SNVSC75B April   2023  – September 2025 LM5171-Q1

PRODUCTION DATA  

  1.   1
  2. Features
  3. Applications
  4. Description
  5. Pin Configuration and Functions
  6. Specifications
    1. 5.1 Absolute Maximum Ratings
    2. 5.2 ESD Ratings
    3. 5.3 Recommended Operating Conditions
    4. 5.4 Thermal Information
    5. 5.5 Electrical Characteristics
    6. 5.6 Timing Requirements
    7. 5.7 Typical Characteristics
  7. Detailed Description
    1. 6.1 Overview
    2. 6.2 Functional Block Diagram
    3. 6.3 Feature Description
      1. 6.3.1  Bias Supplies and Voltage Reference (VCC, VDD, and VREF)
      2. 6.3.2  Undervoltage Lockout (UVLO)
      3. 6.3.3  Device Configurations (CFG)
      4. 6.3.4  High Voltage Inputs (HV1, HV2)
      5. 6.3.5  Current Sense Amplifier
      6. 6.3.6  Control Commands
        1. 6.3.6.1 Channel Enable Commands (EN1, EN2)
        2. 6.3.6.2 Direction Command (DIR1 and DIR2)
        3. 6.3.6.3 Channel Current Setting Commands (ISET1 and ISET2)
      7. 6.3.7  Channel Current Monitor (IMON1, IMON2)
        1. 6.3.7.1 Individual Channel Current Monitor
        2. 6.3.7.2 Multiphase Total Current Monitoring
      8. 6.3.8  Cycle-by-Cycle Peak Current Limit (IPK)
      9. 6.3.9  Inner Current Loop Error Amplifier
      10. 6.3.10 Outer Voltage Loop Error Amplifier
      11. 6.3.11 Soft Start, Diode Emulation, and Forced PWM Control (SS/DEM1 and SS/DEM2)
        1. 6.3.11.1 ISET Soft-Start Control by the SS/DEM Pins
        2. 6.3.11.2 DEM Programming
        3. 6.3.11.3 FPWM Programming and Dynamic FPWM and DEM Change
      12. 6.3.12 Gate Drive Outputs, Dead Time Programming and Adaptive Dead Time (HO1, HO2, LO1, LO2, DT/SD)
      13. 6.3.13 Emergency Latched Shutdown (DT/SD)
      14. 6.3.14 PWM Comparator
      15. 6.3.15 Oscillator (OSC)
      16. 6.3.16 Synchronization to an External Clock (SYNCI, SYNCO)
      17. 6.3.17 Overvoltage Protection (OVP)
      18. 6.3.18 Multiphase Configurations (SYNCO, OPT)
        1. 6.3.18.1 Multiphase in Star Configuration
        2. 6.3.18.2 Daisy-Chain Configurations for 2, 3, or 4 Phases parallel operations
        3. 6.3.18.3 Daisy-Chain configuration for 6 or 8 phases parallel operation
      19. 6.3.19 Thermal Shutdown
    4. 6.4 Device Functional Modes
      1. 6.4.1 Initialization Mode
      2. 6.4.2 Standby Mode
      3. 6.4.3 Power Delivery Mode
      4. 6.4.4 Shutdown Mode
      5. 6.4.5 Latched Shutdown mode
  8. Registers
    1. 7.1 I2C Serial Interface
    2. 7.2 I2C Bus Operation
    3. 7.3 Clock Stretching
    4. 7.4 Data Transfer Formats
    5. 7.5 Single READ From a Defined Register Address
    6. 7.6 Sequential READ Starting From a Defined Register Address
    7. 7.7 Single WRITE to a Defined Register Address
    8. 7.8 Sequential WRITE Starting From A Defined Register Address
    9. 7.9 REGFIELD Registers
  9. Application and Implementation
    1. 8.1 Application Information
      1. 8.1.1 Small Signal Model
        1. 8.1.1.1 Current Loop Small Signal Model
        2. 8.1.1.2 Current Loop Compensation
        3. 8.1.1.3 Voltage Loop Small Signal Model
        4. 8.1.1.4 Voltage Loop Compensation
    2. 8.2 PWM to ISET Pins
