Figure 2-1 shows the building blocks of the CC13x1x3 and
CC26x1x3 device platform.
The CC13x1x3 and
CC26x1x3 device platform has the following features:
- Arm® Cortex®-M4 processor core
- 48 MHz RC oscillator and 48 MHz crystal oscillator
- 32 kHz crystal oscillator, 32 kHz RC oscillator, or low-power 48 MHz crystal derive clock for timing maintenance while in low-power modes
- Arm® Cortex® SysTick timer
- Nested vectored interrupt controller (NVIC)
- On-chip memory
- 352 kB of Flash with 8 kB of 4-way set-associative cache RAM for speed and low power
- 32 kB of System RAM with configurable retention in 16 kB blocks
- Power management
- Wide supply voltage range
- Efficient on-chip DC/DC converter for reduced power consumption
- High granularity clock gating and power gating of device parts
- Flexible frequency of operation
- Flexible low-power modes allowing low energy consumption in duty cycled applications
- Advanced serial integration
- Universal asynchronous receiver/transmitter (UART)
- Inter-integrated circuit (I2C) module
- Synchronous serial interface module (SSI)
- System integration
- Direct memory access (DMA) controller
- Four 32-bit timers (up to eight 16-bit) with pulse width modulation (PWM) capability and synchronization
- 12-bit analog-to-digital converter (ADC) with eight analog input channels
- Low-power analog comparator
- 32 kHz real-time clock (RTC)
- Watchdog timer
- On-chip temperature and supply voltage sensing
- GPIO with normal or high-drive capabilities
- GPIOs with analog capability for ADC and comparator
- Fully flexible digital pin muxing allows use as GPIO or any peripheral function
- IEEE 1149.7 compliant 2-pin cJTAG with legacy 1149.1 JTAG support
- 7 mm × 7 mm and 5 mm × 5 mm VQFN package
For applications requiring extreme conservation of power, the CC13x1x3 and
CC26x1x3 device platform features a power-management system to efficiently power down the devices to a low-power state during extended periods of inactivity. A power-up and power-down sequencer, a 32-bit sleep timer (an RTC), with interrupt and 32 kB of ultra-low-leakage (ULL) RAM with retention in all power modes positions the MCU perfectly for battery applications.
In addition, the CC13x1x3 and
CC26x1x3 device platform offers the advantages of the widely available development tools of Arm®, SoC infrastructure IP applications, and a large user community. Additionally, the microcontroller uses Arm Thumb®-compatible Thumb-2 instruction set to reduce memory requirements and, thereby, cost.
TI offers a complete solution to get to market quickly, with evaluation and development boards, white papers and application notes, an easy-to-use peripheral driver library, and a strong support, sales, and distributor network.