SWRU626 December 2025 CC3501E , CC3551E
The CC35xx device supports on-chip and off-chip memories. The memories are used for execution, data and non volatile memory. The on-chip memory includes SRAM and the off-chip memories supported are serial Flash (connected externally or stacked inside device package) and optional serial PSRAM (stacked inside device package).
The SRAM is used for execution and data. It is divided into instruction and data partitions, as well as secure and non-secure. The instruction memory partition is split into Instruction Tightly Coupled Memory (ITCM) and Instruction Cache memory (I-Cache). I-Cache allows for execution from Flash and the PSRAM. Data memory is divided into Data Tightly Coupled Memory (DTCM), Data non-Tightly Coupled Memory (DMEM), and Data Cache Memory (D-Cache). The D-Cache is designed to access the PSRAM.
Each of the memories can be accessed by the M33 MCU, Host DMA and the μDMA. The host DMA is used for data transfer between peripherals and the device on-chip SRAM. The μDMA is used for data transfer between the external Flash/PSRAM and on-chip SRAM.