Digital Signal Processor
Product details
Parameters
Package | Pins | Size
Features
- High-Performance Digital Media Processor
- 720-MHz, 900-MHz C64x+™ Clock Rates
- 1.39 ns (-720), 1.11 ns (-900) Instruction Cycle Time
- 5760, 7200 MIPS
- Eight 32-Bit C64x+ Instructions/Cycle
- Fully Software-Compatible With C64x/Debug
- Commercial Temperature Ranges (-720, -900 only)
- Industrial Temperature Ranges (-720, -900 only)
- VelociTI.2™ Extensions to VelociTI™ Advanced Very-Long-Instruction-Word (VLIW) TMS320C64x+™ DSP Core
- Eight Highly Independent Functional Units With VelociTI.2 Extensions:
- Six ALUs (32-/40-Bit), Each Supports Single 32-bit, Dual 16-bit, or Quad 8-bit Arithmetic per Clock Cycle
- Two Multipliers Support Four 16 x 16-bit Multiplies (32-bit Results) per Clock Cycle or Eight 8 x 8-bit Multiplies (16-Bit Results) per Clock Cycle
- Load-Store Architecture With Non-Aligned Support
- 64 32-bit General-Purpose Registers
- Instruction Packing Reduces Code Size
- All Instructions Conditional
- Additional C64x+™ Enhancements
- Protected Mode Operation
- Exceptions Support for Error Detection and Program Redirection
- Hardware Support for Modulo Loop Auto-Focus Module Operation
- Eight Highly Independent Functional Units With VelociTI.2 Extensions:
- C64x+ Instruction Set Features
- Byte-Addressable (8-/16-/32-/64-bit Data)
- 8-bit Overflow Protection
- Bit-Field Extract, Set, Clear
- Normalization, Saturation, Bit-Counting
- VelociTI.2 Increased Orthogonality
- C64x+ Extensions
- Compact 16-bit Instructions
- Additional Instructions to Support Complex Multiplies
- C64x+ L1/L2 Memory Architecture
- 256K-bit (32K-byte) L1P Program RAM/Cache [Direct Mapped]
- 256K-bit (32K-byte) L1D Data RAM/Cache
[2-Way Set-Associative] - 1408KB L2 Unified Mapped RAM/Cache [Flexible Allocation]
- Supports Little Endian Mode Only
- External Memory Interfaces (EMIFs)
- 32-Bit DDR2 SDRAM Memory Controller With 512M-Byte Address Space (1.8-V I/O)
- Asynchronous 16-Bit Wide EMIF (EMIFA)
- Up to 128M-Byte Total Address Reach
- 64M-Byte Address Reach per CE Space
- Glueless Interface to Asynchronous Memories (SRAM, Flash, and EEPROM)
- Synchronous Memories (SBSRAM and ZBT SRAM)
- Supports Interface to Standard Sync Devices and Custom Logic (FPGA, CPLD, ASICs, etc.)
- Enhanced Direct-Memory-Access (EDMA) Controller (64 Independent Channels)
- 3-Port Gigabit Ethernet Switch Subsystem
- Four 64-Bit General-Purpose Timers (Each Configurable as Two 32-Bit Timers)
- One UART (With RTS and CTS Flow Control)
- One 4-wire Serial Port Interface (SPI) With Two Chip-Selects
- Master/Slave Inter-Integrated Circuit (I2C Bus™)
- Two Telecom Serial Interface Ports (TSIP0/1)
- Multichannel Audio Serial Port (McASP)
- Ten Serializers and SPDIF (DIT) Mode
- 16/32-Bit Host-Port Interface (HPI)
- Advanced Event Triggering (AET) Compatible
- 32-Bit 33-/66-MHz, 3.3-V Peripheral Component Interconnect (PCI) Master/Slave Interface Conforms to PCI Specification 2.3
- VLYNQ™ Interface (FPGA Interface)
- On-Chip ROM Bootloader
- Individual Power-Saving Modes
- Flexible PLL Clock Generators
- IEEE-1149.1 (JTAG™) Boundary-Scan-Compatible
- 32 General-Purpose I/O (GPIO) Pins (Multiplexed With Other Device Functions)
- Package:
- 529-pin nFBGA (ZUT suffix)
- 19x19 mm 0.8 mm pitch BGA
- 0.09-µm/6-Level Cu Metal Process (CMOS)
- 3.3-V and 1.8-V I/O, 1.2-V Internal (-720,-900)
Description
The TMS320C64x+™ DSPs (including the TMS320C6452 device is the highest-performance fixed-point DSP generation in the TMS320C6000™ DSP platform. The C6452 device is based on the third-generation high-performance, advanced VelociTI™ very-long-instruction-word (VLIW) architecture developed by Texas Instruments (TI), making these DSPs an excellent choice for digital media applications. The C64x+™ devices are upward code-compatible from previous devices that are part of the C6000™ DSP platform. The C64x™ DSPs support added functionality and have an expanded instruction set from previous devices.
Any reference to the C64x DSP or C64x CPU also applies, unless otherwise noted, to the C64x+ DSP and C64x+ CPU, respectively.
