Product details


Number of channels (#) 1 Vin (Min) (V) 0.9 Vin (Max) (V) 3.6 Imax (A) 2 Ron (Typ) (mOhm) 16 Shutdown current (ISD) (Typ) (uA) 0.13 Quiescent current (Iq) (Typ) (uA) 0.2 Soft start Fixed Rise Time Rise time (Typ) (us) 20, 137 Features Inrush current control, Quick output discharge Operating temperature range (C) -40 to 85 open-in-new Find other Load switches

Package | Pins | Size

DSBGA (YFP) 6 DSBGA (YFP) 6 1 mm² .8 x 1.2 DSBGA (YZP) 6 2 mm² .928 x 1.428 open-in-new Find other Load switches


  • Integrated P-Channel Load Switch
  • Input Voltage: 0.9 V to 3.6 V
  • ON-Resistance (Typical Values)
    • rON = 14 mΩ at VIN = 3.6 V
    • rON = 20 mΩ at VIN = 2.5 V
    • rON = 33 mΩ at VIN = 1.8 V
    • rON = 67 mΩ at VIN = 1.2 V
    • rON = 116 mΩ at VIN = 1.0 V
  • 2-A Maximum Continuous Switch Current
  • Quiescent Current:
    • Typical 78 nA at 1.8 V
  • Shutdown Current:
    • Typical 35 nA at 1.8 V
  • Low Threshold Control Input Enable the use of
    1.2 V, 1.8 V, 2.5 V, or 3.3 V Logic
  • Controlled Slew Rate to Avoid Inrush Currents
    • tR = 30 µs at VIN = 1.8 V
    • tR = 200 µs at VIN = 1.8 V
  • Quick Output Discharge (TPS22922/2B)
  • ESD Performance Tested Per JESD 22
    • 3000-V Human Body Model
      (A114-B, Class II)
    • 1000-V Charged-Device Model (C101)
  • Six Terminal Wafer-Chip-Scale DSBGA Package
    (nominal dimensions shown - see Mechanical,
    Packaging, and Orderable Information
    for details)
    • 0.9-mm × 1.4-mm, 0.5-mm Pitch,
      0.5 mm Height (YZP)
    • 0.9-mm × 1.4-mm, 0.5-mm Pitch,
      0.625 mm Height (YZT)
    • 0.8-mm × 1.2-mm, 0.4-mm Pitch,
      0.5-mm Height (YFP)
open-in-new Find other Load switches


TPS22921, TPS22922, and TPS22922B are small, low rON load switches with controlled turnon. The TPS22921/2/2B contains a P-channel MOSFET that can operate over an input voltage range of 0.9 V to 3.6 V. The switch is controlled by an on/off input (ON), which can interface directly with low-voltage control signals. In TPS22922 and in TPS22922B, a 65-Ω on-chip load resistor is added for output quick discharge when the switch is turned off. The rise time (slew rate) of the device is internally controlled in order to avoid inrush current: TPS22921 and TPS22922 feature a 30-µs rise time, whereas TPS22922B is 200 µs.

TPS22921, TPS22922, and TPS22922B feature low quiescent and shutdown currents and are available in space-saving 6-pin wafer-chip-scale packages DSBGA (WCSP: YZP and YZT with 0.5-mm pitch and YFP with 0.4-mm pitch) which make them ideal for portable electronics. The devices are characterized for operation over the free-air temperature range of –40°C to 85°C.

