TMS320C28341

ACTIVE

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Delfino™ 32-bit MCU with 200 MIPS, FPU, 196 KB RAM, EMIF

• High-Performance Static CMOS Technology
  • Up to 300 MHz (3.33-ns Cycle Time)
  • 1.1-V/1.2-V Core, 3.3-V I/O, 1.8-V PLL/Oscillator Design
• High-Performance 32-Bit CPU (TMS320C28x)
  • IEEE 754 Single-Precision Floating-Point Unit (FPU)
  • 16 × 16 and 32 × 32 MAC Operations
  • 16 × 16 Dual MAC
  • Harvard Bus Architecture
  • Fast Interrupt Response and Processing
  • Code-Efficient (in C/C++ and Assembly)
• Six-Channel DMA Controller (for McBSP, XINTF, and SARAM)
• 16-Bit or 32-Bit External Interface (XINTF)
  • More Than 2M × 16 Address Reach
• On-Chip Memory
  • Up to 258K × 16 SARAM
  • 8K × 16 Boot ROM
• Clock and System Control
  • On-Chip Oscillator
  • Watchdog Timer Module
• Peripheral Interrupt Expansion (PIE) Block That Supports All 64 Peripheral Interrupts
• Endianness: Little Endian
• Enhanced Control Peripherals
  • Eighteen Enhanced Pulse Width Modulator (ePWM) Outputs
    • Dedicated 16-Bit Time-Based Counter With Period and Frequency Control
    • Single-Edge, Dual-Edge Symmetric, or Dual-Edge Asymmetric Outputs
    • Dead-Band Generation
    • PWM Chopping by High-Frequency Carrier
    • Trip Zone Input
    • Up to 9 HRPWM Outputs With 55-ps MEP Resolution at V_DD = 1.1 V (65 ps at 1.2 V)
  • Six 32-Bit Enhanced Capture (eCAP) Modules
    • Configurable as 3 Capture Inputs or 3 Auxiliary Pulse Width Modulator Outputs
    • Single-Shot Capture of up to Four Event Timestamps
  • Three 32-Bit Quadrature Encoder Pulse (QEP) Modules
  • Six 32-Bit Timers and Nine 16-Bit Timers
• Three 32-Bit CPU Timers
• Serial Port Peripherals
  • Up to 2 CAN Modules
  • Up to 3 SCI (UART) Modules
  • Up to 2 McBSP Modules (Configurable as SPI)
  • Up to 2 SPI Modules
  • One Inter-Integrated Circuit (I2C) Bus
• External ADC Interface
• Up to 88 Individually Programmable, Multiplexed GPIO Pins With Input Filtering
• Advanced Emulation Features
  • Analysis and Breakpoint Functions
  • Real-Time Debug Using Hardware
• Package Options:
  • 256-Ball Plastic Ball Grid Array (BGA) (ZFE)
  • 179-Ball MicroStar BGA™ (ZHH)
• Temperature Options:
  • T: –40°C to 105°C (ZFE, ZHH)
  • S: –40°C to 125°C (ZFE)
  • Q: –40°C to 125°C (ZFE)
    (AEC Q100 Qualification for Automotive Applications)

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