The TMS320C64x+™ DSPs (including the TMS320C6452 device is the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. The C6452 device is based on the third-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making these DSPs an excellent choice for digital media applications. The C64x+™ devices are upward code-compatible from previous devices that are part of the C6000™ DSP platform. The C64x™ DSPs support added functionality and have an expanded instruction set from previous devices.
Any reference to the C64x DSP or C64x CPU also applies, unless otherwise noted, to the C64x+ DSP and C64x+ CPU, respectively.
With performance of up to 7200 million instructions per second (MIPS) at a clock rate of 900MHz, the C64x+ core offers solutions to high-performance DSP programming challenges. The DSP core possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x+ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units—two multipliers for a 32-bit result and six arithmetic logic units (ALUs). The eight functional units include instructions to accelerate the performance in video and imaging applications. The DSP core can produce four 16-bit multiply-accumulates (MACs) per cycle for up to 3600 million MACs per second (MMACS), or eight 8-bit MACs per cycle for up tp 8800 MMACS. For more details on the C64x+ DSP, see the (literature number SPRU732).
The devices also have application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000 DSP platform devices. The core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 256K-bit direct mapped cache and the Level 1 data cache (L1D) is a 256K-bit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of a 1408KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two.
The device has a 1000 Mbps Ethernet Switch Subsystem with a management data input/output (MDIO) module and two SGMII ports; a 4-bit transmit, 4-bit receive VLYNQ interface; an inter-integrated circuit (I2C) bus interface; a multichannel audio serial port (McASP) with ten serializers; two telecom serial interface ports (TSIP); four 64-bit general-purpose timers each configurable as two independent 32-bit timers; a user-configurable 16-bit or 32-bit host-port interface (HPI); 32 pins for general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; one UART; and two glueless external memory interfaces: a synchronous and asynchronous external memory interface (EMIFA) for slower memories/peripherals, and a higher DDR2 SDRAM interface.
The management data input/output (MDIO) module continuously polls all 32 MDIO addresses to enumerate all PHY devices in the system.
The I2C and VLYNQ ports allow the device to easily control peripheral modules and/or communicate with host processors.
The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.
The devices have a complete set of development tools. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.
This product does not have ongoing design support from TI for new projects, such as new content or software updates. If available, you will find relevant collateral, software and tools in the product folder. You can also search for archived information in the TI E2ETM support forums.
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The XDS200 is a debug probe (emulator) used for debugging TI embedded devices. The XDS200 features a balance of low cost with good performance as compared to the low cost XDS110 and the high performance XDS560v2. It supports a wide variety of standards (IEEE1149.1, IEEE1149.7, SWD) in a (...)
The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).
All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)
The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7). Note that it does not support serial wire debug (SWD).
All XDS debug probes support Core and System Trace in all ARM and DSP processors that (...)
| Package | Pins | Download |
|---|---|---|
| (CUT) | 529 | View options |
| FCBGA (ZUT) | 529 | View options |
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