Product details


Arm CPU 2 Arm Cortex-A72 Arm MHz (Max.) 2000 Co-processor(s) MCU island of 2 Arm Cortex-R5F (lockstep opt), SoC main of 4 Arm Cortex-R5F (lockstep opt) CPU 64-bit Graphics acceleration 1 3D Display type 2 DPI, 1 DSI, 1 EDP Protocols Ethernet Ethernet MAC 8-port 2.5Gb switch PCIe 4 PCIe Gen3 switch Hardware accelerators 1 Deep Learning accelerator, 1 Depth and Motion accelerator, 1 Video Encode/Decode accelerator, 1 Vision Processing accelerator Features Vision Analytics Operating system Linux, QNX, RTOS Security Cryptographic acceleration, Debug security, Device identity, Isolation firewalls, Secure boot & storage & programming, Software IP protection, Trusted execution environment Rating Automotive Operating temperature range (C) -40 to 125 open-in-new Find other Arm-based processors

Package | Pins | Size

FCBGA (ALF) 827 576 mm² 24 x 24 open-in-new Find other Arm-based processors


Processor cores:

  • C7x floating point, vector DSP, up to 1.0 GHz, 80 GFLOPS, 256 GOPS
  • Deep-learning matrix multiply accelerator (MMA), up to 8 TOPS (8b) at 1.0 GHz
  • Vision Processing Accelerators (VPAC) with Image Signal Processor (ISP) and multiple vision assist accelerators
  • Depth and Motion Processing Accelerators (DMPAC)
  • Dual 64-bit Arm Cortex-A72 microprocessor subsystem at up to 2.0 GHz
    • 1MB shared L2 cache per dual-core Cortex-A72 cluster
    • 32KB L1 DCache and 48KB L1 ICache per Cortex-A72 core
  • Six Arm Cortex-R5F MCUs at up to 1.0 GHz
    • 16K I-Cache, 16K D-Cache, 64K L2 TCM
    • Two Arm Cortex-R5F MCUs in isolated MCU subsystem
    • Four Arm Cortex-R5F MCUs in general compute partition
  • Two C66x floating point DSP, up to 1.35 GHz, 40 GFLOPS, 160 GOPS
  • 3D GPU PowerVR Rogue 8XE GE8430, up to 750 MHz, 96 GFLOPS, 6 Gpix/sec
  • Custom-designed interconnect fabric supporting near max processing entitlement

    Memory subsystem:

  • Up to 8MB of on-chip L3 RAM with ECC and coherency
    • ECC error protection
    • Shared coherent cache
    • Supports internal DMA engine
  • External Memory Interface (EMIF) module with ECC
    • Supports LPDDR4 memory types
    • Supports speeds up to 3733 MT/s
    • 32-bit data bus with inline ECC up to 14.9GB/s
  • General-Purpose Memory Controller (GPMC)
  • 512KB on-chip SRAM in MAIN domain, protected by ECC

    Functional Safety:

  • Functional Safety-Compliant targeted (on select part numbers)
    • Developed for functional safety applications
    • Documentation available to aid ISO 26262 functional safety system design up to ASIL-D/SIL-3 targeted
    • Systematic capability up to ASIL-D/SIL-3 targeted
    • Hardware integrity up to ASIL-D/SIL-3 targeted for MCU Domain
    • Hardware integrity up to ASIL-B/SIL-2 targeted for Main Domain
    • Safety-related certification
      • ISO 26262 planned
  • AEC-Q100 qualilfied on part number variants ending in Q1
  • Device security (on select part numbers):

  • Secure boot with secure runtime support
  • Customer programmable root key, up to RSA-4K or ECC-512
  • Embedded hardware security module
  • Crypto hardware accelerators – PKA with ECC, AES, SHA, RNG, DES and 3DES

    High speed serial interfaces:

