SPRSP65B April   2021  – July 2021 AM2431 , AM2432 , AM2434

ADVANCE INFORMATION  

  1. Features
  2. Applications
  3. Description
    1. 3.1 Functional Block Diagram
  4. Revision History
  5. Device Comparison
    1. 5.1 Related Products
  6. Terminal Configuration and Functions
    1. 6.1 Pin Diagram
      1. 6.1.1 AM243x ALV Pin Diagram
      2. 6.1.2 AM243x ALX Pin Diagram
    2. 6.2 Pin Attributes (ALV Package)
    3. 6.3 Pin Attributes (ALX Package)
    4. 6.4 Signal Descriptions
      1. 6.4.1  ADC
        1.       MAIN Domain Instances
        2. 6.4.1.1 ADC0 Signal Descriptions
      2. 6.4.2  DDRSS
        1.       MAIN Domain Instances
        2. 6.4.2.1 DDRSS0 Signal Descriptions
      3. 6.4.3  GPIO
        1.       MAIN Domain Instances
        2. 6.4.3.1 GPIO0 Signal Descriptions
        3. 6.4.3.2 GPIO1 Signal Descriptions
        4.       MCU Domain Instances
        5. 6.4.3.3 MCU_GPIO0 Signal Descriptions
      4. 6.4.4  I2C
        1.       MAIN Domain Instances
        2. 6.4.4.1 I2C0 Signal Descriptions
        3. 6.4.4.2 I2C1 Signal Descriptions
        4. 6.4.4.3 I2C2 Signal Descriptions
        5. 6.4.4.4 I2C3 Signal Descriptions
        6.       MCU Domain Instances
        7. 6.4.4.5 MCU_I2C0 Signal Descriptions
        8. 6.4.4.6 MCU_I2C1 Signal Descriptions
      5. 6.4.5  MCAN
        1.       MAIN Domain Instances
        2. 6.4.5.1 MCAN0 Signal Descriptions
        3. 6.4.5.2 MCAN1 Signal Descriptions
      6. 6.4.6  SPI (MCSPI)
        1.       MAIN Domain Instances
        2. 6.4.6.1 MCSPI0 Signal Descriptions
        3. 6.4.6.2 MCSPI1 Signal Descriptions
        4. 6.4.6.3 MCSPI2 Signal Descriptions
        5. 6.4.6.4 MCSPI3 Signal Descriptions
        6. 6.4.6.5 MCSPI4 Signal Descriptions
        7.       MCU Domain Instances
        8. 6.4.6.6 MCU_MCSPI0 Signal Descriptions
        9. 6.4.6.7 MCU_MCSPI1 Signal Descriptions
      7. 6.4.7  UART
        1.       MAIN Domain Instances
        2. 6.4.7.1 UART0 Signal Descriptions
        3. 6.4.7.2 UART1 Signal Descriptions
        4. 6.4.7.3 UART2 Signal Descriptions
        5. 6.4.7.4 UART3 Signal Descriptions
        6. 6.4.7.5 UART4 Signal Descriptions
        7. 6.4.7.6 UART5 Signal Descriptions
        8. 6.4.7.7 UART6 Signal Descriptions
        9.       MCU Domain Instances
        10. 6.4.7.8 MCU_UART0 Signal Descriptions
        11. 6.4.7.9 MCU_UART1 Signal Descriptions
      8. 6.4.8  MDIO
        1.       MAIN Domain Instances
        2. 6.4.8.1 MDIO0 Signal Descriptions
      9. 6.4.9  CPSW
        1.       MAIN Domain Instances
        2. 6.4.9.1 CPSW3G0 Signal Descriptions
      10. 6.4.10 ECAP
        1.       MAIN Domain Instances
        2. 6.4.10.1 ECAP0 Signal Descriptions
        3. 6.4.10.2 ECAP1 Signal Descriptions
        4. 6.4.10.3 ECAP2 Signal Descriptions
      11.      EQEP
        1.       MAIN Domain Instances
        2. 6.4.11.1 EQEP0 Signal Descriptions
        3. 6.4.11.2 EQEP1 Signal Descriptions
        4. 6.4.11.3 EQEP2 Signal Descriptions
      12. 6.4.11 EPWM
        1.       MAIN Domain Instances
        2. 6.4.11.1  EPWM Signal Descriptions
        3. 6.4.11.2  EPWM0 Signal Descriptions
        4. 6.4.11.3  EPWM1 Signal Descriptions
        5. 6.4.11.4  EPWM2 Signal Descriptions
        6. 6.4.11.5  EPWM3 Signal Descriptions
        7. 6.4.11.6  EPWM4 Signal Descriptions
        8. 6.4.11.7  EPWM5 Signal Descriptions
