This 14.6 mΩ, 12 V, N-Channel device is designed to deliver the lowest on resistance and gate charge in a small 1 × 1 mm outline with excellent thermal characteristics and an ultra low profile.
| Top documentation | Type | Title | Format options | Date |
|---|---|---|---|---|
| * | Data sheet | CSD13302W 12 V N Channel NexFET Power MOSFET datasheet | PDF | HTML | Mar 16, 2015 |
| Application brief | Estimating Leakage Currents of Power MOSFETs | PDF | HTML | Oct 31, 2025 | |
| Application note | MOSFET Support and Training Tools (Rev. G) | PDF | HTML | Oct 27, 2025 | |
| Application note | Semiconductor and IC Package Thermal Metrics (Rev. D) | PDF | HTML | Mar 25, 2024 | |
| Application note | Using MOSFET Transient Thermal Impedance Curves In Your Design | PDF | HTML | Dec 18, 2023 | |
| Application note | Solving Assembly Issues with Chip Scale Power MOSFETs | PDF | HTML | Dec 14, 2023 | |
| Application note | Using MOSFET Safe Operating Area Curves in Your Design | PDF | HTML | Mar 13, 2023 | |
| Application brief | Tips for Successfully Paralleling Power MOSFETs | PDF | HTML | May 31, 2022 | |
| Application note | AN-1112 DSBGA Wafer Level Chip Scale Package (Rev. AI) | Jun 14, 2019 |
For additional terms or required resources, click any title below to view the detail page where available.
The TPS63802HDKEVM is a universal development tool designed to help the users easily and quickly evaluate and test the most common buck-boost converter use-cases. The use-cases include backup power, input current limit, LED driver, digital voltage scaling, bypass mode and precise enable. The user (...)
| Package | Pins | CAD symbols, footprints & 3D models |
|---|---|---|
| DSBGA (YZB) | 4 | Ultra Librarian |
Recommended products may have parameters, evaluation modules or reference designs related to this TI product.
Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.
If you have questions about quality, packaging or ordering TI products, see TI support.