SPRABY1B February 2015 – November 2026 F28M35E20B , F28M35H22C , F28M35H52C , F28M35H52C-Q1 , F28M35M22C , F28M35M52C , F28M36H33B2 , F28M36H53B2 , F28M36P53C2 , F28M36P63C2 , F29H850DM , F29H850TU , F29H859TU-Q1 , F29P329SM-Q1 , F29P589DM-Q1 , F29P589DU-Q1 , SM320F2801-EP , TMS320C28341 , TMS320C28342 , TMS320C28343 , TMS320C28343-Q1 , TMS320C28344 , TMS320C28345 , TMS320C28346 , TMS320C28346-Q1 , TMS320F280021 , TMS320F280021-Q1 , TMS320F280023 , TMS320F280023-Q1 , TMS320F280023C , TMS320F280025 , TMS320F280025-Q1 , TMS320F280025C , TMS320F280025C-Q1 , TMS320F280040-Q1 , TMS320F280040C-Q1 , TMS320F280041 , TMS320F280041-Q1 , TMS320F280041C , TMS320F280041C-Q1 , TMS320F280045 , TMS320F280048-Q1 , TMS320F280048C-Q1 , TMS320F280049 , TMS320F280049-Q1 , TMS320F280049C , TMS320F280049C-Q1 , TMS320F2801 , TMS320F2801-Q1 , TMS320F28015 , TMS320F28016 , TMS320F28016-Q1 , TMS320F2802 , TMS320F2802-Q1 , TMS320F28020 , TMS320F280200 , TMS320F28021 , TMS320F28022 , TMS320F28022-Q1 , TMS320F28023 , TMS320F28023-Q1 , TMS320F280230 , TMS320F28026 , TMS320F28026-Q1 , TMS320F28026F , TMS320F28027 , TMS320F28027-Q1 , TMS320F28027F , TMS320F28027F-Q1 , TMS320F28030 , TMS320F28030-Q1 , TMS320F28031 , TMS320F28031-Q1 , TMS320F28032 , TMS320F28032-Q1 , TMS320F28033 , TMS320F28033-Q1 , TMS320F28034 , TMS320F28034-Q1 , TMS320F28035 , TMS320F28035-EP , TMS320F28035-Q1 , TMS320F28044 , TMS320F28050 , TMS320F28051 , TMS320F28052 , TMS320F28052-Q1 , TMS320F28052F , TMS320F28052F-Q1 , TMS320F28053 , TMS320F28054 , TMS320F28054-Q1 , TMS320F28054F , TMS320F28054F-Q1 , TMS320F28054M , TMS320F28054M-Q1 , TMS320F28055 , TMS320F2806 , TMS320F2806-Q1 , TMS320F28062 , TMS320F28062-Q1 , TMS320F28062F , TMS320F28062F-Q1 , TMS320F28063 , TMS320F28064 , TMS320F28065 , TMS320F28066 , TMS320F28066-Q1 , TMS320F28067 , TMS320F28067-Q1 , TMS320F28068F , TMS320F28068M , TMS320F28069 , TMS320F28069-Q1 , TMS320F28069F , TMS320F28069F-Q1 , TMS320F28069M , TMS320F28069M-Q1 , TMS320F2808 , TMS320F2808-Q1 , TMS320F2809 , TMS320F2810 , TMS320F2810-Q1 , TMS320F2811 , TMS320F2811-Q1 , TMS320F2812 , TMS320F2812-Q1 , TMS320F28232 , TMS320F28232-Q1 , TMS320F28234 , TMS320F28234-Q1 , TMS320F28235 , TMS320F28235-Q1 , TMS320F28332 , TMS320F28333 , TMS320F28334 , TMS320F28335 , TMS320F28335-Q1 , TMS320F28374D , TMS320F28374S , TMS320F28375D , TMS320F28375S , TMS320F28375S-Q1 , TMS320F28376D , TMS320F28376S , TMS320F28377D , TMS320F28377D-EP , TMS320F28377D-Q1 , TMS320F28377S , TMS320F28377S-Q1 , TMS320F28378D , TMS320F28378S , TMS320F28379D , TMS320F28379D-Q1 , TMS320F28379S , TMS320F28384D , TMS320F28384S , TMS320F28386D , TMS320F28386S , TMS320F28388D , TMS320F28388S , TMS320F28P650DH , TMS320F28P650DK , TMS320F28P650SH , TMS320F28P650SK , TMS320F28P659DH-Q1 , TMS320F28P659DK-Q1 , TMS320F28P659SH-Q1
The MSL rating of an IC determines its floor life before board mounting after the drypack packing (MSL2 and higher number ratings) has been opened. Each drypack bag includes a desiccant and a humidity control card, which should be checked immediately after opening the drypack bag for current IC package status.
IPC/JEDEC J-STD-033 is the electronics industry standard for handling, packing, shipping and use of Moisture, Reflow and Process sensitive devices. This standard includes a factory floor life table at 30°C dependant on the component MSL rating, as shown in Table 2-1.
| MSL | Floor Life | Moisture Relative Humidity |
|---|---|---|
| 1 | Unlimited | 85% RH |
| 2 | 1 year | 60% RH |
| 2a | 4 weeks | |
| 3 | 168 hours | |
| 4 | 72 hours | |
| 5 | 48 hours | |
| 5a | 24 hours | |
| 6 | Bake before use and reflow within time on label |
Most semiconductor products are rated MSL3 or higher. MSL 1 is the highest rating where it is considered as being not moisture sensitive even at 85% RH and components rated MSL1 do not require dry packing.
The MSL rating is given after product qualification and determined by the materials used in its IC packaging and assembly process is based on a constant 30°C and constant relative humidity. In practice, the absorption of moisture into an IC package is proportional to temperature and relative humidity.
Therefore, floor life can generally be increased with exposure to temperatures lower than 30°C or lower humidity levels than 60% RH.
Similarly, exposing it to higher humidity conditions or higher temperatures potentially shortens the floor life.
The Recommended Equivalent Total Floor Life table in IPC/JEDEC J-STD-033C provides guidance on floor life for differing temperatures (20°C to 35°C) and a range of relative humidity (5% to 95%) for different package types and thicknesses.
Products that exceed their floor life can be re-worked with a bake to drive out residual moisture. The Reference Conditions for Drying Mounted or Unmounted SMD Packages table in IPC/JEDEC J-STD-033C provides guidance about the baking procedure and where you should take care to ensure that the plastic housing (trays, tape and reel or tubes) can withstand the temperatures being considered. Tape and Reel material should not be baked above 40°C due to risk of the packing material properties changes. A vacuum bake may be considered for IC packages without internal cavities.
For IC products with MSL Rating 2 and lower, the floor life needs to also be considered after a first reflow soldering process. Moisture from the environment where the boards are stored will ingress into the package. A bake of the assembled board may be required prior additional soldering process steps, Rework steps and other process steps with temperatures above the local water boiling point.