SM320C6424-EP

ACTIVE

Enhanced product C6424 fixed point DSP

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Enhanced product C6424 fixed point DSP

SM320C6424-EP

ACTIVE

Product details

Parameters

DSP 1 C64x+ DSP MHz (Max) 700 CPU 32-/64-bit Operating system DSP/BIOS Ethernet MAC 10/100 Rating HiRel Enhanced Product Operating temperature range (C) -40 to 125 open-in-new Find other Digital signal processors (DSPs)

Package | Pins | Size

BGA (GDU) 376 529 mm² 23 x 23 open-in-new Find other Digital signal processors (DSPs)

Features

  • High-Performance Digital Signal Processor (C6424)
    • 2.5-, 2-, 1.67-, 1.43-ns Instruction Cycle Time
    • 400-, 500-, 600-, 700-MHz C64x+™ Clock Rate
    • Eight 32-Bit C64x+ Instructions/Cycle
    • 3200, 4000, 4800, 5600 MIPS
    • Fully Software-Compatible With C64x
    • Commercial and Automotive (Q or S suffix) Grades
    • Low-Power Device (L suffix)
  • VelociTI.2™ Extensions to VelociTI™ Advanced
    Very-Long-Instruction-Word (VLIW) SM320C64x+™ DSP Core
    • Eight Highly Independent Functional Units
      With VelociTI.2 Extensions:
      • Six ALUs (32-/40-Bit), Each Supports Single 32-Bit,
        Dual 16-Bit, or Quad 8-Bit Arithmetic per Clock Cycle
      • Two Multipliers Support Four 16 & times 16-Bit Multiplies
        (32-Bit Results) per Clock Cycle or Eight 8 × 8-Bit
        Multiplies (16-Bit Results) per Clock Cycle
    • Load-Store Architecture With Non-Aligned Support
    • 64 32-Bit General-Purpose Registers
    • Instruction Packing Reduces Code Size
    • All Instructions Conditional
    • Additional C64x+™ Enhancements
      • Protected Mode Operation
      • Exceptions Support for Error Detection
        and Program Redirection
      • Hardware Support for Modulo Loop
        Auto-Focus Module Operation
  • C64x+ Instruction Set Features
    • Byte-Addressable (8-/16-/32-/64-Bit Data)
    • 8-Bit Overflow Protection
    • Bit-Field Extract, Set, Clear
    • Normalization, Saturation, Bit-Counting
    • VelociTI.2 Increased Orthogonality
    • C64x+ Extensions
      • Compact 16-bit Instructions
      • Additional Instructions to Support Complex Multiplies
  • C64x+ L1/L2 Memory Architecture
    • 256K-Bit (32K-Byte) L1P Program
      RAM/Cache [Flexible Allocation]
    • 640K-Bit (80K-Byte) L1D Data RAM/Cache
      [Flexible Allocation]
    • 1M-Bit (128K-Byte) L2 Unified Mapped
      RAM/Cache [Flexible Allocation]
  • Endianess: Supports Both Little Endian and Big Endian
  • External Memory Interfaces (EMIFs)
    • 32-Bit DDR2 SDRAM Memory Controller
      With 256M-Byte Address Space (1.8-V I/O)
      • Supports up to 333-MHz (data rate) bus
        and interfaces to DDR2-400 SDRAM
    • Asynchronous 16-Bit Wide EMIF (EMIFA)
      With up to 128M-Byte Address Reach
      • Flash Memory Interfaces
        • NOR (8-/16-Bit-Wide Data)
        • NAND (8-/16-Bit-Wide Data)
  • Enhanced Direct-Memory-Access (EDMA)
    Controller (64 Independent Channels)
  • Two 64-Bit General-Purpose Timers (Each
    Configurable as Two 32-Bit Timers)
  • One 64-Bit Watch Dog Timer
  • Two UARTs (One with RTS and CTS Flow Control)
  • Master/Slave Inter-Integrated Circuit (I2C Bus™)
  • Two Multichannel Buffered Serial Ports (McBSPs)
    • I2S and TDM
    • AC97 Audio Codec Interface
    • SPI
    • Standard Voice Codec Interface (AIC12)
    • Telecom Interfaces – ST-Bus, H-100
    • 128 Channel Mode
  • Multichannel Audio Serial Port (McASP0)
    • Four Serializers and SPDIF (DIT) Mode
  • 16-Bit Host-Port Interface (HPI)
  • 32-Bit 33-MHz, 3.3-V Peripheral Component
    Interconnect (PCI) Master/Slave Interface
  • 10/100 Mb/s Ethernet MAC (EMAC)
    • IEEE 802.3 Compliant
    • Supports Multiple Media Independent Interfaces
      (MII, RMII)
    • Management Data Input/Output (MDIO) Module
  • VLYNQ™ Interface (FPGA Interface)
  • Three Pulse Width Modulator (PWM) Outputs
  • On-Chip ROM Bootloader
  • Individual Power-Savings Modes
  • Flexible PLL Clock Generators
  • IEEE-1149.1 (JTAG™) Boundary-Scan-Compatible
  • Up to 111 General-Purpose I/O (GPIO) Pins
    (Multiplexed With Other Device Functions)
  • Packages:
    • 376-Pin Plastic BGA Package, 1.0-mm Ball Pitch
  • 0.09-µm/6-Level Cu Metal Process (CMOS)
  • 3.3-V and 1.8-V I/O, 1.2-V Internal
    (-7/-6/-5/-4/Q6/-Q5/-Q4)
  • 3.3-V and 1.8-V I/O, 1.05-V Internal
    (-7/-6/-5/-4/-L/-Q5)
  • Applications:
    • Telecom
    • Audio
    • Industrial Applications
  • SUPPORTS DEFENSE, AEROSPACE, AND MEDICAL APPLICATIONS
    • Controlled Baseline
    • One Assembly/Test Site
    • One Fabrication Site
    • Extended Product Life Cycle
    • Extended Product-Change Notification
    • Product Traceability

