30V, N ch NexFET MOSFET™, single LGA 1.0 x 0.6mm, 117mOhm
Product details
Parameters
Features
- Ultra-Low On-Resistance
- Ultra-Low Qg and Qgd
- Low Threshold Voltage
- Ultra-Small Footprint (0402 Case Size)
- 1.0 mm × 0.6 mm
- Ultra-Low Profile
- 0.35 mm Height
- Integrated ESD Protection Diode
- Rated >4 kV HBM
- Rated >2 kV CDM
- Lead and Halogen Free
- RoHS Compliant
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Description
This 90 mΩ, 30 V N-Channel FemtoFET™ MOSFET technology is designed and optimized to minimize the footprint in many handheld and mobile applications. This technology is capable of replacing standard small signal MOSFETs while providing at least a 60% reduction in footprint size.
Technical documentation
= Top documentation for this product selected by TI
| Type | Title | Date | |
|---|---|---|---|
| * | Datasheet | CSD17381F4 30 V N-Channel FemtoFET MOSFET datasheet (Rev. E) | Dec. 13, 2017 |
| Technical articles | What type of ESD protection does your MOSFET include? | Jun. 22, 2020 | |
| Technical articles | Understanding the benefits of “lead-free” power MOSFETs | Feb. 07, 2019 | |
| User guide | Ultra-Small Footprint N-Channel FemtoFET™ MOSFET Test EVM | Dec. 06, 2017 | |
| User guide | FemtoFET Surface Mount Guide (Rev. D) | Jul. 07, 2016 | |
| Technical articles | When to use load switches in place of discrete MOSFETs | Feb. 03, 2016 | |
| Technical articles | 48V systems: Driving power MOSFETs efficiently and robustly | Oct. 08, 2015 | |
| Application note | Ringing Reduction Techniques for NexFET High Performance MOSFETs | Nov. 16, 2011 |
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
CSD1FNCHEVM-889
Description
This FemtoFET N-ch EVM includes seven daughter cards, each card containing a different FemtoFET N-ch part number. The daughter cards allow the engineer to easily connect and test these tiny devices. The seven FemtoFETs range from 12V to 40V Vds, and the size of the devices include F3 (...)
Features
- Easy handling of these Land Grid Array (LGA) packaged parts
- Full range of Vds and package size
- Seven daughter cards can be snapped to create individual boards, with one FET per daughter card
- FemtoFETs have the best Size*Resistance in the FET industry
Software development
SLPC019.ZIP (338 KB)
Design tools & simulation
SLPM073A.ZIP (3 KB) - PSpice Model
SLPM134.TSM (7 KB) - TINA-TI Spice Model
FETPWRCALC — This tool is designed to assist engineers in the selection of Texas Instruments’ discrete power MOSFET and Power Block devices for their synchronous buck design. Users can input the conditions for their power supply and compare various discrete and power block solutions by power loss, relative (...)
Features
- Vary power supply conditions and observe TI’s most efficient solutions for any set of input parameters
- Select from a pre-established list of TI controllers or enter your own custom IC
- Rank solutions by effective power loss and compare by relative 1k price, device package, and total PCB footprint
- (...)
MOSFET-LOSS-CALC — The MOSFET-LOSS-CALC is an Excel based tool that allows users to estimate power loss in a synchronous buck converter based on system and MOSFET parameters. For help selecting a discrete MOSFET or power block solution for your buck converter application, check out our Buck Converter NexFET™ selection (...)
NONSYNC-BOOST-FET-LOSS-CALC — MOSFET power loss calculator for non-synchronous boost converter
Features
- Calculates power loss for TI MOSFETs
SLPC015.ZIP (66 KB)
Reference designs
TIDA-01352 — The TIDA-01352 enables modular and efficient power scaling capability by providing a solution for digitally programmable power supply for powering ultrasound transmit circuit. The design uses push-pull topology to generate high-voltage (HV) and low- (LV) or MID- voltage power supplies. The HV rails (...)
Design files
-
download TIDA-01352 BOM.pdf (113KB) -
download TIDA-01352 Assembly Drawing.pdf (659KB) -
download TIDA-01352 PCB.pdf (3635KB) -
download TIDA-01352 CAD Files.zip (6527KB) -
download TIDA-01352 Gerber.zip (3231KB)
CAD/CAE symbols
| Package | Pins | Download |
|---|---|---|
| (YJC) | 3 | View options |
Ordering & quality
Information included:
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Support & training
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