Detalles del producto

Component type PMIC/LED Driver Chipset family DLP2010, DLP2010NIR, DLP230GP, DLP230KP, DLP230NP, DLP3010, DLP650LE, DLPA2000, DLPC3430, DLPC3433, DLPC3435, DLPC3438 Operating temperature range (°C) -10 to 85 Rating Catalog
Component type PMIC/LED Driver Chipset family DLP2010, DLP2010NIR, DLP230GP, DLP230KP, DLP230NP, DLP3010, DLP650LE, DLPA2000, DLPC3430, DLPC3433, DLPC3435, DLPC3438 Operating temperature range (°C) -10 to 85 Rating Catalog
DSBGA (YFF) 56 10.7999999999999988 mm² 3 x 3.5999999999999996
  • High Efficiency RGB LED/Lamp Driver with Buck-Boost DC-to-DC Converter, DMD Supplies, DPP Core Supply, 1.8-V Load Switch, and Measurement System in a Small Chip-Scale Package
  • Three Low-Impedance (30 mΩ Typical at 27°C) MOSFET Switches for Channel Selection
  • Independent, 10-Bit Current Control per Channel
  • 750-mA Max LED Current for DLPA2000 Embedded Applications
  • On-Chip Motor Driver
  • DMD Regulators
    • Requires Only a Single Inductor
    • VOFS: 10 V
    • VBIAS: 18 V
    • VRST: –14 V
    • Passive Discharge to GND When Disabled
  • DPP 1.1-V Core Supply
    • Synchronous Step-Down Converter with Integrated Switching FETs
    • Supports up to 600-mA Output Current
  • VLED Buck Boost Converter
    • Power Save Mode at Light Load Current
  • Low-Impedance Load Switch
    • VIN Range from 1.8 V to 3.6 V
    • Supports up to 200 mA of Current
    • Passive Discharge to GND When Disabled
  • DMD Reset Signal Generation and Power Supply Sequencing
  • 33-MHz Serial Peripheral Interface (SPI)
  • Multiplexer for Measuring Analog Signals
    • Battery Voltage
    • LED Voltage, LED Current
    • Light Sensor (for White Point Correction)
    • Internal Reference Voltage
    • External (Thermistor) Temperature Sensor
  • Monitoring and Protection Circuits
    • Hot Die Warning and Thermal
    • Low-Battery Warning
    • Programmable Battery Undervoltage Lockout (UVLO)
    • Load Switch UVLO
    • Overcurrent and Undervoltage Protection
  • DLPA2000 DSBGA Package
    • 56-Ball 0.4-mm Pitch
    • Die Size: 3.280 mm × 3.484 mm ± 0.03 mm
  • High Efficiency RGB LED/Lamp Driver with Buck-Boost DC-to-DC Converter, DMD Supplies, DPP Core Supply, 1.8-V Load Switch, and Measurement System in a Small Chip-Scale Package
  • Three Low-Impedance (30 mΩ Typical at 27°C) MOSFET Switches for Channel Selection
  • Independent, 10-Bit Current Control per Channel
  • 750-mA Max LED Current for DLPA2000 Embedded Applications
  • On-Chip Motor Driver
  • DMD Regulators
    • Requires Only a Single Inductor
    • VOFS: 10 V
    • VBIAS: 18 V
    • VRST: –14 V
    • Passive Discharge to GND When Disabled
  • DPP 1.1-V Core Supply
    • Synchronous Step-Down Converter with Integrated Switching FETs
    • Supports up to 600-mA Output Current
  • VLED Buck Boost Converter
    • Power Save Mode at Light Load Current
  • Low-Impedance Load Switch
    • VIN Range from 1.8 V to 3.6 V
    • Supports up to 200 mA of Current
    • Passive Discharge to GND When Disabled
  • DMD Reset Signal Generation and Power Supply Sequencing
  • 33-MHz Serial Peripheral Interface (SPI)
  • Multiplexer for Measuring Analog Signals
    • Battery Voltage
    • LED Voltage, LED Current
    • Light Sensor (for White Point Correction)
    • Internal Reference Voltage
    • External (Thermistor) Temperature Sensor
  • Monitoring and Protection Circuits
    • Hot Die Warning and Thermal
    • Low-Battery Warning
    • Programmable Battery Undervoltage Lockout (UVLO)
    • Load Switch UVLO
    • Overcurrent and Undervoltage Protection
  • DLPA2000 DSBGA Package
    • 56-Ball 0.4-mm Pitch
    • Die Size: 3.280 mm × 3.484 mm ± 0.03 mm

The DLPA2000 is a dedicated PMIC/RGB LED/lamp driver for the DLP2010 and DLP2010NIR digital micromirror devices (DMD) when used with a DLPC3430, DLPC3435, or DLPC150 digital controller. For reliable operation of these chipsets, it is mandatory to use the DLPA2000.

