계산 툴
데이터시트
DLPA2000
- High Efficiency RGB LED/Lamp Driver with Buck-Boost DC-to-DC Converter, DMD Supplies, DPP Core Supply, 1.8-V Load Switch, and Measurement System in a Small Chip-Scale Package
- Three Low-Impedance (30 mΩ Typical at 27°C) MOSFET Switches for Channel Selection
- Independent, 10-Bit Current Control per Channel
- 750-mA Max LED Current for DLPA2000 Embedded Applications
- On-Chip Motor Driver
- DMD Regulators
- Requires Only a Single Inductor
- VOFS: 10 V
- VBIAS: 18 V
- VRST: –14 V
- Passive Discharge to GND When Disabled
- DPP 1.1-V Core Supply
- Synchronous Step-Down Converter with Integrated Switching FETs
- Supports up to 600-mA Output Current
- VLED Buck Boost Converter
- Power Save Mode at Light Load Current
- Low-Impedance Load Switch
- VIN Range from 1.8 V to 3.6 V
- Supports up to 200 mA of Current
- Passive Discharge to GND When Disabled
- DMD Reset Signal Generation and Power Supply Sequencing
- 33-MHz Serial Peripheral Interface (SPI)
- Multiplexer for Measuring Analog Signals
- Battery Voltage
- LED Voltage, LED Current
- Light Sensor (for White Point Correction)
- Internal Reference Voltage
- External (Thermistor) Temperature Sensor
- Monitoring and Protection Circuits
- Hot Die Warning and Thermal
- Low-Battery Warning
- Programmable Battery Undervoltage Lockout (UVLO)
- Load Switch UVLO
- Overcurrent and Undervoltage Protection
- DLPA2000 DSBGA Package
- 56-Ball 0.4-mm Pitch
- Die Size: 3.280 mm × 3.484 mm ± 0.03 mm
The DLPA2000 is a dedicated PMIC/RGB LED/lamp driver for the DLP2010 and DLP2010NIR digital micromirror devices (DMD) when used with a DLPC3430, DLPC3435, or DLPC150 digital controller. For reliable operation of these chipsets, it is mandatory to use the DLPA2000.
기술 문서
검색된 결과가 없습니다. 검색어를 지우고 다시 시도하십시오.
모두 보기10 | 유형 | 직함 | 날짜 | ||
|---|---|---|---|---|
| * | Data sheet | DLPA2000 Power Management and LED/Lamp Driver IC datasheet (Rev. B) | PDF | HTML | 2018/02/21 |
| Application note | TI DLP® 디스플레이 기술 시작하기 (Rev. G) | PDF | HTML | 2023/05/17 | |
| Application note | DLP System Design: Brightness Requirements and Tradeoffs (Rev. C) | PDF | HTML | 2022/05/05 | |
| Technical article | Design ultra-portable 1080p displays thanks to the industry’s smallest full HD mic | PDF | HTML | 2019/04/29 | |
| White paper | TI DLP® Pico™ Technology for smart home applications (Rev. B) | 2019/02/08 | ||
| Application note | DLPC34xx General System Design Guide Application Note (Rev. A) | 2019/02/04 | ||
| Technical article | Designing smaller mobile projection and display applications with DLP Pico product | PDF | HTML | 2018/10/09 | |
| Application note | DLP Technology for Near Eye Display (NED) (Rev. A) | 2017/08/04 | ||
| Application note | PCB Design Requirements for TI DLP Pico TRP Digital Micromirror Devices | 2016/08/19 | ||
| Application note | TI DLP® IntelliBright™ Algorithms for the DLPC343x Controller | 2014/12/08 |
설계 및 개발
추가 조건 또는 필수 리소스는 사용 가능한 경우 아래 제목을 클릭하여 세부 정보 페이지를 확인하세요.
광학 모듈
DLP-OMM-SEARCH — DLP® 제품 광학 모듈 검색 툴
To best meet your design needs and accelerate your time-to-market, DLP® Products works with a variety of third parties to help with everything from optical modules and hardware design to specialty software and other production services. Download one or both search tools listed below to quickly (...)
펌웨어
DLP-PICO-FW-SEL — DLP® Pico™ 펌웨어 선택기
Firmware selector for various DLPC34xx controllers and configurations.
레퍼런스 디자인
TIDA-00722 — TI DLP® Pico™ 프로젝터용 MSP430을 사용한 실시간 색상 관리 레퍼런스 디자인
This reference design enables real-time color management for TI DLP® Pico projection display systems. The reference design enables automatic color correction in the field for products incorporating TI DLP Pico technology displays using LEDs. Automatic color correction allows (...)
레퍼런스 디자인
TIDA-00325 — DLP® 기술을 사용한 울트라 모바일, 초저전력 디스플레이 레퍼런스 디자인
This display reference design featuring TI's DLP2010 (.2 WVGA) DMD chipset, was designed to enable ultra-low power and ultra-mobile display applications either embedded inside a system (e.g. smartphone, tablets etc.) or as a standalone accessory module. The chipset used in the design comprises of (...)
| 패키지 | 핀 | 다운로드 |
|---|---|---|
| DSBGA (YFF) | 56 | 옵션 보기 |
주문 및 품질
포함된 정보:
- RoHS
- REACH
- 디바이스 마킹
- 납 마감/볼 재질
- MSL 등급/피크 리플로우
- MTBF/FIT 예측
- 물질 성분
- 인증 요약
- 지속적인 신뢰성 모니터링
포함된 정보:
- 팹 위치
- 조립 위치
권장 제품에는 본 TI 제품과 관련된 매개 변수, 평가 모듈 또는 레퍼런스 디자인이 있을 수 있습니다.