        9. 6.4.11.8  EPWM6 Signal Descriptions
        10. 6.4.11.9  EPWM7 Signal Descriptions
        11. 6.4.11.10 EPWM8 Signal Descriptions
      13. 6.4.12 SERDES
        1.       MAIN Domain Instances
        2. 6.4.12.1 SERDES0 Signal Descriptions
      14. 6.4.13 USB
        1.       MAIN Domain Instances
        2. 6.4.13.1 USB0 Signal Descriptions
      15. 6.4.14 OSPI
        1.       MAIN Domain Instances
        2. 6.4.14.1 OSPI0 Signal Descriptions
      16. 6.4.15 GPMC
        1.       MAIN Domain Instances
        2. 6.4.15.1 GPMC0 Signal Descriptions
      17. 6.4.16 MMC
        1.       MAIN Domain Instances
        2. 6.4.16.1 MMC0 Signal Descriptions
        3. 6.4.16.2 MMC1 Signal Descriptions
      18. 6.4.17 FSITX
        1.       MAIN Domain Instances
        2. 6.4.17.1 FSI0 TX Signal Descriptions
        3. 6.4.17.2 FSI1 TX Signal Descriptions
      19. 6.4.18 FSIRX
        1.       MAIN Domain Instances
        2. 6.4.18.1 FSI0 RX Signal Descriptions
        3. 6.4.18.2 FSI1 RX Signal Descriptions
        4. 6.4.18.3 FSI2 RX Signal Descriptions
        5. 6.4.18.4 FSI3 RX Signal Descriptions
        6. 6.4.18.5 FSI4 RX Signal Descriptions
        7. 6.4.18.6 FSI5 RX Signal Descriptions
      20. 6.4.19 CPTS
        1.       MAIN Domain Instances
        2. 6.4.19.1 CPTS0 Signal Descriptions
        3. 6.4.19.2 CP GEMAC CPTS0 Signal Descriptions
      21. 6.4.20 ICSSG
        1.       MAIN Domain Instances
        2. 6.4.20.1 PRU_ICSSG0 Signal Descriptions
        3. 6.4.20.2 PRU_ICSSG1 Signal Descriptions
      22. 6.4.21 DMTIMER
        1.       MAIN Domain Instances
        2. 6.4.21.1 DMTIMER Signal Descriptions
        3.       MCU Domain Instances
        4. 6.4.21.2 MCU_DMTIMER Signal Descriptions
      23. 6.4.22 TRACE
        1.       MAIN Domain Instances
        2. 6.4.22.1 Trace Signal Descriptions
      24. 6.4.23 JTAG
        1.       MAIN Domain Instances
        2. 6.4.23.1 JTAG Signal Descriptions
      25. 6.4.24 SYSBOOT
        1.       MAIN Domain Instances
        2. 6.4.24.1 Sysboot Signal Descriptions
      26. 6.4.25 SYSTEM
        1.       MAIN Domain Instances
        2. 6.4.25.1 System Signal Descriptions
        3.       MCU Domain Instances
        4. 6.4.25.2 MCU System Signal Descriptions
      27. 6.4.26 CLOCK
        1.       MCU Domain Instances
        2. 6.4.26.1 MCU Clock Signal Descriptions
      28. 6.4.27 VMON
        1. 6.4.27.1 VMON Signal Description
      29. 6.4.28 Power Supply
        1. 6.4.28.1 Power Supply Signal Description
    5. 6.5 Pin Multiplexing
    6. 6.6 Connections for Unused Pins
  7. Specifications
    1. 7.1  Absolute Maximum Ratings
    2. 7.2  ESD Ratings
    3. 7.3  Power-On Hours (POH)
    4. 7.4  Recommended Operating Conditions
    5. 7.5  Operating Performance Points
    6. 7.6  Power Consumption Summary
    7. 7.7  Electrical Characteristics
      1. 7.7.1 Fail-Safe Reset (FS RESET) Electrical Characteristics
      2. 7.7.2 I2C Open-Drain, and Fail-Safe (I2C OD FS) Electrical Characteristics
      3. 7.7.3 High-Frequency Oscillator (HFOSC) Electrical Characteristics
      4. 7.7.4 eMMCPHY Electrical Characteristics
      5. 7.7.5 SDIO Electrical Characteristics
      6. 7.7.6 ADC12B Electrical Characteristics
      7. 7.7.7 LVCMOS Electrical Characteristics
      8. 7.7.8 USB2PHY Electrical Characteristics
      9. 7.7.9 DDR Electrical Characteristics
