Home Energiemanagement Leistungsstufen Galliumnitrid (GaN)-Leistungsstufen
NEU

LMG2656

AKTIV

650 V 230 mΩ GaN-Halbbrücke mit integriertem Treiber, Schutz und Strommessung

Produktdetails

VDS (max) (V) 650 RDS(on) (mΩ) 230 ID (max) (A) 3.6 Features Bottom-side cooled, Built-in bootstrap diode, Cycle-by-cycle overcurrent protection, Half-bridge, Integrated current sense, Overtemperature protection Rating Catalog Operating temperature range (°C) -40 to 125
VDS (max) (V) 650 RDS(on) (mΩ) 230 ID (max) (A) 3.6 Features Bottom-side cooled, Built-in bootstrap diode, Cycle-by-cycle overcurrent protection, Half-bridge, Integrated current sense, Overtemperature protection Rating Catalog Operating temperature range (°C) -40 to 125
VQFN (RFB) 19 48 mm² 8 x 6
  • 650V GaN power-FET half bridge
  • 230mΩ low-side and high-side GaN FETs
  • Integrated gate drivers with <100ns low propagation delays
  • Programmable turn-on slew rate control
  • Current-sense emulation with high-bandwidth and high accuracy
  • Low-side referenced (INH) and high-side referenced (GDH) high-side gate drive pins
  • Low-side (INL) / high-side (INH) gate-drive interlock
  • High-side (INH) gate-drive signal level shifter
  • Smart-switched bootstrap diode function
  • High-side start up: <8µs
  • Low-side / high-side cycle-by-cycle overcurrent protection
  • Overtemperature protection
  • AUX idle quiescent current: 250µA
  • AUX standby quiescent current: 50µA
  • BST idle quiescent current: 70µA
  • 8mm × 6mm QFN package with dual thermal pads
  • 650V GaN power-FET half bridge
  • 230mΩ low-side and high-side GaN FETs
  • Integrated gate drivers with <100ns low propagation delays
  • Programmable turn-on slew rate control
  • Current-sense emulation with high-bandwidth and high accuracy
  • Low-side referenced (INH) and high-side referenced (GDH) high-side gate drive pins
  • Low-side (INL) / high-side (INH) gate-drive interlock
  • High-side (INH) gate-drive signal level shifter
  • Smart-switched bootstrap diode function
  • High-side start up: <8µs
  • Low-side / high-side cycle-by-cycle overcurrent protection
  • Overtemperature protection
  • AUX idle quiescent current: 250µA
  • AUX standby quiescent current: 50µA
  • BST idle quiescent current: 70µA
  • 8mm × 6mm QFN package with dual thermal pads

The LMG2656 is a 650V 230mΩ GaN power-FET half bridge. The LMG2656 simplifies design, reduces component count, and reduces board space by integrating half-bridge power FETs, gate drivers, bootstrap FET, and high-side gate-drive level shifter in a 6mm by 8mm QFN package.

Programmable turn-on slew rates provide EMI and ringing control. The low-side current-sense emulation reduces power dissipation compared to the traditional current-sense resistor and allows the low-side thermal pad to be connected to PCB power ground.

The high-side GaN power FET can be controlled with either the low-side referenced gate-drive pin (INH) or the high-side referenced gate-drive pin (GDH). The high-side gate-drive signal level shifter reliably transmits the INH pin signal to the high-side gate driver in challenging power switching environments. The smart-switched GaN bootstrap FET has no diode forward-voltage drop, avoids overcharging the high-side supply, and has zero reverse-recovery charge.

The LMG2656 supports converter light-load efficiency requirements and burst-mode operation with low quiescent currents and fast start-up times. Protection features include FET turn-on interlock, under-voltage lockout (UVLO), cycle-by-cycle current limit, and over-temperature shut down. Ultra low slew rate setting supports motor drive applications.