With performance of up to 7200 million instructions per second (MIPS) at a clock rate of 900MHz, the C64x+ core offers solutions to high-performance DSP programming challenges. The DSP core possesses the operational flexibility of high-speed controllers and the numerical capability of array processors. The C64x+ DSP core processor has 64 general-purpose registers of 32-bit word length and eight highly independent functional units—two multipliers for a 32-bit result and six arithmetic logic units (ALUs). The eight functional units include instructions to accelerate the performance in video and imaging applications. The DSP core can produce four 16-bit multiply-accumulates (MACs) per cycle for up to 3600 million MACs per second (MMACS), or eight 8-bit MACs per cycle for up tp 8800 MMACS. For more details on the C64x+ DSP, see the (literature number SPRU732).
The devices also have application-specific hardware logic, on-chip memory, and additional on-chip peripherals similar to the other C6000 DSP platform devices. The core uses a two-level cache-based architecture. The Level 1 program cache (L1P) is a 256K-bit direct mapped cache and the Level 1 data cache (L1D) is a 256K-bit 2-way set-associative cache. The Level 2 memory/cache (L2) consists of a 1408KB memory space that is shared between program and data space. L2 memory can be configured as mapped memory, cache, or combinations of the two.
The device has a 1000 Mbps Ethernet Switch Subsystem with a management data input/output (MDIO) module and two SGMII ports; a 4-bit transmit, 4-bit receive VLYNQ interface; an inter-integrated circuit (I2C) bus interface; a multichannel audio serial port (McASP) with ten serializers; two telecom serial interface ports (TSIP); four 64-bit general-purpose timers each configurable as two independent 32-bit timers; a user-configurable 16-bit or 32-bit host-port interface (HPI); 32 pins for general-purpose input/output (GPIO) with programmable interrupt/event generation modes, multiplexed with other peripherals; one UART; and two glueless external memory interfaces: a synchronous and asynchronous external memory interface (EMIFA) for slower memories/peripherals, and a higher DDR2 SDRAM interface.
The management data input/output (MDIO) module continuously polls all 32 MDIO addresses to enumerate all PHY devices in the system.
The I2C and VLYNQ ports allow the device to easily control peripheral modules and/or communicate with host processors.
The rich peripheral set provides the ability to control external peripheral devices and communicate with external processors. For details on each of the peripherals, see the related sections later in this document and the associated peripheral reference guides.
The devices have a complete set of development tools. These include C compilers, a DSP assembly optimizer to simplify programming and scheduling, and a Windows™ debugger interface for visibility into source code execution.
No design support from TI available
This product does not have ongoing design support from TI for new projects, such as new content or software updates. If available, you will find relevant collateral, software and tools in the product folder. You can also search for archived information in the TI E2ETM support forums.
Technical documentation
Design & development
For additional terms or required resources, click any title below to view the detail page where available.Hardware development
Description
The Spectrum Digital XDS200 is the first model of the XDS200 family of debug probes (emulators) for TI processors. The XDS200 family features a balance of low cost with good performance between the super low cost XDS110 and the high performance XDS560v2, while supporting a wide variety of standards (...)
Features
The XDS200 is the mid-range family of JTAG debug probes (emulators) for TI processors. Designed to deliver good performance and the most common features that place it between the low cost XDS110 and the high performance XDS560v2, the XDS200 is the balanced solution to debug TI microcontrollers (...)
Description
The XDS560v2 System Trace is the first model of the XDS560v2 family of high-performance debug probes (emulators) for TI processors. The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).
The (...)
Features
XDS560v2 is the latest variant of the XDS560 family of high-performance debug probes (emulators) for TI processors. With the fastest speeds and most features of the entire XDS family, XDS560v2 is the most comprehensive solution to debug TI microcontrollers, processors and wireless connectivity (...)
Description
The XDS560v2 System Trace is the first model of the XDS560v2 family of high-performance debug probes (emulators) for TI processors. The XDS560v2 is the highest performance of the XDS family of debug probes and supports both the traditional JTAG standard (IEEE1149.1) and cJTAG (IEEE1149.7).
The (...)
Features
-
XDS560v2 is the latest variant of the XDS560 family of high-performance debug probes (emulators) for TI processors. With the fastest speeds and most features of the entire XDS family, XDS560v2 is the most comprehensive solution to debug TI microcontrollers, processors and wireless connectivity (...)
Software development
Features
Optimized DSP routines including functions for:
- Adaptive filtering
- Correlation
- FFT
- Filtering and convolution: FIR, biquad, IIR, convolution
- Math: Dot products, max value, min value, etc.
- Matrix operations
Features
VoLIB
- Telogy Software Line Echo Canceller (ECU)
- Tone Detection Unit (TDU)
- Caller ID Detection/Generation (CID)
- Tone Generation Unit (TGU)
- Voice Activity Detection Unit (VAU)
- Noise Matching Functions
- Packet Loss Concealment (PLC)
- Voice Enhancement Unit (VEU)
FAXLIB
- Fax Interface Unit (FIU)
- Fax Modem (FM)
- (...)
Features
For best design results, find the codec(s) optimized for your platform. If none are available, click GET SOFTWARE button (above) for codecs optimized for TI C64x+ core-based devices (i.e. most devices in the OMAP35x, TMS320C645x, TMS320C647x, TMS320DM646x, TMS320DM644x and TMS320DM643x families).
- For (...)
Design tools & simulation
CAD/CAE symbols
Package | Pins | Download |
---|---|---|
(CUT) | 529 | View options |
FCBGA (ZUT) | 529 | View options |
Ordering & quality
- RoHS
- REACH
- Device marking
- Lead finish/Ball material
- MSL rating/Peak reflow
- MTBF/FIT estimates
- Material content
- Qualification summary
- Ongoing reliability monitoring
Support & training
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