All trademarks are the property of their respective owners.

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Description

The 320C64x+™ DSPs (including the SMS320C6424 device) are the highest-performance fixed-point DSP generation in the 320C6000™ DSP platform. The C6424 device is based on the third-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making these DSPs an excellent choice for digital signal processor applications. The C64x+™ devices are upward code-compatible from previous devices that are part of the C6000™ DSP platform. The C64x™ DSPs support added functionality and have an expanded instruction set from previous devices.

Any reference to the C64x DSP or C64x CPU also applies, unless otherwise noted, to the C64x+ DSP and C64x+ CPU, respectively.

With performance of up to 5600 million instructions per second (MIPS) at a clock rate of 700 MHz, the C64x+ core offers solutions to high-performance DSP programming challenges. The DSP core possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x+ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units—two multipliers for a 32-bit result and six arithmetic logic units (ALUs). The eight functional units include instructions to accelerate the performance in telecom, audio, and industrial applications. The DSP core can produce four 16-bit multiply-accumulates (MACs) per cycle for a total of 2800 million MACs per second (MMACS), or eight 8-bit MACs per cycle for a total of 5600 MMACS. For more details on the C64x+ DSP, see the TMS320C64x/C64x+ DSP CPU and Instruction Set Reference Guide (literature number SPRU732).

The C6424 also has application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000 DSP platform devices. The C6424 core uses a two-level cache-based architecture. The Level 1 program memory/cache (L1P) consists of a 256K-bit memory space that can be configured as mapped memory or direct mapped cache, and the Level 1 data (L1D) consists of a 640K-bit memory space —384K-bit of which is mapped memory and 256K-bit of which can be configured as mapped memory or 2-way set-associative cache. The Level 2 memory/cache (L2) consists of a 1M-bit memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two.

The peripheral set includes: a 10/100 Mb/s Ethernet MAC (EMAC) with a management data input/output (MDIO) module; a 4-bit transmit, 4-bit receive VLYNQ interface; an inter-integrated circuit (I2C) Bus interface; two multichannel buffered serial ports (McBSPs); a multichannel audio serial port (McASP0) with 4 serializers; 2 64-bit general-purpose timers each configurable as 2 independent 32-bit timers; 1 64-bit watchdog timer; a user-configurable 16-bit host-port interface (HPI); up to 111-pins of general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; 2 UARTs with hardware handshaking support on 1 UART; 3 pulse width modulator (PWM) peripherals; 1 peripheral component interconnect (PCI) [33 MHz]; and 2 glueless external memory interfaces: an asynchronous external memory interface (EMIFA) for slower memories/peripherals, and a higher speed synchronous memory interface for DDR2.

The Ethernet Media Access Controller (EMAC) provides an efficient interface between the C6424 and the network. The C6424 EMAC supports 10Base-T and 100Base-TX, or 10 Mbits/second (Mbps) and 100 Mbps in either half- or full-duplex mode, with hardware flow control and quality of service (QOS) support.

The Management Data Input/Output (MDIO) module continuously polls all 32 MDIO addresses in order to enumerate all PHY devices in the system.

The I2C and VLYNQ ports allow C6424 to easily control peripheral devices and/or communicate with host processors.

The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.

The C6424 has a complete set of development tools. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.

