SM320F2801-EP

ACTIVE

Product details

CPU 1 C28 Frequency (MHz) 100 Flash memory (kByte) 32 RAM (kByte) 12 ADC type 12-bit Total processing (MIPS) 100 Features 2-pin oscillator, 32-bit CPU timers, Watchdog timer UART 1 CAN (#) 1 Sigma-delta filter 0 PWM (Ch) 6 Number of ADC channels 16 Direct memory access (Ch) 0 SPI 2 QEP 1 USB No Hardware accelerators CPU only Edge AI enabled Yes Operating temperature range (°C) -55 to 125 Rating HiRel Enhanced Product Communication interface CAN, I2C, SPI, UART Operating system BareMetal (No OS) Nonvolatile memory (kByte) 32 Number of GPIOs 35 Security Secure storage
CPU 1 C28 Frequency (MHz) 100 Flash memory (kByte) 32 RAM (kByte) 12 ADC type 12-bit Total processing (MIPS) 100 Features 2-pin oscillator, 32-bit CPU timers, Watchdog timer UART 1 CAN (#) 1 Sigma-delta filter 0 PWM (Ch) 6 Number of ADC channels 16 Direct memory access (Ch) 0 SPI 2 QEP 1 USB No Hardware accelerators CPU only Edge AI enabled Yes Operating temperature range (°C) -55 to 125 Rating HiRel Enhanced Product Communication interface CAN, I2C, SPI, UART Operating system BareMetal (No OS) Nonvolatile memory (kByte) 32 Number of GPIOs 35 Security Secure storage
LQFP (PZ) 100 256 mm² 16 x 16
  • Controlled Baseline
    • One Assembly/Test/Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • High-Performance Static CMOS Technology
    • 100 MHz (10-ns Cycle Time)
    • Low-Power (1.8-V Core, 3.3-V I/O) Design
    • 3.3-V Flash Voltage
  • JTAG Boundary Scan Support
  • High-Performance 32-Bit CPU (TMS320C28x)
    • 16 x 16 and 32 x 32 MAC Operations
    • 16 x 16 Dual MAC
    • Harvard Bus Architecture
    • Atomic Operations
    • Fast Interrupt Response and Processing
    • Unified Memory Programming Model
    • Code-Efficient (in C/C++ and Assembly)
  • On-Chip Memory
    • F2808: 64K X 16 Flash, 18K X 16 SARAM
      F2806: 32K X 16 Flash, 10K X 16 SARAM
      F2801: 16K X 16 Flash, 6K X 16 SARAM
      9501: 16K X 16 Flash, 6K X 16 SARAM
    • 1K x 16 OTP ROM
  • Boot ROM (4K x 16)
    • With Software Boot Modes (via SCI, SPI, CAN, I2C, and Parallel I/O)
    • Standard Math Tables
  • Clock and System Control
    • Dynamic PLL Ratio Changes Supported
    • On-Chip Oscillator
    • Clock-Fail-Detect Mode
    • Watchdog Timer Module
  • Any GPIO A Pin Can Be Connected to One of the Three External Core Interrupts
  • Peripheral Interrupt Expansion (PIE) Block That Supports All 43 Peripheral Interrupts
  • 128-Bit Security Key/Lock
    • Protects Flash/OTP/L0/L1 Blocks
    • Prevents Firmware Reverse Engineering
  • Enhanced Control Peripherals
    • Up to 16 PWM Outputs
    • Up to Four HRPWM Outputs With 150 ps MEP Resolution
    • Up to Four Capture Inputs
    • Up to Two Quadrature Encoder Interfaces
    • Up to Six 32-bit Timers
    • Up to Six 16-bit Timers
  • Three 32-Bit CPU Timers
  • Serial Port Peripherals
    • Up to Four Serial Peripheral Interface (SPI) Modules
    • Up to Two Serial Communications Interface (SCI), Standard UART Modules
    • Up to Two Enhanced Controller Area Network (eCAN) Modules
    • One Inter-Integrated-Circuit (I2C) Bus
  • 12-Bit ADC, 16 Channels
    • 2 x 8 Channel Input Multiplexer
    • Two Sample-and-Hold
    • Single/Simultaneous Conversions
    • Fast Conversion Rate: 160 ns/6.25 MSPS
    • Internal or External Reference
  • Up to 35 Individually Programmable, Multiplexed General-Purpose Input/Output (GPIO) Pins With Input Filtering
  • Advanced Emulation Features
    • Analysis and Breakpoint Functions
    • Real-Time Debug via Hardware
  • Low-Power Modes and Power Savings
    • IDLE, STANDBY, HALT Modes Supported
    • Disable Individual Peripheral Clocks
  • Package Options
    • Thin Quad Flatpack (PZ)
    • MicroStar BGA™ (GGM, ZGM)
  • Temperature Options:
    • M: -55°C to 125°C (PZ)

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

MicroStar BGA, TMS320C28x, MicroStar, C28x, TMS320C2000, DSP/BIOS, Code Composer Studio, TMS320 are trademarks of Texas Instruments.
eZdsp, XDS510USB are trademarks of Spectrum Digital.

