STDA033 October   2026 MSPM0G3105-Q1 , MSPM0G3106-Q1 , MSPM0G3107-Q1 , MSPM0G3505-Q1 , MSPM0G3506-Q1 , MSPM0G3507-Q1 , MSPM0L1227-Q1 , MSPM0L1228-Q1 , MSPM0L2227-Q1 , MSPM0L2228-Q1 , MSPM33C321A

 

  1.   1
  2.   Abstract
  3.   Trademarks
  4. 1Introduction
    1.     How Does an Electromagnetic Field Start in a Circuit?
    2.     Near-Field and Far-Field Electromagnetic Fields
  5. 2Common Sources of EMI in Electronic Designs
    1. 2.1 Resistors
      1. 2.1.1 Equivalent Series Inductance (ESL)
      2. 2.1.2 Shunt Capacitance
      3. 2.1.3 Parasitic Capacitance to Ground
    2. 2.2 Capacitors
      1. 2.2.1 Equivalent Series Resistance (ESR)
      2. 2.2.2 Equivalent Series Inductance (ESL)
      3. 2.2.3 Leakage Resistance
      4. 2.2.4 Dielectric Absorption (Soakage)
    3. 2.3 Inductors
      1. 2.3.1 Direct Current Resistance (DCR)
      2. 2.3.2 Parasitic Capacitance
      3. 2.3.3 Core Losses (Magnetic Parasitics)
    4. 2.4 Summary of Discrete Component EMI Considerations
    5. 2.5 Design Deficiencies
    6. 2.6 Sources Specific to MCUs
      1. 2.6.1 Clock Circuits and Oscillators
    7. 2.7 Other Common Sources
      1. 2.7.1 High-Speed Digital Buses
      2. 2.7.2 I/O Output Transitions
      3. 2.7.3 Floating Components
      4. 2.7.4 External Environmental Sources
  6. 3Mitigation Techniques to Minimize EMI and Optimize Board Performance
    1. 3.1 Power Supply Capacitor Selection and Placement
    2. 3.2 Capacitor Placement
    3. 3.3 Layer Stack-Up Optimization
      1. 3.3.1 Good Stack-Up Traits
      2. 3.3.2 Stitching and Shielding Optimization Techniques
    4. 3.4 Trace Routing
    5. 3.5 Passive Pi Filtering
    6. 3.6 Shielding, Grounding, and Cable Boundaries
    7. 3.7 Transient and ESD Current Paths
  7. 4EMC Verification and Troubleshooting
    1. 4.1 Emissions and Immunity as Port Problems
    2. 4.2 Pre-Compliance Measurement Toolkit
    3. 4.3 A Frequency-to-Structure Debug Method
    4. 4.4 Interpreting Common Spectral Signatures
    5. 4.5 Integrated Design Review Checklist
  8. 5Conclusion

How Does an Electromagnetic Field Start in a Circuit?

Any change in the electrical potential of a wire, circuit board trace, or any component that has inductive properties causes a voltage or electromagnetic field (EMF) to be induced in the circuit. This EMF produces a current if a load is present. No matter how the change is produced, a voltage is generated and subsequently a current develops across any load. The change can be produced by changing the magnetic field strength, moving a magnet toward or away from the coil, moving the coil into or out of the magnetic field, rotating the coil relative to a magnet or field, and so forth. In simpler terms, any ΔV/Δt can develop electromagnetic lines of force, so if the voltage moves, pulses, ripples, or changes in any way, the voltage can be considered a source of EMF.

MSPM0 MSPM33 EMF Induced by Changing
                    Magnetic Flux Figure 1-1 EMF Induced by Changing Magnetic Flux
MSPM0 MSPM33 EMF Induced by Changing Loop
                    Area Figure 1-2 EMF Induced by Changing Loop Area
MSPM0 MSPM33 EMF Induced by Relative
                    Magnet-Coil Motion Figure 1-3 EMF Induced by Relative Magnet-Coil Motion
MSPM0 MSPM33 EMF Induced by Coil
                    Rotation Figure 1-4 EMF Induced by Coil Rotation

A schematic net describes connectivity but does not show the physical return path. Every signal current leaves a source and returns to that source. The outgoing trace and return path form a loop whose inductance and field exposure increases with enclosed area. At high frequency, current follows the path of least impedance, which is typically the path of least inductance rather than the path of least DC resistance. A useful mental model is to think in loops, not just nets. The outgoing current on the signal trace and the return current in the reference plane form a loop. The smaller and more co-located that loop is, the less magnetic field is exposed to the outside world. The same idea applies to switching regulator input loops, gate-drive loops, ESD clamp loops, decoupling loops, and cable common-mode loops.

At low frequency, return current tends to spread according to resistance. At high frequency, return current concentrates under or near the signal path because that path minimizes inductance. If the reference plane is continuous, this is beneficial: the outgoing and return fields cancel well. If the plane is split, the return current is forced to detour, the loop expands, and the board can radiate or become susceptible to external fields.

Rise time is often a better warning sign than clock frequency. A 10MHz clock with 500ps edges can contain meaningful harmonic energy well into the hundreds of MHz. For EMC reviews, estimate the highest important spectral content from edge rate and then ask whether the return path, via spacing, enclosure aperture, and cable boundary still look small at that frequency.

MSPM0 MSPM33 Magnetic Fields Induced by
                    Change in Current MSPM0 MSPM33 Magnetic Fields Induced by
                    Change in Current Figure 1-5 Magnetic Fields Induced by Change in Current