Condition Monitoring Module


TI integrated circuits and reference designs will help you to jumpstart your condition monitoring module through a high speed signal chain, powerful processing and different wired and wireless interfaces to connect to the external world according to your needs:

  • High-resolution, high-speed conversion with low-power and small-footprint vibration front end
  • Efficient scalable FFT processing to predict potential machine failures
  • Edge processing to reduce system power and lower network bandwidth

Technical documents

Application notes & user guides

Application Notes (1)

Title Abstract Type Size (KB) Date Views
HTM 8 KB 18 Sep 2017 0

Product bulletin & white papers

White Papers (1)

Title Abstract Type Size (MB) Date Views
PDF 1.73 MB 02 Nov 2016 0


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