  • Integrated ethernet switch supporting (total of 8 external ports)
    • Up to eight 2.5Gb SGMII
    • Up to eight RMII (10/100) or RGMII (10/100/1000)
    • Up to two QSGMII
  • Up to four PCI-Express (PCIe) Gen3 controllers
    • Up to two lanes per controller
    • Gen1 (2.5GT/s), Gen2 (5.0GT/s), and Gen3 (8.0GT/s) operation with auto-negotiation
  • Two USB 3.0 dual-role device (DRD) subsystem
    • Two enhanced SuperSpeed Gen1 Ports
    • Each port supports Type-C switching
    • Each port independently configurable as USB host, USB peripheral, or USB DRD

    Automotive interfaces:

  • Sixteen Modular Controller Area Network (MCAN) modules with full CAN-FD support
  • Two CSI2.0 4L RX plus One CSI2.0 4L TX
    • 2.5Gbps RX throughput per lane (20Gbps total)

    Display subsystem:

  • One eDP/DP interface with Multi-Display Support (MST)
    • HDCP1.4/HDCP2.2 high-bandwidth digital content protection
  • One DSI TX (up to 2.5K)
  • Up to two DPI

    Audio interfaces:

  • Twelve Multichannel Audio Serial Port (MCASP) modules

    Video acceleration:

  • Ultra-HD video, one (3840 × 2160p, 60 fps), or two (3840 × 2160p, 30 fps) H.264/H.265 decode
  • Full-HD video, four (1920 × 1080p, 60 fps), or eight (1920 × 1080p, 30 fps) H.264/H.265 decode
  • Full-HD video, one (1920 × 1080p, 60 fps), or up to three (1920 × 1080p, 30 fps) H.264 encode

    Flash memory interfaces:

  • Embedded MultiMediaCard Interface ( eMMC™ 5.1)
  • Universal Flash Storage (UFS 2.1) interface with two lanes
  • Two Secure Digital 3.0/Secure Digital Input Output 3.0 interfaces (SD3.0/SDIO3.0)
  • Two simultaneous flash interfaces configured as
    • One OSPI and one QSPI flash interfaces
    • or one HyperBus™ and one QSPI flash interface

    System-on-Chip (SoC) architecture:

  • 16-nm FinFET technology
  • 24 mm × 24 mm, 0.8-mm pitch, 827-pin FCBGA (ALF), enables IPC class 3 PCB routing

    TPS6594-Q1 Companion Power Management ICs (PMIC):

  • Functional Safety support up to ASIL-D
  • Flexible mapping to support different use cases
open-in-new Find other Arm-based processors


The TDA4VM processor family is based on the evolutionary Jacinto™ 7 architecture, targeted at ADAS and Autonomous Vehicle (AV) applications and built on extensive market knowledge accumulated over a decade of TI’s leadership in the ADAS processor market. The unique combination high-performance compute, deep-learning engine, dedicated accelerators for signal and image processing in an functional safety compliant targeted architecture make the TDA4VM devices a great fit for several industrial applications, such as: Robotics, Machine Vision, Radar, and so on. The TDA4VM provides high performance compute for both traditional and deep learning algorithms at industry leading power/performance ratios with a high level of system integration to enable scalability and lower costs for advanced automotive platforms supporting multiple sensor modalities in centralized ECUs or stand-alone sensors. Key cores include next generation DSP with scalar and vector cores, dedicated deep learning and traditional algorithm accelerators, latest Arm and GPU processors for general compute, an integrated next generation imaging subsystem (ISP), video codec, Ethernet hub and isolated MCU island. All protected by automotive grade safety and security hardware accelerators.

Key Performance Cores Overview

The “C7x” next generation DSP combines TI’s industry leading DSP and EVE cores into a single higher performance core and adds floating point vector calculation capabilities, enabling backward compatibility for legacy code while simplifying software programming. The new “MMA” deep learning accelerator enables performance up to 8 TOPS within the lowest power envelope in the industry when operating at the typical automotive worst case junction temperature of 125°C. The dedicated ADAS/AV hardware accelerators provide vision pre-processing plus distance and motion processing with no impact on system performance.

