM0G3507-Q1 , MSPM0L1227-Q1 , MSPM0L1228-Q1 , MSPM0L2227-Q1 , MSPM0L2228-Q1 , MSPM33C321A

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1.     How Does an Electromagnetic Field Start in a Circuit?
    2.     Near-Field and Far-Field Electromagnetic Fields
  5. 2Common Sources of EMI in Electronic Designs
    1. 2.1 Resistors
      1. 2.1.1 Equivalent Series Inductance (ESL)
      2. 2.1.2 Shunt Capacitance
      3. 2.1.3 Parasitic Capacitance to Ground
    2. 2.2 Capacitors
      1. 2.2.1 Equivalent Series Resistance (ESR)
      2. 2.2.2 Equivalent Series Inductance (ESL)
      3. 2.2.3 Leakage Resistance
      4. 2.2.4 Dielectric Absorption (Soakage)
    3. 2.3 Inductors
      1. 2.3.1 Direct Current Resistance (DCR)
      2. 2.3.2 Parasitic Capacitance
      3. 2.3.3 Core Losses (Magnetic Parasitics)
    4. 2.4 Summary of Discrete Component EMI Considerations
    5. 2.5 Design Deficiencies
    6. 2.6 Sources Specific to MCUs
      1. 2.6.1 Clock Circuits and Oscillators
    7. 2.7 Other Common Sources
      1. 2.7.1 High-Speed Digital Buses
      2. 2.7.2 I/O Output Transitions
      3. 2.7.3 Floating Components
      4. 2.7.4 External Environmental Sources
  6. 3Mitigation Techniques to Minimize EMI and Optimize Board Performance
    1. 3.1 Power Supply Capacitor Selection and Placement
    2. 3.2 Capacitor Placement
    3. 3.3 Layer Stack-Up Optimization
      1. 3.3.1 Good Stack-Up Traits
      2. 3.3.2 Stitching and Shielding Optimization Techniques
    4. 3.4 Trace Routing
    5. 3.5 Passive Pi Filtering
    6. 3.6 Shielding, Grounding, and Cable Boundaries
    7. 3.7 Transient and ESD Current Paths
  7. 4EMC Verification and Troubleshooting
    1. 4.1 Emissions and Immunity as Port Problems
    2. 4.2 Pre-Compliance Measurement Toolkit
    3. 4.3 A Frequency-to-Structure Debug Method
    4. 4.4 Interpreting Common Spectral Signatures
    5. 4.5 Integrated Design Review Checklist
  8. 5Conclusion

Abstract

This white paper provides a comprehensive analysis of electromagnetic interference (EMI), a critical challenge in the design and operation of modern electronic systems. As device density increases and operating frequencies rise, the risk of performance degradation and system failure due to unwanted electromagnetic disturbances grows. This study first categorizes the primary sources of EMI, distinguishing between natural phenomena and human-made emissions from high-speed digital circuits and switching power supplies.

Furthermore, the paper evaluates essential mitigation techniques, including the application of shielding, filtering, and grounding strategies to contain or block interference. Special attention is given to printed circuit board (PCB) layout optimization, such as minimizing loop areas and maintaining impedance control, as a foundational preventative measure. Finally, the research outlines industry practices and compliance standards, offering a systematic framework for engineers to maintain electromagnetic compatibility (EMC) in complex environments.