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Power management

Isolated DC/DC converters & modules

Simplify your isolated DC/DC design

Our portfolio of isolated bias supplies, isolated modules and isolated power converters compromises high-density integrated-FET converters and integrated-transformer modules to reduce your power supply BOM count and simplify your isolated DC/DC design. Transformer drivers with external transformers can provide a simple isolated power solution. To achieve the best combination of flexibility and power up to 20 W, look to the primary side regulated (PSR) flyback and Fly-Buck™ converter portfolios that can be optimized for performance with an external transformer.  Select an integrated-transformer module to further reduce design time and complexity to help you get to market faster with an easy-to-use isolated power supply. 


Our isolated power modules increase performance and reduces solution size. Featured products include TI’s integrated transformer technology with certified isolation.


Simplify the task of generating one or more isolated positive and negative supplies using a small number of off-the-shelf external components. These devices do not require an optocoupler and can be used for cost-costrained isolated applications.

Transformer drivers

Our compact push-pull transformer drivers and LLC transformer drivers provide a simple, low-EMI, isolated power supply and are ideal for cost-constrained applications when compared to integrated isolated power solutions.  

What is integrated transformer technology? 

Our newest isolation technology miniaturizes and integrates the power transfer with ultra-low-EMI for high-density DC/DC power conversion.

The IC-sized, single-package, surface-mount devices give you an easy-to-use solution with low height, reduced BOM and improved temperature performance. The EMI-optimized transformer and quiet control scheme streamline EMI compliance while providing a reliable solution with reinforced or basic isolation.

Power trends

Power management is at the center of enabling the continued integration of electronics in our lives. For decades, TI has been at the forefront of developing new process, packaging and circuit-design technologies to deliver the best power devices for your design. Check out our featured isolation products below, designed to help you address power density, low EMI and isolation. 

Isolated bias supplies for power density, low EMI & isolation

These unique solutions can shrink your power solution by as much as 80% and maximize efficiency in high-voltage industrial applications with high-density.  The 16-pin SOIC package measures 10.3 mm by 10.3 mm by 2.65 mm and offers 60% efficiency – twice that of competing devices of similar size – and twice the power density of comparative isolated power modules. Delivering 0.5 W in the new architecture improves reliability, enables a small BOM and simplifies board layout. These devices also offer ultra-low EMI and eliminate external filter components such as low-dropout regulators and ferrite beads normally required to meet EMI certification, which significantly reduces component selection and design time.  The devices are available with reinforced or wide isolation and a wide temperature range (extended -40°C to 125°C), to deliver more power in extreme conditions.


500-mW, 5-kVRMS reinforced isolated DC/DC converter with integrated transformer enables ultra-small form factor isolated power supply designs with low-EMI from a 4.5-V to 5.5-V DC power supply.


High-efficiency, low-EMI, 3-kVRMS basic isolation DC/DC converter

Featured resources

Power through the isolation barrier

This paper examines various isolated DC/DC bias power supplies to move signals and power across the isolation barrier to help you transfer signals and power across the isolation barrier safely

Achieving EMI reduction in power supplies

This paper examines EMI in switch-mode power supplies, and provides technology examples to help designers quickly and easily pass industry-standard EMI tests

Save space with our isolated bias supplies

This article highlights how to reduce the number components in the PCB area while increasing power density by at least 50% with our UCC1205x family of devices