    8. 7.8  VPP Specifications for One-Time Programmable (OTP) eFuses
      1. 7.8.1 Recommended Operating Conditions for OTP eFuse Programming
      2. 7.8.2 Hardware Requirements
      3. 7.8.3 Programming Sequence
      4. 7.8.4 Impact to Your Hardware Warranty
    9. 7.9  Thermal Resistance Characteristics
      1. 7.9.1 Thermal Resistance Characteristics
    10. 7.10 Timing and Switching Characteristics
      1. 7.10.1 Timing Parameters and Information
      2. 7.10.2 Power Supply Sequencing
        1. 7.10.2.1 Power Supply Slew Rate Requirement
        2. 7.10.2.2 Power-Up Sequencing
        3. 7.10.2.3 Power-Down Sequencing
      3. 7.10.3 System Timing
        1. 7.10.3.1 Reset Timing
        2. 7.10.3.2 Safety Signal Timing
        3. 7.10.3.3 Clock Timing
      4. 7.10.4 Clock Specifications
        1. 7.10.4.1 Input Clocks / Oscillators
          1. 7.10.4.1.1 MCU_OSC0 Internal Oscillator Clock Source
            1. 7.10.4.1.1.1 Load Capacitance
            2. 7.10.4.1.1.2 Shunt Capacitance
          2. 7.10.4.1.2 MCU_OSC0 LVCMOS Digital Clock Source
        2. 7.10.4.2 Output Clocks
        3. 7.10.4.3 PLLs
      5. 7.10.5 Peripherals
        1. 7.10.5.1  CPSW3G
          1. 7.10.5.1.1 CPSW3G MDIO Timing
          2. 7.10.5.1.2 CPSW3G RMII Timing
          3. 7.10.5.1.3 CPSW3G RGMII Timing
        2. 7.10.5.2  DDRSS
        3. 7.10.5.3  ECAP
        4. 7.10.5.4  EPWM
        5. 7.10.5.5  EQEP
        6. 7.10.5.6  FSI
        7. 7.10.5.7  GPIO
        8. 7.10.5.8  GPMC
          1. 7.10.5.8.1 GPMC and NOR Flash — Synchronous Mode
          2. 7.10.5.8.2 GPMC and NOR Flash — Asynchronous Mode
          3. 7.10.5.8.3 GPMC and NAND Flash — Asynchronous Mode
        9. 7.10.5.9  I2C
          1. 7.10.5.9.1 Timing Requirements for I2C Input Timings
        10. 7.10.5.10 MCAN
        11. 7.10.5.11 MCSPI
          1. 7.10.5.11.1 MCSPI — Master Mode
          2. 7.10.5.11.2 MCSPI — Slave Mode
        12. 7.10.5.12 MMCSD
          1. 7.10.5.12.1 MMC0 - eMMC Interface
            1. 7.10.5.12.1.1 Legacy SDR Mode
            2. 7.10.5.12.1.2 High Speed SDR Mode
            3. 7.10.5.12.1.3 High Speed DDR Mode
            4. 7.10.5.12.1.4 HS200 Mode
          2. 7.10.5.12.2 MMC1 - SD/SDIO Interface
            1. 7.10.5.12.2.1 Default Speed Mode
            2. 7.10.5.12.2.2 High Speed Mode
            3. 7.10.5.12.2.3 UHS–I SDR12 Mode
            4. 7.10.5.12.2.4 UHS–I SDR25 Mode
            5. 7.10.5.12.2.5 UHS–I SDR50 Mode
            6. 7.10.5.12.2.6 UHS–I DDR50 Mode
            7. 7.10.5.12.2.7 UHS–I SDR104 Mode
        13. 7.10.5.13 CPTS
        14. 7.10.5.14 OSPI
          1. 7.10.5.14.1 OSPI With Data Training
            1. 7.10.5.14.1.1 OSPI Switching Characteristics – Data Training
          2. 7.10.5.14.2 OSPI Without Data Training
            1. 7.10.5.14.2.1 OSPI SDR Timing
            2. 7.10.5.14.2.2 OSPI DDR Timing
        15. 7.10.5.15 PCIe
        16. 7.10.5.16 PRU_ICSSG
          1. 7.10.5.16.1 PRU_ICSSG Programmable Real-Time Unit (PRU)
            1. 7.10.5.16.1.1 PRU_ICSSG PRU Direct Output Mode Timing
            2. 7.10.5.16.1.2 PRU_ICSSG PRU Parallel Capture Mode Timing
            3. 7.10.5.16.1.3 PRU_ICSSG PRU Shift Mode Timing
            4. 7.10.5.16.1.4 PRU_ICSSG PRU Sigma Delta and Peripheral Interface
              1. 7.10.5.16.1.4.1 PRU_ICSSG PRU Sigma Delta and Peripheral Interface Timing
          2. 7.10.5.16.2 PRU_ICSSG Pulse Width Modulation (PWM)