  • Controlled Baseline
    • One Assembly/Test/Fabrication Site
  • Enhanced Diminishing Manufacturing Sources (DMS) Support
  • Enhanced Product-Change Notification
  • Qualification Pedigree(1)
  • High-Performance Static CMOS Technology
    • 100 MHz (10-ns Cycle Time)
    • Low-Power (1.8-V Core, 3.3-V I/O) Design
    • 3.3-V Flash Voltage
  • JTAG Boundary Scan Support
  • High-Performance 32-Bit CPU (TMS320C28x)
    • 16 x 16 and 32 x 32 MAC Operations
    • 16 x 16 Dual MAC
    • Harvard Bus Architecture
    • Atomic Operations
    • Fast Interrupt Response and Processing
    • Unified Memory Programming Model
    • Code-Efficient (in C/C++ and Assembly)
  • On-Chip Memory
    • F2808: 64K X 16 Flash, 18K X 16 SARAM
      F2806: 32K X 16 Flash, 10K X 16 SARAM
      F2801: 16K X 16 Flash, 6K X 16 SARAM
      9501: 16K X 16 Flash, 6K X 16 SARAM
    • 1K x 16 OTP ROM
  • Boot ROM (4K x 16)
    • With Software Boot Modes (via SCI, SPI, CAN, I2C, and Parallel I/O)
    • Standard Math Tables
  • Clock and System Control
    • Dynamic PLL Ratio Changes Supported
    • On-Chip Oscillator
    • Clock-Fail-Detect Mode
    • Watchdog Timer Module
  • Any GPIO A Pin Can Be Connected to One of the Three External Core Interrupts
  • Peripheral Interrupt Expansion (PIE) Block That Supports All 43 Peripheral Interrupts
  • 128-Bit Security Key/Lock
    • Protects Flash/OTP/L0/L1 Blocks
    • Prevents Firmware Reverse Engineering
  • Enhanced Control Peripherals
    • Up to 16 PWM Outputs
    • Up to Four HRPWM Outputs With 150 ps MEP Resolution
    • Up to Four Capture Inputs
    • Up to Two Quadrature Encoder Interfaces
    • Up to Six 32-bit Timers
    • Up to Six 16-bit Timers
  • Three 32-Bit CPU Timers
  • Serial Port Peripherals
    • Up to Four Serial Peripheral Interface (SPI) Modules
    • Up to Two Serial Communications Interface (SCI), Standard UART Modules
    • Up to Two Enhanced Controller Area Network (eCAN) Modules
    • One Inter-Integrated-Circuit (I2C) Bus
  • 12-Bit ADC, 16 Channels
    • 2 x 8 Channel Input Multiplexer
    • Two Sample-and-Hold
    • Single/Simultaneous Conversions
    • Fast Conversion Rate: 160 ns/6.25 MSPS
    • Internal or External Reference
  • Up to 35 Individually Programmable, Multiplexed General-Purpose Input/Output (GPIO) Pins With Input Filtering
  • Advanced Emulation Features
    • Analysis and Breakpoint Functions
    • Real-Time Debug via Hardware
  • Low-Power Modes and Power Savings
    • IDLE, STANDBY, HALT Modes Supported
    • Disable Individual Peripheral Clocks
  • Package Options
    • Thin Quad Flatpack (PZ)
    • MicroStar BGA™ (GGM, ZGM)
  • Temperature Options:
    • M: -55°C to 125°C (PZ)

(1) Component qualification in accordance with JEDEC and industry standards to ensure reliable operation over an extended temperature range. This includes, but is not limited to, Highly Accelerated Stress Test (HAST) or biased 85/85, temperature cycle, autoclave or unbiased HAST, electromigration, bond intermetallic life, and mold compound life. Such qualification testing should not be viewed as justifying use of this component beyond specified performance and environmental limits.

MicroStar BGA, TMS320C28x, MicroStar, C28x, TMS320C2000, DSP/BIOS, Code Composer Studio, TMS320 are trademarks of Texas Instruments.
eZdsp, XDS510USB are trademarks of Spectrum Digital.