The DLPA2000 is a dedicated PMIC/RGB LED/lamp driver for the DLP2010 and DLP2010NIR digital micromirror devices (DMD) when used with a DLPC3430, DLPC3435, or DLPC150 digital controller. For reliable operation of these chipsets, it is mandatory to use the DLPA2000.

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Documentación técnica

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Documentación principal Tipo Título Opciones de formato Fecha
* Data sheet DLPA2000 Power Management and LED/Lamp Driver IC datasheet (Rev. B) PDF | HTML 21 feb 2018
Application note Getting Started With TI DLP® Display Technology (Rev. H) PDF | HTML 18 abr 2024
Application note DLP System Design: Brightness Requirements and Tradeoffs (Rev. C) PDF | HTML 05 may 2022
Technical article Design ultra-portable 1080p displays thanks to the industry’s smallest full HD mic PDF | HTML 29 abr 2019
White paper TI DLP® Pico™ Technology for smart home applications (Rev. B) 08 feb 2019
Application note DLPC34xx General System Design Guide Application Note (Rev. A) 04 feb 2019
Technical article Designing smaller mobile projection and display applications with DLP Pico product PDF | HTML 09 oct 2018
Application note DLP Technology for Near Eye Display (NED) (Rev. A) 04 ago 2017
Application note PCB Design Requirements for TI DLP Pico TRP Digital Micromirror Devices 19 ago 2016
Application note TI DLP® IntelliBright™ Algorithms for the DLPC343x Controller 08 dic 2014

Diseño y desarrollo

Para conocer los términos adicionales o los recursos necesarios, haga clic en cualquier título de abajo para ver la página de detalles cuando esté disponible.

Firmware

DLP-PICO-FW-SEL — Selector de firmware DLP® Pico™

Selector de firmware para varios controladores y configuraciones DLPC34xx.
Herramienta de cálculo

DLPC094 Throw Ratio Calculator

Productos y hardware compatibles

Productos y hardware compatibles

Herramienta de cálculo

DMD-DIFFRACTION-EFFICIENCY-CALCULATOR Calculator helps model DMD diffraction patterns and diffraction efficiency

This calculator will be used to help customers understand how to model DMD diffraction patterns and efficiency with their specific DMD input parameters and is modeled to the customer’s specific design. Optical modules can also be used with the calculator.
Productos y hardware compatibles

Productos y hardware compatibles

Herramienta de diseño

DLP-OMM-SEARCH — Herramientas de búsqueda de productos de terceros DLP®

To best meet your design needs and accelerate your time-to-market, DLP® Products works with a variety of third parties to help with everything from optical modules and hardware design to specialty software and other production services. Download one or both search tools listed below to quickly (...)
Herramienta de diseño

DLP-OPTICAL-DESIGN DLP-OPTICAL-DESIGN-GUIDELINES

The DLP optical design guidelines presentation provides a comprehensive overview of the guidelines specific to designing an optical system with DLP Products and will help enable customers in their design process.
Productos y hardware compatibles

Productos y hardware compatibles

Diseños de referencia

TIDA-00722 — Diseño de referencia de gestión del color en tiempo real con MSP430 para el proyector TI DLP® Pico™

Este diseño de referencia permite la administración del color en tiempo real para los sistemas de visualización de proyecciones DLP® Pico de TI.  El diseño de referencia permite la corrección automática del color en el campo para productos que incorporan pantallas con tecnología DLP Pico de TI (...)
Design guide: PDF
Esquema: PDF
Diseños de referencia

TIDA-00325 — Diseño de referencia de pantalla ultra móvil y de potencia ultrabaja con tecnología DLP®

This display reference design featuring TI's DLP2010 (.2 WVGA) DMD chipset, was designed to enable ultra-low power and ultra-mobile display applications either embedded inside a system (e.g. smartphone, tablets etc.) or as a standalone accessory module. The chipset used in the design comprises of (...)
Test report: PDF
Esquema: PDF
Encapsulado Pines Símbolos CAD, huellas y modelos 3D
DSBGA (YFF) 56 Ultra Librarian

Pedidos y calidad

Información incluida:
  • RoHS
  • REACH
  • Marcado del dispositivo
  • Acabado de plomo/material de la bola
  • Clasificación de nivel de sensibilidad a la humedad (MSL)/reflujo máximo
  • Estimaciones de tiempo medio entre fallas (MTBF)/fallas en el tiempo (FIT)
  • Contenido del material
  • Resumen de calificaciones
  • Monitoreo continuo de confiabilidad
Información incluida:
  • Lugar de fabricación
  • Lugar de ensamblaje

Los productos recomendados pueden tener parámetros, módulos de evaluación o diseños de referencia relacionados con este producto de TI.

Soporte y capacitación

Foros de TI E2E™ con asistencia técnica de los ingenieros de TI

El contenido lo proporcionan “tal como está” TI y los colaboradores de la comunidad y no constituye especificaciones de TI. Consulte los términos de uso.

Si tiene alguna pregunta sobre calidad, encapsulados o pedido de productos de TI, consulte el servicio de asistencia de TI. ​​​​​​​​​​​​​​

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