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  1.   Abstract
  2.   Trademarks
  3. 1Solving Assembly Issues with Chip Scale Power MOSFETs
  4. 2Land Grid Area (LGA) MOSFET Packaging Technology
  5. 3Wafer Level Chip Scale Packaging Technology
  6. 4Common Issues
  7. 5Best Practices
  8. 6Considerations When There are Problems
    1. 6.1 Tilted or Misaligned Packages
    2. 6.2 Solder Balls, Poor, or no Solder
    3. 6.3 Chipped or Cracked Devices
  9. 7Summary
  10. 8References

Abstract

Texas Instruments has shipped billions of chip scale power MOSFETs that go into a variety of applications and end equipment types. Because of their small size, high performance and proven reliability, customers often favor these devices over conventional, plastic packaged parts. In general, the small percentage of assembly issues discussed below can be avoided by following the recommendations in the documentation referenced in this article.