SPRY303F May 2019 – February 2025 AM3351 , AM3352 , AM3354 , AM3356 , AM3357 , AM3358 , AM3358-EP , AM3359 , AM4372 , AM4376 , AM4377 , AM4378 , AM4379 , AM5706 , AM5708 , AM5746 , AM5748 , AM623 , AM625 , AM625-Q1 , AM625SIP , AM62A1-Q1 , AM62A3 , AM62A3-Q1 , AM62A7 , AM62A7-Q1 , AM62L , AM62P , AM62P-Q1 , AM6411 , AM6412 , AM6421 , AM6422 , AM6441 , AM6442 , AM6526 , AM6528 , AM6546 , AM6548 , AM68 , AM68A , AM69 , AM69A , DRA821U , DRA821U-Q1 , DRA829J , DRA829J-Q1 , DRA829V , DRA829V-Q1 , TDA4VM , TDA4VM-Q1
Sophisticated and not-so-sophisticated hacking organizations have been known to remove chips from a system or a silicon die from a chip package to access the embedded assets.
Figure 7 A system under physical
attack.Once the device or die have been removed, hackers can bombard them with lasers, power them up beyond their specified power limits or employ other means. Their objective is to observe how the device reacts to the stimulus because this response may betray vulnerabilities that the hackers can then exploit to access the device.
Some application processors have been integrated with hardware and software features to thwart these physical intrusions into both the digital and analog sections of SoCs. Tamper-protection modules integrated into multicore application processors can contain power and temperature monitors, reset functionality, frequency monitors and programmable tamper-protection capabilities.