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Technical documentation

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Type Title Date
* Data sheet Fixed-Point Digital Signal Processor datasheet Jun. 08, 2009
* VID SM320C6424-EP VID V6209629 Jun. 21, 2016
* Radiation & reliability report SM320C6424GDUQ6EP Reliability Report Mar. 22, 2013
Technical article Bringing the next evolution of machine learning to the edge Nov. 27, 2018
Technical article Industry 4.0 spelled backward makes no sense – and neither does the fact that you haven’t heard of TI’s newest processor yet Oct. 30, 2018
Technical article How quality assurance on the Processor SDK can improve software scalability Aug. 22, 2018
Technical article Clove: Low-Power video solutions based on Sitara™ AM57x processors Jul. 21, 2016
Application note Introduction to TMS320C6000 DSP Optimization Oct. 06, 2011

Design & development

For additional terms or required resources, click any title below to view the detail page where available.

Hardware development

DEBUG PROBE Download
XDS200 USB Debug Probe
TMDSEMU200-U
295
Description

The XDS200 is a debug probe (emulator) used for debugging TI embedded devices.  The XDS200 features a balance of low cost with good performance as compared to the low cost XDS110 and the high performance XDS560v2.  It supports a wide variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a (...)

Features

The XDS200 is the mid-range family of JTAG debug probes (emulators) for TI processors. Designed to deliver good performance and the most common features that place it between the low cost XDS110 and the high performance XDS560v2, the XDS200 is the balanced solution to debug TI microcontrollers (...)

DEBUG PROBE Download
995
Description

The XDS560v2 System Trace is the first model of the XDS560v2 family of high-performance debug probes (emulators) for TI processors. The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).

The (...)

Features

XDS560v2 is the latest variant of the XDS560 family of high-performance debug probes (emulators) for TI processors. With the fastest speeds and most features of the entire XDS family, XDS560v2 is the most comprehensive solution to debug TI microcontrollers, processors and wireless connectivity (...)

DEBUG PROBE Download
1495
Description

The XDS560v2 System Trace is the first model of the XDS560v2 family of high-performance debug probes (emulators) for TI processors. The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).

The (...)

Features
  • XDS560v2 is the latest variant of the XDS560 family of high-performance debug probes (emulators) for TI processors. With the fastest speeds and most features of the entire XDS family, XDS560v2 is the most comprehensive solution to debug TI microcontrollers, processors and wireless connectivity (...)

Software development

DRIVER OR LIBRARY Download
TMS320C6000 DSP Library (DSPLIB)
SPRC265 TMS320C6000 Digital Signal Processor Library (DSPLIB) is a platform-optimized DSP function library for C programmers. It includes C-callable, general-purpose signal-processing routines that are typically used in computationally intensive real-time applications. With these routines, higher (...)
Features

Optimized DSP routines including functions for:

  • Adaptive filtering
  • Correlation
  • FFT
  • Filtering and convolution: FIR, biquad, IIR, convolution
  • Math: Dot products, max value, min value, etc.
  • Matrix operations
DRIVER OR LIBRARY Download
Telecom and Media Libraries - FAXLIB, VoLIB and AEC/AER for TMS320C64x+ and TMS320C55x Processors
TELECOMLIB Voice Library - VoLIB provides components that, together, facilitate the development of the signal processing chain for Voice over IP applications such as infrastructure, enterprise, residential gateways and IP phones. Together with optimized implementations of ITU-T voice codecs, that can be acquired (...)
Features

VoLIB

  • Telogy Software Line Echo Canceller (ECU)
  • Tone Detection Unit (TDU)
  • Caller ID Detection/Generation (CID)
  • Tone Generation Unit (TGU)
  • Voice Activity Detection Unit (VAU)
  • Noise Matching Functions
  • Packet Loss Concealment (PLC)
  • Voice Enhancement Unit (VEU)  

FAXLIB

  • Fax Interface Unit (FIU)
  • Fax Modem (FM)
  • (...)

Design tools & simulation

DESIGN TOOL Download
Arm-based MPU, arm-based MCU and DSP third-party search tool
PROCESSORS-3P-SEARCH TI has partnered with companies to offer a wide range of software, tools, and SOMs using TI Processors to accelerate your path to production. Download this search tool to quickly browse our third-party solutions and find the right third-party to meet your needs. The software, tools and modules (...)
Features
  • Supports many TI processors including Sitara and Jacinto Processors and DSPs
  • Search by type of product, TI devices supported, or country
  • Links and contacts for quick engagement
  • Third-party companies located around the world

CAD/CAE symbols

Package Pins Download
BGA (GDU) 376 View options

Ordering & quality

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  • Device marking
  • Lead finish/Ball material
  • MSL rating/Peak reflow
  • MTBF/FIT estimates
  • Material content
  • Qualification summary
  • Ongoing reliability monitoring

Support & training

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