SLUSFQ1A December   2024  – December 2024 BQ41Z90

ADVANCE INFORMATION  

  1.   1
  2. 1 Features
  3. 2 Applications
  4. 3 Description
  5. 4 Pin Configuration and Functions:
  6. 5 Pin Equivalent Diagrams
  7. 6 Specifications
    1. 6.1  Absolute Maximum Ratings
    2. 6.2  ESD Ratings
    3. 6.3  Recommended Operating Conditions
    4. 6.4  Thermal Information
    5. 6.5  Supply Current
    6. 6.6  Power Selector
    7. 6.7  Current Wake Detector
    8. 6.8  General Purpose Input-Outputs
    9. 6.9  Aux REGOUT LDO
    10. 6.10 LD Pin
    11. 6.11 Shelf Timer
    12. 6.12 Cell Balancing
    13. 6.13 Comparator-Based Detections (SCOMP)
    14. 6.14 SCOMP Timing Requirements
    15. 6.15 SCD Comparator
    16. 6.16 High-side NFET Drivers (CHG and DSG and PCHG and PDSG)
    17. 6.17 FUSE Pin
    18. 6.18 Flash Memory
    19. 6.19 Interface I/O
    20. 6.20 I2C Interface Timing
  8. 7 Detailed Description
    1. 7.1 Overview
    2. 7.2 Functional Block Diagram
    3. 7.3 Feature Description
      1. 7.3.1 Device Functional Modes
        1. 7.3.1.1 Analog Front End (AFE)
        2. 7.3.1.2 Power Management
          1. 7.3.1.2.1 Power Mode Block Configuration
          2. 7.3.1.2.2 Power Supply Control
            1. 7.3.1.2.2.1 HIBERNATE Mode
            2. 7.3.1.2.2.2 SHUTDOWN Mode
            3. 7.3.1.2.2.3 SHELF Mode
            4. 7.3.1.2.2.4 Wake Functionality
          3. 7.3.1.2.3 Power Management Unit
            1. 7.3.1.2.3.1 PMU Overview
          4. 7.3.1.2.4 Thermal Shutdown
          5. 7.3.1.2.5 Low Drop Out Regulators (LDOs)
            1. 7.3.1.2.5.1 REG18
            2. 7.3.1.2.5.2 REG135
            3. 7.3.1.2.5.3 REGIO
            4. 7.3.1.2.5.4 REGOUT
        3. 7.3.1.3 Reset Management
          1. 7.3.1.3.1 RST_SD Pin Operation
          2. 7.3.1.3.2 AFE Watchdog
        4. 7.3.1.4 Diagnostics Features
        5. 7.3.1.5 Internal Oscillators
          1. 7.3.1.5.1 Low Frequency Oscillator (LFO)
          2. 7.3.1.5.2 High Frequency Oscillator (HFO)
          3. 7.3.1.5.3 Low Power Oscillator (LPO)
      2. 7.3.2 Temperature Measurement
        1. 7.3.2.1 External Temperature Measurement Support
        2. 7.3.2.2 Internal Temperature Sensor
      3. 7.3.3 Random Cell Connection Support
        1. 7.3.3.1 Usage of VC Pins for Cells Versus Interconnect
        2. 7.3.3.2 Unused Pins
      4. 7.3.4 Cell Balancing Support
        1. 7.3.4.1 Open Wire Detection
      5. 7.3.5 Protection and Charge Control Outputs
        1. 7.3.5.1 High-Side NFET Drivers
        2. 7.3.5.2 PRECHARGE and PREDISCHARGE Modes
        3. 7.3.5.3 FET Configuration
        4. 7.3.5.4 CFETOFF, DFETOFF Pin Functionality
        5. 7.3.5.5 DDSG and DCHG Pin Operation
        6. 7.3.5.6 Hardware Fault Detection (SCOMP and SCD)
        7. 7.3.5.7 FET UVLO Protection
        8. 7.3.5.8 Fuse Drive
      6. 7.3.6 Load Detect Functionality
      7. 7.3.7 MCU Peripherals
        1. 7.3.7.1 General Purpose and Special Function I/O
          1. 7.3.7.1.1 Low Voltage RAx I/O
          2. 7.3.7.1.2 Low Voltage RCx I/O
          3. 7.3.7.1.3 Constant Current Sink I/O
        2. 7.3.7.2 Communication Interfaces
          1. 7.3.7.2.1 I2C Interface
          2. 7.3.7.2.2 SMBus Interface
        3. 7.3.7.3 Authentication Support
          1. 7.3.7.3.1 ECC Authentication
          2. 7.3.7.3.2 SHA-1 Support
          3. 7.3.7.3.3 SHA-2 Support
  9. 8 Application and Implementation
    1. 8.1 Application Information
    2. 8.2 Typical Applications
      1. 8.2.1 Design Requirements
  10. 9 Power Supply Recommendations
  11. 10Device and Documentation Support
    1. 10.1 Third-Party Products Disclaimer
    2. 10.2 Documentation Support
      1. 10.2.1 Related Documentation
    3. 10.3 Receiving Notification of Documentation Updates
    4. 10.4 Support Resources
    5. 10.5 Trademarks
    6. 10.6 Electrostatic Discharge Caution
    7. 10.7 Glossary
  12. 11Revision History
  13. 12Mechanical, Packaging, and Orderable Information

Package Options

Refer to the PDF data sheet for device specific package drawings

Mechanical Data (Package|Pins)
  • PVP|64
Thermal pad, mechanical data (Package|Pins)
Orderable Information

8.2.1 Design Requirements

Table 8-1 shows the default settings for the BQ41Z90 main parameters. Use the bqStudio tool to update the gauge settings to meet the specific application or battery pack configuration requirements.

The device should be calibrated before any gauging tests are ran. Follow the bqStudio Calibration page to calibrate the device, and use the bqStudio Chemistry page to update the ChemID configured on the device.

Table 8-1 Design Parameters
Design Parameters Example
Cell Configuration 3S
Design Capacity 4400mAh
Device Chemistry 1210 (LiCoO2/graphitized carbon)
Cell Overvoltage at Standard Temperature 4300mV
Cell Undervoltage 2500mV
Shutdown Voltage 2300mV
Overcurrent in CHARGE Mode 6000mA
Overcurrent in DISCHARGE Mode -6000mA
Short Circuit in DISCHARGE Mode 0.1V/RSense across SRP, SRN
Safety Overvoltage 4500mV
Cell Balancing Disabled
Internal or External Temperature Sensor External Temperature Sensor is used
Undertemperature Charging 0°C
Undertemperature Discharging 0°C
BROADCAST Mode Disabled