Power Management

DC/DC power modules

Innovative solutions to fit design constraints

TI’s broad portfolio of DC/DC modules integrate inductors, FETs, compensation, and other passive components into a single package to simplify prototyping, design, and manufacturing. Using a module reduces engineering time for design and verification to help speed development cycles for many applications, including personal electronics, industrial, and communications.

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Find your power module

TI has the most diverse portfolio of DC/DC power modules in the industry, covering a wide range of input voltages and output currents with a variety of package options. Using the graphic below, explore the power module portfolio and find the right device for your design.

High current open frameHigh current QFN Med current QFN High current leaded Low voltage QFN Med voltage QFN Med current leaded Low voltage microsip Med voltage microsip Wide voltage QFN

Select device by package type

MicroSiP™ package type

MicroSiP™

High performance, smallest size and high power density up to 430 mW/mm³ are ideal for space constrained applications.

Leaded package type

Leaded

TO-PMOD leaded packaging features a single ground pad and probeable pins for easy prototyping and mounting.

QFN package type

QFN

QFN modules with leadless packaging feature a small footprint for high density designs.

Open frame package type

Open frame

Non-isolated DC/DC converter power modules built on PC board substrates with SMD or through-hole interface pins.

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Select device by input voltage level