The SM320F2808, F2806, and F2801/UCD9501 devices, members of the TMS320C28x™ DSP generation, are highly integrated, high-performance solutions for demanding control applications. The UCD9501 is a 32-bit digital signal controller for power management.

Throughout this document, SM320F2808, F2806, and F2801/UCD9501 are abbreviated as F2808, F2806, and F2801/9501, respectively. TMS320x280x device reference guides, flash tools, and other collateral are applicable to the UCD9501 device as well.

The SM320F2808, F2806, and F2801/UCD9501 devices, members of the TMS320C28x™ DSP generation, are highly integrated, high-performance solutions for demanding control applications. The UCD9501 is a 32-bit digital signal controller for power management.

Throughout this document, SM320F2808, F2806, and F2801/UCD9501 are abbreviated as F2808, F2806, and F2801/9501, respectively. TMS320x280x device reference guides, flash tools, and other collateral are applicable to the UCD9501 device as well.

Download View video with transcript Video

Technical documentation

star =Top documentation for this product selected by TI
No results found. Please clear your search and try again.
View all 8
Top documentation Type Title Format options Date
* Data sheet Digital Signal Processors datasheet (Rev. A) 08 Feb 2007
* Errata TMS320F280x, TMS320C280x, TMS320F2801x DSPs Silicon Errata (Rev. T) PDF | HTML 28 Sep 2020
* VID SM320F2801-EP VID V6206619 21 Jun 2016
* VID SM320F2801-EP VID V6206619 21 Jun 2016
* Radiation & reliability report SM320F2801PZMEP Reliability Report 26 Oct 2011
Application note Calculating Useful Lifetimes of Embedded Processors (Rev. B) PDF | HTML 07 May 2019
Application note MSL Ratings and Reflow Profiles (Rev. A) 13 Dec 2018
Application note Calculating FIT for a Mission Profile 24 Mar 2015

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Debug probe

TMDSEMU200-U — XDS200 USB Debug Probe

The XDS200 is a debug probe (emulator) used for debugging TI embedded devices. For the majority of devices it is recommended to use the newer, lower cost XDS110 (www.ti.com/tool/TMDSEMU110-U). The XDS200 supports a wide variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a single pod. All XDS (...)

Not available on TI.com
Debug probe

TMDSEMU560V2STM-U — XDS560™ software v2 system trace USB debug probe

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).  Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

Not available on TI.com
Debug probe

TMDSEMU560V2STM-UE — XDS560v2 System Trace USB & Ethernet Debug Probe

The XDS560v2 is the highest performance of the XDS560™ family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).

All XDS debug probes support Core and System Trace in all ARM and DSP processors (...)

Not available on TI.com
Firmware

USIT-3P-SECIC-HSM — Uni-Sentry SecIC-HSM Firmware

The SecIC-HSM is designed to meet the cybersecurity requirements needed for MCU/SoC chips. The HSM firmware can be applied in fields such as automobiles, new energy, photovoltaics, robotics, healthcare, and aviation. The provided cybersecurity functions available include secure boot, secure (...)
Firmware

USIT-3P-SECIC-PQC — Uni-Sentry SecIC-PQC Algorithms Firmware

Uni-Sentry's security solutions adopt PQC algorithms capable of resisting decryption threats posed by quantum computers to traditional cryptographic algorithms. The PQC firmware is co-optimized with Hardware Security Module (HSM), leveraging hardware acceleration and security enhancement to improve (...)
Software programming tool

UNIFLASH UniFlash for most TI microcontrollers (MCUs) and mmWave sensors

UniFlash is a software tool for programming on-chip flash on TI microcontrollers and wireless connectivity devices and on-board flash for TI processors. UniFlash provides both graphical and command-line interfaces.

UniFlash can be run from the cloud on the TI Developer Zone or downloaded and used (...)

Supported products & hardware

Supported products & hardware

Launch Download options
Design tool

C2000-3P-SEARCH — C2000 Third-party search tool

TI has partnered with multiple companies to offer a wide range of solutions and services for TI C2000 devices. These companies can accelerate your path to production using C2000 devices. Download this search tool to quickly browse third-party details and find the right third-party to meet your (...)
Package Pins CAD symbols, footprints & 3D models
LQFP (PZ) 100 Ultra Librarian

Ordering & quality

Information included:
  • RoHS
  • REACH
  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring
Information included:
  • Fab location
  • Assembly location

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​

Videos