            1. 7.10.5.16.2.1 PRU_ICSSG PWM Timing
          3. 7.10.5.16.3 PRU_ICSSG Industrial Ethernet Peripheral (IEP)
            1. 7.10.5.16.3.1 PRU_ICSSG IEP Timing
          4. 7.10.5.16.4 PRU_ICSSG Universal Asynchronous Receiver Transmitter (UART)
            1. 7.10.5.16.4.1 PRU_ICSSG UART Timing
          5. 7.10.5.16.5 PRU_ICSSG Enhanced Capture Peripheral (ECAP)
            1. 7.10.5.16.5.1 PRU_ICSSG ECAP Timing
          6. 7.10.5.16.6 PRU_ICSSG RGMII, MII_RT, and Switch
            1. 7.10.5.16.6.1 PRU_ICSSG MDIO Timing
            2. 7.10.5.16.6.2 PRU_ICSSG MII Timing
            3. 7.10.5.16.6.3 PRU_ICSSG RGMII Timing
        17. 7.10.5.17 Timers
        18. 7.10.5.18 UART
        19. 7.10.5.19 USB
      6. 7.10.6 Emulation and Debug
        1. 7.10.6.1 Trace
        2. 7.10.6.2 JTAG
  8. Detailed Description
    1. 8.1 Overview
    2. 8.2 Processor Subsystems
      1. 8.2.1 Arm Cortex-R5F Subsystem (R5FSS)
      2. 8.2.2 Arm Cortex-M4F (M4FSS)
    3. 8.3 Accelerators and Coprocessors
      1. 8.3.1 Programmable Real-Time Unit Subsystem and Industrial Communication Subsystem (PRU_ICSSG)
    4. 8.4 Other Subsystems
      1. 8.4.1 PDMA Controller
      2. 8.4.2 Peripherals
        1. 8.4.2.1  ADC
        2. 8.4.2.2  DCC
        3. 8.4.2.3  Dual Date Rate (DDR) External Memory Interface (DDRSS)
        4. 8.4.2.4  ECAP
        5. 8.4.2.5  EPWM
        6. 8.4.2.6  ELM
        7. 8.4.2.7  ESM
        8. 8.4.2.8  GPIO
        9. 8.4.2.9  EQEP
        10. 8.4.2.10 GPMC
        11. 8.4.2.11 I2C
        12. 8.4.2.12 MCAN
        13. 8.4.2.13 MCRC Controller
        14. 8.4.2.14 MCSPI
        15. 8.4.2.15 MMCSD
        16. 8.4.2.16 OSPI
        17. 8.4.2.17 Peripheral Component Interconnect Express (PCIe)
        18. 8.4.2.18 Serializer/Deserializer (SerDes)
        19. 8.4.2.19 RTI
        20. 8.4.2.20 DMTIMER
        21. 8.4.2.21 UART
        22. 8.4.2.22 Universal Serial Bus Subsystem(USBSS)
  9. Applications, Implementation, and Layout
    1. 9.1 Power Supply Mapping
    2. 9.2 Device Connection and Layout Fundamentals
      1. 9.2.1 Power Supply Decoupling and Bulk Capacitors
        1. 9.2.1.1 Power Distribution Network Implementation Guidance
      2. 9.2.2 External Oscillator
      3. 9.2.3 JTAG and EMU
      4. 9.2.4 Unused Pins
    3. 9.3 Peripheral- and Interface-Specific Design Information
      1. 9.3.1 General Routing Guidelines
      2. 9.3.2 DDR Board Design and Layout Guidelines
      3. 9.3.3 OSPI and QSPI Board Design and Layout Guidelines
        1. 9.3.3.1 No Loopback and Internal Pad Loopback
        2. 9.3.3.2 External Board Loopback
        3. 9.3.3.3 DQS (only available in Octal Flash devices)
      4. 9.3.4 USB VBUS Design Guidelines
      5. 9.3.5 System Power Supply Monitor Design Guidelines
      6. 9.3.6 High Speed Differential Signal Routing Guidance
      7. 9.3.7 Thermal Solution Guidance
  10. 10Device and Documentation Support
    1. 10.1 Device Nomenclature
      1. 10.1.1 Standard Package Symbolization
      2. 10.1.2 Device Naming Convention
    2. 10.2 Tools and Software
    3. 10.3 Documentation Support
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  11. 11Mechanical, Packaging, and Orderable Information
    1. 11.1 Packaging Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • ALV|441
  • ALX|293
Thermal pad, mechanical data (Package|Pins)
Orderable Information

