Ultra low power 0.25mA, RRO, fully differential amplifier
Product details
Parameters
Package | Pins | Size
Features
- Ultra Low Power:
- Voltage: 2.5 V to 5.5 V
- Current: 250 µA
- Power-Down Mode: 0.5 µA (typical)
- Fully-Differential Architecture
- Bandwidth: 36 MHz
- Slew Rate: 200 V/µs
- THD: –120 dBc at 1 kHz (1 VRMS, RL= 2 kΩ)
- Input Voltage Noise: 10 nV/√Hz (f = 1 kHz)
- High DC Accuracy:
- VOS Drift: ±4 µV/˚C (–40°C to +125°C)
- AOL: 114 dB
- Rail-to-Rail Output (RRO)
- Negative Rail Input (NRI)
- Output Common-Mode Control
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Description
The THS4531 is a low-power, fully-differential op amp with input common-mode range below the negative rail and rail-to-rail output. The device is designed for low-power data acquisition systems and high density applications where power consumption and dissipation is critical.
The device features accurate output common-mode control that allows for dc coupling when driving analog-to-digital converters (ADCs). This control, coupled with the input common-mode range below the negative rail and rail-to-rail output, allows for easy interface from single-ended ground-referenced signal sources to successive-approximation registers (SARs), and delta-sigma (ΔΣ) ADCs using only single-supply 2.5 V to 5 V power. The THS4531 is also a valuable tool for general-purpose, low-power differential signal conditioning applications.
The THS4531 is characterized for operation over the extended industrial temperature range from –40°C to +125°C. The following package options are available:
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The THS4531DGKEVM is designed to quickly and easily demonstrate the functionality and versatility of the amplifier. The EVM is ready to connect to power, signal source, and test instruments through the use of on-board connectors. The default amplifier configuration is single-ended input (...)
Features
Design tools & simulation
Features
- Leverages Cadence PSpice Technology
- Preinstalled library with a suite of digital models to enable worst-case timing analysis
- Dynamic updates ensure you have access to most current device models
- Optimized for simulation speed without loss of accuracy
- Supports simultaneous analysis of multiple products
- (...)
Reference designs
Design files
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download TIDA-00201 BOM.pdf (188KB) -
download TIDA-00201 Assembly Drawing.pdf (735KB) -
download TIDA-00201 PCB.pdf (3920KB) -
download TIDA-00201 CAD Files.zip (2429KB) -
download TIDA-00201 Gerber.zip (1523KB)
Design files
-
download TIDA-01012 BOM.pdf (135KB) -
download TIDA-01012 Assembly Drawing.pdf (639KB) -
download TIDA-01012 PCB.pdf (1928KB) -
download TIDA-01012 CAD Files.zip (1908KB) -
download TIDA-01012 Gerber.zip (1021KB)
Design files
-
download TIDA-01014 BOM.pdf (165KB) -
download TIDA-01014 Assembly Drawing.pdf (636KB) -
download TIDA-01014 PCB.pdf (4433KB) -
download TIDA-01014 CAD Files.zip (1901KB) -
download TIDA-01014 Gerber.zip (1229KB)
Design files
-
download TIDA-00499 BOM.zip (388KB) -
download TIDA-00499 Assembly Drawing.zip (289KB) -
download TIDA-00499 Layer Plots.zip (2806KB) -
download TIDA-00499 Layer Plots (Combined).zip (829KB) -
download TIDA-00499 Altium.zip (10108KB) -
download TIDA-00499 Gerber.zip (4384KB)
Design files
-
download TIPD117 Gerber.zip (306KB) -
download TIPD117 BOM.pdf (57KB)
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
QFN (RUN) | 10 | View options |
SOIC (D) | 8 | View options |
VSSOP (DGK) | 8 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
TI E2E™ forums with technical support from TI engineers
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