General Compute Cores and Integration Overview

Separate dual core cluster configuration of Arm Cortex-A72 facilitates multi-OS applications with minimal need for a software hypervisor. Up to six Arm Cortex-R5F subsystems enable low-level, timing critical processing tasks to leave the Arm Cortex-A72’s unencumbered for applications. The integrated “8XE GE8430” GPU offers up to 100 GFLOPS to enable dynamic 3D rendering for enhanced viewing applications. Building on the existing world-class ISP, TI’s 7th generation ISP includes flexibility to process a broader sensor suite, support for higher bit depth, and features targeting analytics applications. Integrated diagnostics and safety features support operations up to ASIL-D/SIL-3 levels while the integrated security features protect data against modern day attacks. To enable systems requiring heavy data bandwidth, a PCIe hub and Gigabit Ethernet switch are included along with CSI-2 ports to support throughput for many sensor inputs. To further the integration, the TDA4VM family also includes an MCU island eliminating the need for an external system microcontroller.

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Technical documentation

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Type Title Date
* Data sheet TDA4VM Jacinto™ Processors for ADAS and Autonomous Vehicles Silicon Revisions 1.0 and 1.1 datasheet (Rev. J) Aug. 31, 2021
* Errata J721E DRA829/TDA4VM Processors Silicon Revision 1.1/1.0 (Rev. A) Aug. 03, 2021
Application note Jacinto 7 LPDDR4 Board Design and Layout Guidelines (Rev. B) Aug. 17, 2021
Functional safety information TÜV SÜD Certificate for Functional Safety Software Development Process (Rev. A) Jul. 21, 2021
Application note TISCI Server Integration in Vector AUTOSAR Jul. 16, 2021
Application note TDA4 Flashing Techniques Jul. 08, 2021
Application note J721E DDR Firewall Example Jul. 01, 2021
Application note Hardware Accelerated Structure From Motion on TDA4VM Apr. 23, 2021
Application note Efficient Visual Localization on TDA4VM (Rev. A) Apr. 19, 2021
White paper Jacinto™ 7 프로세서의 보안 구현 도구 Jan. 04, 2021
White paper Security Enablers on Jacinto™ 7 Processors Jan. 04, 2021
White paper Sicherheitsaktivierung auf Jacinto™ 7-Prozessoren Jan. 04, 2021
User guide DRA829/TDA4VM/AM752x Technical Reference Manual (Rev. B) Jan. 03, 2021
White paper Differenzierungsmöglichkeit durch MCU-Integration Prozessoren der Reihe Jacinto™ Oct. 22, 2020
White paper Enabling Differentiation through MCU Integration on Jacinto™ 7 Processors Oct. 22, 2020
White paper Jacinto™ 7 프로세서의 MCU 통합으로 차별화 지원 Oct. 22, 2020
Application note MMC SW Tuning Algorithm Aug. 18, 2020
Application note OSPI Tuning Procedure Jul. 08, 2020
White paper 360度環景系統與自動停車系統 Mar. 01, 2020
White paper 360도 인식이 가능한서라운드뷰와 자동 주차 시스템 Mar. 01, 2020
White paper 運用 Jacinto™ 7 處理器的汽車設計功能安全特性 Mar. 01, 2020
White paper 오토모티브 설계 시 Jacinto™ 7 프로세서의 기능적 안전성 활용하기 Mar. 01, 2020
White paper Leverage Jacinto 7 Processors Functional Safety Features for Automotive Designs Dec. 12, 2019
White paper A 360-degree view of surround-view and automated parking systems Dec. 10, 2019
More literature Jacinto 7 EVM Quick Start Guide for TDA4VM and DRA829V Processors Oct. 10, 2019
Application note Jacinto 7 High-Speed Interface Layout Guidelines Oct. 04, 2019
User guide C6000-to-C7000 Migration User's Guide (Rev. C) Aug. 11, 2019
User guide VCOP Kernel-C to C7000 Migration Tool User's Guide (Rev. C) Aug. 11, 2019
Technical article Bringing the next evolution of machine learning to the edge Nov. 27, 2018
Technical article Industry 4.0 spelled backward makes no sense – and neither does the fact that you haven’t heard of TI’s newest processor yet Oct. 30, 2018
Technical article How quality assurance on the Processor SDK can improve software scalability Aug. 22, 2018
Technical article Clove: Low-Power video solutions based on Sitara™ AM57x processors Jul. 21, 2016
Certificate TÜV NORD Certificate for Functional Safety Software Development Process Feb. 03, 2015