open-in-new Find other Load switches

Technical documentation

= Top documentation for this product selected by TI
No results found. Please clear your search and try again. View all 12
Type Title Date
* Datasheet TPS2292x 3.6-V, 2-A, 14-mΩ ON-Resistance Load Switch With Controlled Turnon datasheet (Rev. C) Oct. 29, 2014
Application notes Load Switch Thermal Considerations (Rev. A) Oct. 11, 2018
Application notes Basics of Load Switches (Rev. A) Sep. 05, 2018
Selection guides Power Management Guide 2018 (Rev. R) Jun. 25, 2018
Technical articles How can a load switch extend your device’s battery life? Mar. 20, 2018
Technical articles How and why you should use load switches for power sequencing Feb. 06, 2018
Technical articles How to use load switches and eFuses in your set-top box design Nov. 23, 2017
Application notes Selecting a Load Switch to Replace a Discrete Solution Apr. 30, 2017
Application notes Timing of Load Switches Apr. 27, 2017
Technical articles Don’t leave it floating! Power off your outputs with quick output discharge Dec. 09, 2016
Application notes Managing Inrush Current (Rev. A) May 28, 2015
User guides TPS22921/22/22B Evaluation Module Jan. 19, 2009

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

document-generic User guide

The TPS22922BEVM is an evaluation module for the Texas Instruments family of low-input voltage, ultra-low rON load switches. This EVM operates over a 0.9 V to 3.6 V range and provides a continuous output current of up to 110 mA. Additional open resistor and capacitor footprints allow (...)

Design tools & simulation

SLVMA61A.ZIP (44 KB) - PSpice Model
PSpice® for TI design and simulation tool
PSPICE-FOR-TI — PSpice® for TI is a design and simulation environment that helps evaluate functionality of analog circuits. This full-featured, design and simulation suite uses an analog analysis engine from Cadence®. Available at no cost, PSpice for TI includes one of the largest model libraries in the (...)
  • Leverages Cadence PSpice Technology
  • Preinstalled library with a suite of digital models to enable worst-case timing analysis
  • Dynamic updates ensure you have access to most current device models
  • Optimized for simulation speed without loss of accuracy
  • Supports simultaneous analysis of multiple products
  • (...)

Reference designs

Single Chip Drive for Industrial Communications and Motor Control
TIDEP0025 This TI design implements a hardware interface solution based on the HEIDENHAIN EnDat 2.2 standard for position or rotary encoders. The platform also allows designers to implement real-time EtherCAT communications standards in a broad range of industrial automation equipment. It enables designers (...)
document-generic Schematic document-generic User guide
ARM MPU with Integrated BiSS C Master Interface Reference Design
TIDEP0022 Implementation of BiSS C Master protocol on Industrial Communication Sub-System (PRU-ICSS). The design provides full documentation and source code for Programmable Realtime Unit (PRU).
document-generic Schematic document-generic User guide
ARM MPU with Integrated HIPERFACE DSL Master Interface Reference Design
TIDEP0035 Implementation of HIPERFACE DSL Master protocol on Industrial Communication Sub-System (PRU-ICSS). The two wire interface allows for integration of position feedback wires into motor cable.  Complete solution consists of AM437x PRU-ICSS firmware and TIDA-00177 transceiver reference design.
document-generic Schematic document-generic User guide
EnDat 2.2 System Reference Design
TIDEP0050 The TIDEP0050 TI Design implements the EnDat 2.2 Master protocol stack and hardware interface solution based on the HEIDENHAIN EnDat 2.2 standard for position or rotary encoders. The design is composed of the EnDat 2.2 Master protocol stack, half-duplex communications using RS485 transceivers and (...)
document-generic Schematic document-generic User guide
SSD Power Delivery Reference Design
TIDA-00399 The TIDA-00399 design implements a complete power delivery solution for an SSD in the M.2 form factor. The TPS22954 load switch is used to limit inrush current and eliminate the need for a separate supervisor circuit on the system input. This design is tested and includes GUI, demo, and User's (...)
document-generic Schematic document-generic User guide

CAD/CAE symbols

Package Pins Download
DSBGA (YFP) 6 View options
DSBGA (YZP) 6 View options

Ordering & quality

Recommended products may have parameters, evaluation modules or reference designs related to this TI product.

Support & training

TI E2E™ forums with technical support from TI engineers

Content is provided "as is" by TI and community contributors and does not constitute TI specifications. See terms of use.

If you have questions about quality, packaging or ordering TI products, see TI support. ​​​​​​​​​​​​​​


Related videos