    3. 8.3 ISET Clamp
    4. 8.4 Dynamic Dead Time Adjustment
    5. 8.5 Proper Termination of Unused Pins
    6. 8.6 Typical Application
      1. 8.6.1 60A, Dual-Phase, 48V to 12V Bidirectional Converter
        1. 8.6.1.1 Design Requirements
        2. 8.6.1.2 Detailed Design Procedure
          1. 8.6.1.2.1  Determining the Duty Cycle
          2. 8.6.1.2.2  Oscillator Programming (OSC)
          3. 8.6.1.2.3  Power Inductor, RMS and Peak Currents
          4. 8.6.1.2.4  Current Sense (RCS)
          5. 8.6.1.2.5  Current Setting Commands (ISETx)
          6. 8.6.1.2.6  Peak Current Limit (IPK)
          7. 8.6.1.2.7  Power MOSFETS
          8. 8.6.1.2.8  Bias Supply
          9. 8.6.1.2.9  Boot Strap Capacitor
          10. 8.6.1.2.10 Overvoltage Protection (OVP)
          11. 8.6.1.2.11 Dead Time (DT/SD)
          12. 8.6.1.2.12 Channel Current Monitor (IMONx)
          13. 8.6.1.2.13 Undervoltage Lockout (UVLO)
          14. 8.6.1.2.14 HVx Pin Configuration
          15. 8.6.1.2.15 Loop Compensation
          16. 8.6.1.2.16 Soft Start (SS/DEMx)
        3. 8.6.1.3 Application Curves
          1. 8.6.1.3.1 Efficiency and Thermal Performance
          2. 8.6.1.3.2 Step Load Response
          3. 8.6.1.3.3 Dual-Channel Interleaving Operation
          4. 8.6.1.3.4 Typical Start Up and Shutdown
          5. 8.6.1.3.5 DEM and FPWM
          6. 8.6.1.3.6 Mode Transition Between DEM and FPWM
          7. 8.6.1.3.7 ISET Tracking and Pre-charge
          8. 8.6.1.3.8 Protections
    7. 8.7 Power Supply Recommendations
    8. 8.8 Layout
      1. 8.8.1 Layout Guidelines
      2. 8.8.2 Layout Examples
  10. Device and Documentation Support
    1. 9.1 Device Support
      1. 9.1.1 Development Support
    2. 9.2 Receiving Notification of Documentation Updates
    3. 9.3 Support Resources
    4. 9.4 Trademarks
    5. 9.5 Electrostatic Discharge Caution
    6. 9.6 Glossary
  11. 10Revision History
  12. 11Mechanical, Packaging, and Orderable Information

Direction Command (DIR1 and DIR2)

These pins are tri-state function pins. DIR1 controls CH-1, and DIR2 controls CH-2.

  1. When the DIR1 pin is actively pulled above 2V (logic state of 1), CH-1 operates in buck mode, and current flows from the HV-Port to the LV-Port.
  2. When the DIR1 pin is actively pulled below 1V (logic state of 0), CH-1 operates in boost mode, and current flows from the LV-Port to the HV-Port.
  3. When DIR1 is left open, the DIR1 is around 1.5V that is considered an invalid command and CH-1 remains in standby mode regardless of the EN1 states. This tri-state function prevents faulty operation when losing the DIR signal connection to the MCU.
  4. When DIR1 changes the logic state between 1 and 0 dynamically during operation, the transition causes the SS/DEM1 pin to discharge first to below 0.3V, then the SS/DEM1 pin pulldown is released and CH-1 goes through a new soft-start process to produce the current in the new direction. The soft-start eliminates the surge current during the direction change.
  5. Similar behaviors for DIR2, CH-2, EN2, and SS/DEM2.
  6. The built-in 10µs glitch filter prevents errant operation by noise on the DIR1 and DIR2 signals.