The LMG2656 is a 650V 230mΩ GaN power-FET half bridge. The LMG2656 simplifies design, reduces component count, and reduces board space by integrating half-bridge power FETs, gate drivers, bootstrap FET, and high-side gate-drive level shifter in a 6mm by 8mm QFN package.

Programmable turn-on slew rates provide EMI and ringing control. The low-side current-sense emulation reduces power dissipation compared to the traditional current-sense resistor and allows the low-side thermal pad to be connected to PCB power ground.

The high-side GaN power FET can be controlled with either the low-side referenced gate-drive pin (INH) or the high-side referenced gate-drive pin (GDH). The high-side gate-drive signal level shifter reliably transmits the INH pin signal to the high-side gate driver in challenging power switching environments. The smart-switched GaN bootstrap FET has no diode forward-voltage drop, avoids overcharging the high-side supply, and has zero reverse-recovery charge.

The LMG2656 supports converter light-load efficiency requirements and burst-mode operation with low quiescent currents and fast start-up times. Protection features include FET turn-on interlock, under-voltage lockout (UVLO), cycle-by-cycle current limit, and over-temperature shut down. Ultra low slew rate setting supports motor drive applications.

Herunterladen Video mit Transkript ansehen Video

Technische Dokumentation

star =Von TI ausgewählte Top-Empfehlungen für dieses Produkt
Keine Ergebnisse gefunden. Bitte geben Sie einen anderen Begriff ein und versuchen Sie es erneut.
Alle anzeigen 1
Top-Dokumentation Typ Titel Format-Optionen Datum
* Data sheet LMG2656 650V 230 mΩ GaN Half Bridge With Integrated Driver and Current Sense Emulation datasheet PDF | HTML 27 Jun 2025

Design und Entwicklung

Weitere Bedingungen oder erforderliche Ressourcen enthält gegebenenfalls die Detailseite, die Sie durch Klicken auf einen der unten stehenden Titel erreichen.

Tochterkarte

LMG2656EVM-102 — LMG2656-Tochterkarte

Das LMG2656EVM-102 wurde entwickelt, um eine schnelle und einfache Plattform für die Evaluierung der integrierten GaN-Bausteine von TI in beliebigen Halbbrückentopologien zu bieten. Die Platine ist für die Anbindung an ein größeres System unter Verwendung der sechs Stromversorgungspins und (...)

Benutzerhandbuch: PDF | HTML
Simulationsmodell

LMG2656 SIMPLIS Model

SNOM812.ZIP (28 KB) - SIMPLIS Model
Berechnungstool

LMGXX-GAN-LLC-CALC GaN LLC resonant converter device loss calculator

Device Loss Calculator can be used to evaluate different devices for different topologies of the LLC Resonant Converter
Unterstützte Produkte und Hardware

Unterstützte Produkte und Hardware

Gehäuse Pins CAD-Symbole, Footprints und 3D-Modelle
VQFN (RFB) 19 Ultra Librarian

Bestellen & Qualität

Beinhaltete Information:
  • RoHS
  • REACH
  • Bausteinkennzeichnung
  • Blei-Finish/Ball-Material
  • MSL-Rating / Spitzenrückfluss
  • MTBF-/FIT-Schätzungen
  • Materialinhalt
  • Qualifikationszusammenfassung
  • Kontinuierliches Zuverlässigkeitsmonitoring
Beinhaltete Information:
  • Werksstandort
  • Montagestandort

Empfohlene Produkte können Parameter, Evaluierungsmodule oder Referenzdesigns zu diesem TI-Produkt beinhalten.

Support und Schulungen

TI E2E™-Foren mit technischem Support von TI-Ingenieuren

Inhalte werden ohne Gewähr von TI und der Community bereitgestellt. Sie stellen keine Spezifikationen von TI dar. Siehe Nutzungsbedingungen.

Bei Fragen zu den Themen Qualität, Gehäuse oder Bestellung von TI-Produkten siehe TI-Support. ​​​​​​​​​​​​​​

Videos