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TPSM63603

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High-density, 3-V to 36-V input, 1-V to 16-V output, 3-A power module

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Product details

Parameters

Iout (Max) (A) 3 Vin (Min) (V) 3.0 Vin (Max) (V) 36 Vout (Min) (V) 1 Vout (Max) (V) 16 Soft start Fixed Features EMI Tested, Enable, Frequency Synchronization, Overcurrent protection, Power Good, Spread Spectrum Operating temperature range (C) -40 to 125 Iq (Typ) (uA) 9 Regulated outputs (#) 1 Switching frequency (Max) (kHz) 2200 Switching frequency (Min) (kHz) 200 Duty cycle (Max) (%) 98 Topology Buck, Inverting Buck-Boost, Synchronous Buck open-in-new Find other Buck modules (integrated inductor)

Features

  • Integrated controller, MOSFETs, and inductor
  • 4.0-mm × 6.0-mm × 1.8-mm overmolded package
  • Wide input voltage range: 3.0 V to 36 V
  • Wide output voltage range: 1.0 V to 16 V
  • Best in-class efficiency
  • Switching frequency range: 200 kHz to 2.2 MHz
  • Frequency synchronization
  • FPWM mode of operation
  • 1% total output voltage accuracy
  • Low IQ current of 9-µA (non-switching)
  • –40°C to 105°C ambient temperature range
  • Undervoltage and overvoltage power good
  • Optimized for ultra-low EMI requirements
    • Spread spectrum (S suffix) reduces peak emissions
    • Adjustable SW node slew rate
    • Meets CISPR22 and CISPR32 class B emissions
  • Monotonic start-up into prebiased output
  • No external loop-compensation components
  • Precision enable with hysteresis for external UVLO
  • Thermal shutdown protection with hysteresis
  • Create a custom design using the TPSM63603 with the WEBENCH Power Designer

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Description

The TPSM63603 power module is a highly integrated 3-A power solution that combines a 36-V input, step-down DC/DC converter with power MOSFETs, a shielded inductor, and passives in a thermally enhanced QFN package. The 30-pin QFN package has enhanced thermal performance, small footprint, and low EMI. The package footprint has all signal and power pins accessible from the perimeter as well as four larger thermal pads beneath the device for simple layout and easy handling in manufacturing.

The TPSM63603 is a compact, easy-to-use power module with a wide output voltage range of 1.0 V to 16 V. The module is designed to quickly and easily implement a power design in a small PCB footprint. The total solution requires as few as four external components and eliminates the loop compensation and magnetics part selection from the design process.

Although designed for small size and simplicity, the TPSM63603 offers many features: precision enable with hysteresis allows external adjustable UVLO, adjustable SW node slew rate for improving EMI, and a power-good indicator allows sequencing and output voltage monitoring. The small package size is a good fit for space-constrained applications.

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Technical documentation

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Type Title Date
* Data sheet TPSM63603 High-Density, 3-V to 36-V Input, 1-V to 16-V Output, 3-A Power Module datasheet Mar. 30, 2021
User guide TPSM63603EVM Evaluation Module Mar. 22, 2021
More literature TPSM63603EVM EU Declaration of Conformity (DoC) Mar. 16, 2021

Design & development

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Hardware development

EVALUATION BOARD Download
document-generic User guide
49
Description
The TPSM63603EVM evaluation board is configured to evaluate the operation of the TPSM63603 power module. The input voltage range is 3 V to 36 V. The output voltage range is 1 V to 16 V. The evaluation board makes it easy to evaluate the TPSM63603 operation.
Features
  • 3-V to 36-V input voltage range
  • Output current up to 3 A
  • 1-V to 16-V output voltage
  • 4-mm x 6-mm QFN package

Design tools & simulation

SIMULATION TOOL Download
PSpice® for TI design and simulation tool
PSPICE-FOR-TI — PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
Features
  • Leverages Cadence PSpice Technology
  • Preinstalled library with a suite of digital models to enable worst-case timing analysis
  • Dynamic updates ensure you have access to most current device models
  • Optimized for simulation speed without loss of accuracy
  • Supports simultaneous analysis of multiple products
  • (...)

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