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

document-generic User guide

The J721EXCP01EVM common processor board for Jacinto™ 7 processors lets you evaluate vision analytics and networking applications in automotive and industrial markets. The common processor board is compatible with all Jacinto 7 processors system-on-modules (sold separately or as a (...)

  • UFS flash memory, 32GByte, 2Lane, Gear3
  • USB3.1 type C interface, support DFP, DRP, UFP modes
  • Display port, up to 4K resolution with MST support
  • 2x PCIe card slot, 1x PCIe M.2 slot (M‐Key), all Gen3
document-generic User guide

The J721EXSOMG01EVM system-on-module—when paired with the J721EXPCP01EVM common processor board—lets you evaluate TDA4VM and DRA829V processors in vision analytics and networking applications throughout automotive and industrial markets. These processors perform (...)

  • TDA4VM/DRA829V (J721 E) processor
  • Optimized power solution (PMIC)
  • DRAM, LPDDR4‐3733, 4GByte total memory, support inline ECC
  • Octal‐SPI NOR flash, 512Mb memory (8bit)
  • HyperFlash + HyerRAM, 512Mb flash memory + 256Mb RAM
document-generic User guide

Expand the capabilities of the J721EXCP01EVM common processor board for evaluating Jacinto 7 processors in vision analytics and networking applications in automotive and industrial markets with our Gateway/Ethernet switch expansion card.

  • Ethernet
    • 4x 10/100/1000Mbps - RGMII ports (DP83867E)
    • 1x 10/100Mbps - RMII port (DP83822I)
  • 6x CAN interface
  • 6x LIN interface
  • PROFI BUS/RS485 port (DB9)
  • USS/IMU sensor header
  • Motor control header
  • Booster pack interface header
  • Board ID EEPROM
document-generic User guide
Expand the capabilities of the J721EXCP01EVM common processor board for evaluating Jacinto 7 processors in vision analytics and networking applications in automotive and industrial markets with our audio and display expansion card.
  • Audio interfaces:
    • Two Audio codecs each with three Stereo Inputs and four Stereo Outputs
    • Audio input over FPD Link III
    • Digital Audio Interface Transmit
    • Digital Audio Interface Receiver
  • Video interfaces:
    • HDMI/FPD LINK III Display out
    • LI/OV Camera input
  • JAMR3 interface
  • Board ID EEPROM
document-generic User guide

Bring smart cameras, robots and intelligent machines to life with the TDA4VM processor starter kit. With a fast setup process and an assortment of foundational demos and tutorials, you can start prototyping a vision-based application in less than an hour. The kit enables 8 TOPS of deep learning (...)

  • PerformanceTDA4VM processor enables 8 TOPS deep learning performance and hardware-accelerated edge AI at low power
  • Camera interfaces—two CSI-2 ports compatible with Raspberry Pi and a high-speed 40-pin Semtec camera connector connecting up to eight cameras (requires TIDA-01413 sensor fusion (...)

The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).  Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)


XDS560v2 is the latest variant of the XDS560 family of high-performance debug probes (emulators) for TI processors. With the fastest speeds and most features of the entire XDS family, XDS560v2 is the most comprehensive solution to debug TI microcontrollers, processors and wireless connectivity (...)