System Power Supply Monitor Design Guidelines

The VMON_VSYS pin provides a way to monitor a system power supply. This system power supply is typically a single pre-regulated power source for the entire system. This supply is monitored by comparing the output of an external voltage divider circuit sourced by this supply with an internal voltage reference, with a power fail event being triggered when the voltage applied to VMON_VSYS drops below the internal reference voltage. The actual system power supply voltage trip point is determined by the system designer when selecting component values used to implement the external resistor voltage divider circuit.

When designing the resistor divider circuit it is important to understand various factors which contribute to variability in the system power supply monitor trip point. The first thing to consider is the initial accuracy of the VMON_VSYS input threshold which has a nominal value of 0.45 V, with a variation of ±3%. Precision 1% resistors with similar thermal coefficient are recommended for implementing the resistor voltage divider. This minimizes variability contributed by resistor value tolerances. Input leakage current associated with VMON_VSYS must also be considered since any current flowing into the pin creates a loading error on the voltage divider output. The VMON_VSYS input leakage current may be in the range of 10 nA to 2.5 µA when applying 0.45 V.

Note:

The resistor voltage divider shall be designed such that its output voltage never exceeds the maximum value defined in the Recommended Operating Conditions section, during normal operating conditions.

Figure 9-6 presents an example, where the system power supply is nominally 5 V and the maximum trigger threshold is 5 V - 10%, or 4.5 V.

For this example, it is important to understand which variables effect the maximum trigger threshold when selecting resistor values. It is obvious a device which has a VMON_VSYS input threshold of 0.45 V + 3% needs to be considered when trying to design a voltage divider that doesn’t trip until the system supply drops 10%. The effect of resistor tolerance and input leakage also needs to be considered, but how these contributions effect the maximum trigger point may not be obvious. When selecting component values which produce a maximum trigger voltage, the system designer must consider a condition where the value of R1 is 1% low and the value of R2 is 1% high combined with a condition where input leakage current for the VMON_VSYS pin is 2.5 µA. When implementing a resistor divider where R1 = 4.81 KΩ and R2 = 40.2 KΩ, the result is a maximum trigger threshold of 4.523 V.

Once component values have been selected to satisfy the maximum trigger voltage as described above, the system designer can determine the minimum trigger voltage by calculating the applied voltage that produces an output voltage of 0.45 V - 3% when the value of R1 is 1% high and the value of R2 is 1% low, and the input leakage current is 10 nA, or zero. Using an input leakage of zero with the resistor values given above, the result is a minimum trigger threshold of 4.008 V.

This example demonstrates a system power supply voltage trip point that ranges from 4.008 V to 4.523 V. Approximately 250 mV of this range is introduced by VMON_VSYS input threshold accuracy of ±3%, approximately 150 mV of this range is introduced by resistor tolerance of ±1%, and approximately 100 mV of this range is introduced by loading error when VMON_VSYS input leakage current is 2.5 µA.

The resistor values selected in this example produces approximately 100 µA of bias current through the resistor divider when the system supply is 4.5 V. The 100 mV of loading error mentioned above could be reduced to about 10 mV by increasing the bias current through the resistor divider to approximately 1 mA. So resistor divider bias current vs loading error is something the system designer needs to consider when selecting component values.

The system designer should also consider implementing a noise filter on the voltage divider output since VMON_VSYS has minimum hysteresis and a high-bandwidth response to transients. This could be done by installing a capacitor across R1 as shown in Figure 9-6. However, the system designer must determine the response time of this filter based on system supply noise and expected response to transient events.

GUID-04102B71-40CB-44F1-8A58-49A5ED8CD00E-low.gifFigure 9-6 System Supply Monitor Voltage Divider Circuit

VMON_1P8_MCU and VMON_1P8_SOC pins provide a way to monitor external 1.8 V power supplies. An internal resistor divider with software control is implemented inside the SoC for each of these pins. Software can program each internal resistor divider to create appropriate under voltage and over voltage interrupts.

VMON_3P3_MCU and VMON_3P3_SOC pins provide a way to monitor external 3.3 V power supplies. An internal resistor divider with software control is implemented inside the SoC for each of these pins. Software can program each internal resistor divider to create appropriate under voltage and over voltage interrupts.