D3 Engineering RVP-TDAx development kits
Provided by D3 Engineering
These rugged development kits are in a finalized product form-factor that lets you evaluate TI ADAS technology under realistic on-vehicle conditions. Accelerate development of autonomous vision-based navigation systems for automotive, transportation and materials handling applications. The (...)

Software development

Software Development Kit for DRA829 & TDA4VM Jacinto™ processors
PROCESSOR-SDK-J721E Processor SDK RTOS (PSDK RTOS) can be used together with either Processor SDK Linux (PSDK Linux) or Processor SDK QNX (PSDK QNX) to form a multi-processor software development platform for TDA4VM and DRA829 SoCs within TI’s Jacinto™ platform. The SDK provides a comprehensive (...)
  • Detailed feature lists for each SDK can be found in the respective release notes links found on the SDK download pages
Hella Aglaia TDAx-based ADAS algorithms for front camera
Provided by Hella Aglaia HELLA Aglaia develops embedded software solutions for advanced driver assistance systems – compliant with certified industry standards and ready for hardware integration.

Leveraging the powerful deep learning capabilities of the TDA4x processor family, HELLA Aglaia’s robust image processing (...)

Momenta deep learning algorithms for ADAS forward camera applications on TDA4x processors
Provided by Momenta Momenta’s deep learning based algorithms for ADAS applications make full use of the DSP cores and accelerators on TDA4x for neural network processing. Designed to achieve market leading computational and power efficiency, Momenta’s algorithms offer an array of pre- and post-imaging (...)
Wind River Processors VxWorks and Linux operating systems
Provided by Wind River Systems Wind River is a global leader in delivering software for the Internet of Things (IoT). The company’s technology has been powering the safest, most secure devices in the world since 1981 and today is found in more than 2 billion products. Wind River offers a comprehensive edge-to-cloud product (...)
Code Composer Studio™ integrated development environment (IDE)
CCSTUDIO — Code Composer Studio؜™ software is an integrated development environment (IDE) that supports TI's microcontroller (MCU) and embedded processor portfolios. Code Composer Studio software comprises a suite of tools used to develop and debug embedded applications. The software includes an (...)
Provided by Green Hills Software — The flagship of Green Hills Software operating systems—the INTEGRITY RTOS—is built around a partitioning architecture to provide embedded systems with total reliability, absolute security, and maximum real-time performance. With its leadership pedigree underscored by certifications in a (...)
QNX Neutrino RTOS
Provided by QNX Software Systems — The QNX Neutrino® Realtime Operating System (RTOS) is a full-featured and robust RTOS designed to enable the next-generation of products for automotive, medical, transportation, military and industrial embedded systems. Microkernel design and modular architecture enable customers to create (...)
Evaluate deep learning inference performance on TDA4x processors
TI-EDGE-AI-CLOUD TI Edge AI Cloud is a free online service that lets you evaluate accelerated deep learning inference on TDA4x processors. You do not need to purchase an evaluation board. The service is python-based; and it only takes a few minutes to login, deploy a model, and get a variety of performance (...)
  • Connect to a TDA4x processor evaluation model via the cloud using only your web browser
  • Benchmark embedded deep learning inference in under 5 minutes
  • Get latency, frames-per-second processing, DDR bandwidth and accuracy benchmarks
  • Deploy a custom model in less than 30 minutes
  • Evaluate the software (...)

Design tools & simulation

Arm-based MPU, arm-based MCU and DSP third-party search tool
PROCESSORS-3P-SEARCH TI has partnered with companies to offer a wide range of software, tools, and SOMs using TI processors to accelerate your path to production. Download this search tool to quickly browse our third-party solutions and find the right third-party to meet your needs. The software, tools and modules (...)
  • Supports many TI processors including Sitara and Jacinto processors and DSPs
  • Search by type of product, TI devices supported, or country
  • Links and contacts for quick engagement
  • Third-party companies located around the world

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  • Qualification summary
  • Ongoing reliability monitoring

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